N7201A652E - 第475页
NPM- TT2 EJM1E E-MB-06O-04 6-1-1 -4 At a glance
NPM-TT2 EJM1EE-MB-06O-04
Specifi-
cation
Machine specifications/
Basic performance 2
6-1-1-3
Operating procedure
6-1-1
■Component recognition camera specifications
Basic performance
Item
Multi-recognition camera
*1)
Type 1 (2D measurement)
/ Type 2 (thickness
measurement)
*2)
Type 3 (3D measurement)
Chip Outside dimension
0402 to
QFP
SOP
Outside dimension
5 5 to 45 45 mm
Minimum lead pitch
0.4 mm
Minimum lead width
0.2 mm
BGA
CSP
Outside dimension
5 5 to 45 45 mm
Minimum ball pitch
0.3 mm 0.5 mm
Minimum ball diameter
0.15 mm 0.25 mm
Minimum ball height
--- 0.25 mm
Connector
Outside dimension
to 100 (L) 90 mm (W)
Opposite side134.5mm
Minimum lead pitch
0.5 mm
Minimum lead width
0.2 mm
*1 ) The values may vary depending on head specifications.
*2 ) Thickness can be measured by 0402 to Min Tr/Di.
●Regarding the machines released later than NPM-D3 / NPM-W2 / NPM-TT2 and equipped with multi-
recognition camera, the component library for the conventional line camera may not be partially compatible.
(When the function such as illuminance check of recognition option is used)
NPM-TT2 EJM1EE-MB-06O-04
6-1-1-4
At
a glance
NPM-TT2 EJM1EE-MB-06O-04
Specifi-
cation
Machine specifications/
Basic performance 3
6-1-1-5
Operating procedure
6-1-1
Recognition unit configuration 1
■Multi-recognition camera: [Type 1]
Corrects position and angle displacement during component pickup.
It also enabled to detect BGA / CSP solder ball presence / absence using the lateral light (option)
*1)
.
*1) There are some limitations for detectable parts.
For details, (see →”BGA/CSP recognition condition (Type1 )”)
Recognition
method
Recognition speed Applicable component
Batch recognition High speed
General chip components including a square chip of 0402 or
larger
e.g.: BGA / CSP, QFP, SOP, connector, etc
QFP recognition condition (Type 1 )
Conditions of QFP which enables to be placed are as follows
*2)
.
8-nozzle head 3-nozzle head
Outer dimensions 5 x 5 to 32 x 32 mm 5 x 5 to 80 x 80 mm
*3)
Thickness 1.0 to 12 mm 1.0 to 30 mm
Lead pitch
0.5 mm, 0.65 mm, 1.0 mm,1.27 mm,
1.5 mm
0.4 mm, 0.5 mm, 0.65 mm, 1.0 mm, 1.27 mm,
1.5 mm
Lead width 0.2 mm or longer
Lead shape The amount of lead protrusion from the mold should be 1 mm or more.
Supply type: Tape, tray
*2) Basically, either OK or NG is judged by placement review and experimental trial using sample.
*3) If outer dimensions of a component exceeds 45 45 mm, split recognition is performed.
●For components other than above specifications, contact us.
●Regarding the machines released later than NPM-D3 / NPM-W2 / NPM-TT2 and equipped with multi-
recognition camera, the component library for the conventional line camera may not be partially compatible.
(When the function such as illuminance check of recognition option is used)