prober-english - 第4页

4 8 inch 12 inch Model HMP-800 / HMP-1200 This  is  a  standard  manual  prober  that  supports  8 ”o r  12 ”w a f e r s . ・ Model HMP-800 is for 8" wafers. ・ Model HM P-1200 is for 12" wafers. This  …

4inch 6inch

Model HMP-400 / HMP-600

・

Model HMP-400 is for 4" wafers.

・

Model HMP-600 is for 6" wafers.

BestsellingCompactManualProber

ThisisacompactmanualproberforR&Dthatsupportswafermeasurementsrangingfromsmallchip upto4” or6” wafers.

Proberiscapableofmeasuringultra low curren tsonthefAlevelorlowcapacitanceonthepFlevelbyselectingappropriate

options.

Hightemperaturetestscanbealsomadebyincorporatingahotchuck

thatsupportsatemperaturerangefrom

roomtemperature to+300°C.

‐ UltralowsignalI‐Vmeasurements(fAlevel)

‐ VariousC‐Vmeasurements(quasi‐staticC‐V,HF‐CV)

‐ 4‐terminalresistancemeasurements

‐ Temperaturecharacteristicstestsinrangefromroomtemperature to

+200°Cor+300°C

‐ Mountsinglovebox

‐ Probecardsupport

‐ RFmeasurements(upto67 GHz)

‐ Ultrahigh‐speedI‐Vmeasurements

‐ High‐powerdevicemeasurements

(100Apulse,±3kVtriaxial,±10kVcoaxial)

‐ Light‐receiving/emittingcharacteristicsevaluationapplicationsfor

optoelectronics (suchasLED,

LD,VCSEL,andPD)

Extended applications

Applications

■ MANUAL PROBER

Wafer Size

X‐Ycoarsetravel

X‐Yfinetravel

θ travel

PlatenZaxisaction

Unitdimension（W×D×H）*

Weight*

PlatenZaxisadjustment

HMP‐400 HMP‐600

upto φ100mm upto φ150mm

X：105mm，Y：150mm X：155mm，Y：200mm

350×390×450mm

390×450×450mm

28kg 36kg

XY：13mm / Micrometerhead

coarse±30°,fine±2.5°

0‐ 20mmfree

0～15mm

*Itemswithasteriskvarydependingonsystemconfiguration.

ManualProber

8inch 12inch

Model HMP-800 / HMP-1200

Thisisastandardmanualproberthatsupports8”or12”wafers.

・

Model HMP-800 is for 8" wafers.

・

Model HMP-1200 is for 12" wafers.

Thisprobersupportsreliableon‐wafermeasurementswithasimpleyethigh‐accuracymechanismthatiseasytooperate.

Thisstandardmanualprobermodelisscalabletosupportawiderangeofapplicationssuchashotchucksystems

(fromroomtemperatureto+200°Cor+300°C),submicronresolutionstages,and

lasercutters.

Applications

‐ Temperaturecharacteristicstestsinrangefrom+20°Cto+300°C

‐ UltralowsignalI‐Vmeasurements(fAlevel)

‐ VariousC‐Vmeasurements(quasi‐staticC‐V,HF‐CV,andRF‐CV)

‐ RFmeasurements(upto67GHz)

‐ Ultrahigh‐speedI‐Vmeasurements

Extended applications

‐ Probecardsupport(cansupportMultisiteWLR)

‐ Built‐inlasercutter(Pointmarking,Exfoliationofprotectionlayer,

Metallayercutting)

‐ Probingwithsubmicronaccuracyachievedbyabuilt‐in

metallograph,activevibrationisolator,andultrahigh‐accuracy stage

‐ Light‐receiving/emittingcharacteristicsevaluationapplications

foroptoelectronics (suchasLED,LD,VCSEL,andPD)

‐ Common

gatepad contactsofflat‐paneldisplaydevices

‐ High‐powerdevicemeasurements

(200Apulse,±3kVtriaxial,±10kVcoaxial)

‐ Waferlevelreliabilitytests(suchasEM,TDDB,HCI,NBTI,andBT)

■ MANUAL PROBER

WaferSize

X‐Ycoarsetravel

X‐Yfinetravel

θ travel

PlatenZaxisaction

Unitdimension（W×D×H）*

Weight*

PlatenZaxisadjustment

HMP‐800 HMP‐1200

～φ200mm ～φ300mm

X：205mm，Y：300mm X：305mm，Y：400mm

550×650×450mm

690×780×450mm

60kg 80kg

XY：13mm/Micrometerhead

coarse±30°,fine±2.5°

0/0.3/10mm

0～13mm

*Itemswithasteriskvarydependingonsystemconfiguration.

ManualProber

8inch 12inch

■ MANUAL PROBER

Model HMP-810SC / HMP-1210SC

・

Model HMP-800SC is for 8" wafers.

・

Model HMP-1200SC is for 12" wafers.

ManualProberforHigh/LowTemperatureTests

Thisisamanualprobesystemfornext‐generationsemiconductordevicesdesignedforlownoiseandlowleakage.

Inthissystem,ashieldedchamberstructurecontainstheprobeandchuckinatotallyEMIshieldedenvironment.

Thesystemsupportsmeasurementssuchasultralowsignalmeasurementinthethresholdregions,1/f

noisemeasurement,

Sparameteracquisition,andhigh‐speedI‐Vmeasurementinatemperaturecontrolrangefrom‐60°Cto+300°C

(or+400°Cwhenusingthespecialoption).

Thisprobesystemcanoptionallysupporthigh‐currentandhigh‐voltagepowerdeviceapplications.

*TheHMP‐610SCfor6” wafersisalso

available.

Applications

‐ Temperaturecharacteristicstestsinrangefrom+25°Cto+300°C

orfrom‐60°Cto+300°C

‐ UltralowsignalI‐Vmeasurements(fAlevel)

‐ VariousC‐Vmeasurements

(quasi‐staticC‐V,HF‐CV,andRF‐CV)[subpFlevel]

‐ 1/fnoiseevaluation

‐ RTN(random telegraphnoise)evaluation

‐ High‐frequencynoiseevaluation(upto800MHz)

‐ RFmeasurements(upto67GHz)/Sparameteracquisition

‐ Ultrahigh‐speedI‐Vmeasurements

Extended applications

‐ Probecardsupport(cansupportMultisiteWLR)

‐ Light‐receiving/emittingcharacteristicsevaluationapplications

foroptoelectronics(suchasLED,LD,VCSEL,andPD)

‐ Commongatepad contactsofflat‐paneldisplaydevices

‐ High‐powerdevicemeasurements

(200Apulse,±3kVtriaxial,±10kVcoaxial)*8” model

‐ Waferlevelreliabilitytests

(suchasEM,TDDB,HCI,

NBTI,andBT)

WaferSize

X‐Ycoarsetravel

X‐Yfinetravel

θ travel

PlatenZaxisaction

Unitdimension（W×D×H）*

Weight*

PlatenZaxisadjustment

HMP‐810SC HMP‐1210SC

～φ200mm ～φ300mm

X：205mm，Y：205mm X：310mm，Y：310mm

1020×1000×1550mm

1150×1100×1550mm

750kg 1000kg

±7.5°

0/0.3mm

0～13mm

X：205mm，Y：205mm X：310mm，Y：310mm

*Itemswithasteriskvarydependingonsystemconfiguration.

ManualProber