prober-english - 第8页

・ Model HSP -200SC is for 8" wafers. ・ Model HSP -300SC is fo r 12" wafers. 8 inch 12 inch ■ SEMI-AUTOMATIC PROBER Semi ‐ Automatic Prober  for  High  /L o w  Temperature  Tests Applications ‐ Temperature …

■ SEMI-AUTOMATIC PROBER

・

Model HSP-200 is for 8" wafers.

・

Model HSP-300 is for 12" wafers.

8inch 12inch

StandardSemi‐AutomaticProberModel

Thisisastandardsemi‐automaticprobesystemthatsupports8” or12” wafers.

Equippedwithahigh‐accuracyX‐Y‐Z‐θ quadraxial closedloopstagehavingexcellentpositioningaccuracyandrepeatability,

thisprobesystemensuresreliableprobecontact.

Thisprobesystemcanincorporateahotchuckthatsupportsatemperaturerangefrom+20°

Cto+300°C.

Thisprobesystemcanoptionallysupporthigh‐currentandhigh‐voltagepowerdeviceapplications.

Applications

Extended applications

‐ Temperaturecharacteristicstestsinrangefrom+20°Cto+300°C

‐ UltralowsignalI‐Vmeasurements(fAlevel)

‐ VariousC‐Vmeasurements(quasi‐staticC‐V,HF‐CV,andRF‐CV)

‐ RFmeasurements(upto67GHz)

‐ Ultrahigh‐speedI‐Vmeasurements

‐ Probecardsupport(cansupportMultisiteWLR)

‐ Built‐inlasercutter

(Pointmarking,Exfoliationofprotectionlayer,Metallayercutting )

‐ Activevibrationisolatorandultrahigh‐accuracyprobingthrough

imageprocessingpatternrecognition(accuracy:± 1umorfiner)

‐ Light‐receiving/emittingcharacteristicsevaluationapplicationsfor

optoelectronics(suchasLED,LD,VCSEL,

andPD)

‐ Commongatepad contactsofflat‐paneldisplaydevices

‐ High‐powerdevicemeasurements

(200Apulse,±3kVtriaxial,±10kVcoaxial)

‐ Waferlevelreliabilitytests(suchasEM,TDDB,HCI,NBTI,and BT)

WaferSize

X‐Ytravel

X‐Yrepeatability

X‐Yaccuracy

Ztravel

Unitdimension（W×D×H）*

Weight*

Zrepeatability

HSP‐200 HSP‐300

～φ200mm ～φ300mm

X：205mm，Y：300mm X：310mm，Y：450mm

1300×1000×1550mm

1400×1050×1600mm

750kg 950kg

＜±2μm

＜±5μm

20mm

＜±1μm

θ travel

θ repeatability

±7.5°

0.002°

*Itemswithasteriskvarydependingonsystemconfiguration.

Model HSP-200 / HSP-300

Semi‐AutomaticProber

・

Model HSP-200SC is for 8" wafers.

・

Model HSP-300SC is for 12" wafers.

8inch 12inch

■ SEMI-AUTOMATIC PROBER

Semi‐Automatic ProberforHigh/LowTemperatureTests

Applications

‐ Temperaturecharacteristicstestsinrangefrom+25°Cto+300°C

orfrom‐60°Cto+300°C

‐ UltralowsignalI‐Vmeasurements(fAlevel)

‐ VariousC‐Vmeasurements

(quasi‐staticC‐V,HF‐CV,andRF‐CV)[subpFlevel]

‐ 1/fnoiseevaluation

‐ RTN(random telegraphnoise)evaluation

‐ High‐frequencynoiseevaluation(upto800MHz)

‐ RFmeasurements(upto67GHz)/Sparameteracquisition

‐ Ultrahigh‐speedI‐Vmeasurements

Thisisasemi‐automaticprobesystemfornext‐generationsemiconductordevicesdesignedforlownoiseandlowleakage.

Inthissystem,ashieldedchamberstructurecontains

theprobeandchuckinatotallyEMIshieldedenvironment.

Thesystemsupportsin‐planeautomaticmeasurementssuchasultralowsignalI‐V/C‐Vmeasurementinthreshold

regions,1/fnoisemeasurement,Sparameteracquisition,RTN(randomtelegraphnoise)measurement,andhigh‐speedI‐V

measurementinatemperature

controlrangefrom‐65°Cto+300°C(or+400°Cwhenusingthespecialoption).

Thisprobesystemcanoptionallysupporthigh‐currentandhigh‐voltagepowerdeviceapplications.

*TheHSP‐150SCfor6” wafersisalsoavailable.

Extended applications

‐ Probecardsupport(cansupportMultisiteWLR)

‐ Activevibrationisolatorandultrahigh‐accuracyprobingthrough

image processingpatternrecognition(accuracy:±1umorfiner)

‐ Light‐receiving/emittingcharacteristicsevaluationapplicationsfor

optoelectronics(suchasLED,LD,VCSEL,andPD)

‐ Commongatepad contactsofflat‐paneldisplaydevices

‐ High‐powerdevicemeasurements

(400Apulse,±3kVtriaxial,±10kVcoaxial) *8” model

‐ Waferlevelreliabilitytests(suchasEM,TDDB,HCI,NBTI,and BT)

WaferSize

X‐Ytravel

X‐Yrepeatability

X‐Yaccuracy

Ztravel

Unitdimension（W×D×H）*

Weight*

Zrepeatability

HSP‐200SC HSP‐300SC

～φ200mm ～φ300 mm

X：205mm，Y：205mm X：310mm，Y：310mm

1350×1000×1450mm

1450×1150×1450mm

1050kg 1250kg

＜±3μm

＜±5μm

20mm

＜±1μm

θ travel

θ repeatability

±7.5°

0.002°

*Itemswithasteriskvarydependingonsystemconfiguration.

Model HSP-200SC / HSP-300SC

Semi‐AutomaticProber

HiSOLSemi‐Automatic Prober ControlSoftware

Manualoperation

BINmapping

WaferMapsetting

Seals feature

Supportedautomaticmeasurementsoftware

KEYSIGHTtechnologies

‐EasyEXPERT

‐DesktopEasyEXPERT

‐WaferProExpress

TFF/KEITHLEYinstruments

‐4200‐SCS KITE(KeithleyInteractiveTestEnvironment)

‐ACS

Proplus designsolution ‐Noisepro

OtherGP‐IBcommunication‐enabledsoftware

‐ User‐friendlymultifunctionalsemi‐automaticprobingsoftware.

‐ SupportsWindows8asitsoperatingsystem.(Windows7isalsosupported.)

‐ AlsoavailableasamanualproberwithasoftwareGUIorjoystickcontroller.

‐ ReceivingBINinformationfromahigher‐levelmeasuringinstrument,itispossibletodisplayBINmapping.

‐ Supportswafer

thermalexpansioncompensationfunctionforThermaltest.

‐ Possibletocontrolthesemi‐automaticproberusingtheGP‐IBcommandsentfromahigher‐levelmeasuring

instrument or PC.

‐ Possibletoprovidesoftwareformakingadatabaseofandextractingparametersofrawdataobtainedfromeach

measuring instrumentinordertoanalyzethedata.

(Optional)

‐ Theself‐developedsoftwareallowsuserstoincorporatecustomizedrequirements.

■ SEMI-AUTOMATIC PROBER

Semi‐AutomaticProber