prober-english - 第6页

4 inch 6 inch ■ SEMI-AUTOMATIC PROBER ・ Model HSP -100 is for 4" wafers. ・ Model HSP -150 is for 6" wafers. Semi ‐ Automatic  Probe  System  for  Small ‐ Diameter  Wafers This  is  a  semi ‐ automatic …

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8inch 12inch
MANUAL PROBER
Model HMP-810SC / HMP-1210SC
Model HMP-800SC is for 8" wafers.
Model HMP-1200SC is for 12" wafers.
ManualProberforHigh/LowTemperatureTests
Thisisamanualprobesystemfornextgenerationsemiconductordevicesdesignedforlownoiseandlowleakage.
Inthissystem,ashieldedchamberstructurecontainstheprobeandchuckinatotallyEMIshieldedenvironment.
Thesystemsupportsmeasurementssuchasultralowsignalmeasurementinthethresholdregions,1/f
noisemeasurement,
Sparameteracquisition,andhighspeedIVmeasurementinatemperaturecontrolrangefrom‐60°Cto+300°C
(or+400°Cwhenusingthespecialoption).
Thisprobesystemcanoptionallysupporthighcurrentandhighvoltagepowerdeviceapplications.
*TheHMP610SCfor6” wafersisalso
available.
Applications
Temperaturecharacteristicstestsinrangefrom+25°Cto+300°C
orfrom‐60°Cto+300°C
UltralowsignalIVmeasurements(fAlevel)
VariousCVmeasurements
(quasistaticCV,HFCV,andRFCV)[subpFlevel]
1/fnoiseevaluation
RTN(random telegraphnoise)evaluation
Highfrequencynoiseevaluation(upto800MHz)
RFmeasurements(upto67GHz)/Sparameteracquisition
UltrahighspeedIVmeasurements
Extended applications
Probecardsupport(cansupportMultisiteWLR)
Lightreceiving/emittingcharacteristicsevaluationapplications
foroptoelectronics(suchasLED,LD,VCSEL,andPD)
Commongatepad contactsofflatpaneldisplaydevices
Highpowerdevicemeasurements
(200Apulse,±3kVtriaxial,±10kVcoaxial)*8” model
Waferlevelreliabilitytests
(suchasEM,TDDB,HCI,
NBTI,andBT)
WaferSize
XYcoarsetravel
XYfinetravel
θ travel
PlatenZaxisaction
UnitdimensionW×D×H*
Weight*
PlatenZaxisadjustment
HMP810SC HMP1210SC
~φ200mm ~φ300mm
X205mmY205mm X310mmY310mm
1020×1000×1550mm
1150×1100×1550mm
750kg 1000kg
±7.5°
0/0.3mm
013mm
X205mmY205mm X310mmY310mm
*Itemswithasteriskvarydependingonsystemconfiguration.
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ManualProber
4inch 6inch
SEMI-AUTOMATIC PROBER
Model HSP-100 is for 4" wafers.
Model HSP-150 is for 6" wafers.
SemiAutomaticProbeSystemforSmallDiameterWafers
Thisisasemiautomaticprobesystemthatsupports4” or6” smalldiameterwafers.
EquippedwithahighaccuracyXYZθ quadraxial closedloopstagehavingexcellentpositioningaccuracyandrepeatability,
thisprobesystemensuresreliableprobecontact.
Thisprobesystemcanincorporateahotchuckthatsupportsatemperaturerangefrom
+20°Cto+300°C.
Thisprobesystemcanoptionallysupporthighcurrentandhighvoltagepowerdeviceapplications.
Applications
Extended applications
Temperaturecharacteristicstestsinrangefrom+20°Cto+300°C
UltralowsignalIVmeasurements(fAlevel)
VariousCVmeasurements(quasistaticCV,HFCV,andRFCV)
RFmeasurements(upto67GHz)
UltrahighspeedIVmeasurements
Probecardsupport(cansupportMultisiteWLR)
Builtinlasercutter
(Pointmarking,Exfoliationofprotectionlayer,Metallayercutting)
Activevibrationisolatorandultrahighaccuracyprobingthrough
imageprocessingpatternrecognition(accuracy:± 1umorfiner)
Lightreceiving/emittingcharacteristicsevaluationapplicationsfor
optoelectronics(suchasLED,LD,VCSEL,
andPD)
Commongatepad contactsofflatpaneldisplaydevices
Highpowerdevicemeasurements
(200Apulse,±3kVtriaxial,±10kVcoaxial)
Waferlevelreliabilitytests(suchasEM,TDDB,HCI,NBTI,and BT)
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WaferSize
XYtravel
XYrepeatability
XYaccuracy
Ztravel
UnitdimensionW×D×H*
Weight*
Zrepeatability
HSP100 HSP150
~φ100mm ~φ150mm
X105mmY200mm X160mmY250mm
1200×900×1550mm
1250×900×1550mm
650kg 700kg
<±2μm
<±5μm
20mm
<±1μm
θ travel
θ repeatability
±7.5°
0.002°
*Itemswithasteriskvarydependingonsystemconfiguration.
Model HSP-100 / HSP-150
SemiAutomaticProber
SEMI-AUTOMATIC PROBER
Model HSP-200 is for 8" wafers.
Model HSP-300 is for 12" wafers.
8inch 12inch
StandardSemiAutomaticProberModel
Thisisastandardsemiautomaticprobesystemthatsupports8” or12” wafers.
EquippedwithahighaccuracyXYZθ quadraxial closedloopstagehavingexcellentpositioningaccuracyandrepeatability,
thisprobesystemensuresreliableprobecontact.
Thisprobesystemcanincorporateahotchuckthatsupportsatemperaturerangefrom+20°
Cto+300°C.
Thisprobesystemcanoptionallysupporthighcurrentandhighvoltagepowerdeviceapplications.
Applications
Extended applications
Temperaturecharacteristicstestsinrangefrom+20°Cto+300°C
UltralowsignalIVmeasurements(fAlevel)
VariousCVmeasurements(quasistaticCV,HFCV,andRFCV)
RFmeasurements(upto67GHz)
UltrahighspeedIVmeasurements
Probecardsupport(cansupportMultisiteWLR)
Builtinlasercutter
(Pointmarking,Exfoliationofprotectionlayer,Metallayercutting )
Activevibrationisolatorandultrahighaccuracyprobingthrough
imageprocessingpatternrecognition(accuracy:± 1umorfiner)
Lightreceiving/emittingcharacteristicsevaluationapplicationsfor
optoelectronics(suchasLED,LD,VCSEL,
andPD)
Commongatepad contactsofflatpaneldisplaydevices
Highpowerdevicemeasurements
(200Apulse,±3kVtriaxial,±10kVcoaxial)
Waferlevelreliabilitytests(suchasEM,TDDB,HCI,NBTI,and BT)
WaferSize
XYtravel
XYrepeatability
XYaccuracy
Ztravel
UnitdimensionW×D×H*
Weight*
Zrepeatability
HSP200 HSP300
~φ200mm ~φ300mm
X205mmY300mm X310mmY450mm
1300×1000×1550mm
1400×1050×1600mm
750kg 950kg
<±2μm
<±5μm
20mm
<±1μm
θ travel
θ repeatability
±7.5°
0.002°
*Itemswithasteriskvarydependingonsystemconfiguration.
Model HSP-200 / HSP-300
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SemiAutomaticProber