N7201A652E - 第479页
NPM- TT2 EJM1E E-MB-06O-04 6-1-1 -8 At a glance ■ Part thickness measurement function (Multi-recogn ition camera: [T ype 2]) Item Description Applicable component Each time 0402 to Mini T r / Di Minimum part thickness: 0…
NPM-TT2 EJM1EE-MB-06O-04
Specifi-
cation
Machine specifications/
Basic performance 4
6-1-1-7
Operating procedure
6-1-1
Recognition unit configuration 2
Connector recognition condition (Type 1 )
General conditions of a connector which can be placed are as follows
*1)
.
8-nozzle head
3-nozzle head
Outer dimensions 32 x 32 mm or less
L 120 x W 90 mm or less
*2) *3)
L 150 x W 25 mm or less
*2)
Lead pitch 0.5 mm or more
Lead width 0.2 mm or more
Lead shape The amount of lead protrusion from the body should be 1 mm or more.
Other shape
There should be no through holes in a vertical direction around contact pins.
Contact pins should not be exposed on the under surface.
Supply type: Tape, tray, stick
*1) Basically, assess the availability of recognition by reviewing / conducting experimental placement using
samples.
*2) In the case of placement of a large connector, its size may be limited due to a relationship between the
pickup position and the camera view as well as this condition.
For details, contact us.
*3) If outer dimensions of a component exceeds 45 45 mm, split recognition is performed.
NPM-TT2 EJM1EE-MB-06O-04
6-1-1-8
At
a glance
■Part thickness measurement function (Multi-recognition camera: [Type 2])
Item Description
Applicable
component
Each time 0402 to Mini Tr / Di
Minimum part thickness: 0.1 mm
*To detect the pickup of a component being in a standing or slanted position, the difference
between any two of the following --- the thickness, width and length of the component ---
needs to be at least 50 μm.
Function
Part thickness
measurement
function
Each time
Part thickness is measured each time, which is
reflected in placement height. In addition, you can
simultaneously check the pickup of micro parts being
in a standing or slanted position and the reversing
pickup of Tr / Di.
At the time of
first pickup
after
component
changes
Thickness measurement is done for first pickups after
“Automatic operation start”, “Component replenishment
following exhaustion detection”, “Tape splicing
detection”,and “Chip data modify.”
Part teaching
You can make thickness measurement and chip data
entry on a per-part basis.
Nozzle top check
function
Checks the height of the nozzles for abnormalities.
*1)
Eject detection
function
If an error such as a recognition error has occurred, it checks the top of
the nozzles for any extraneous / foreign matter after ejecting parts.
・This is not applicable to the measurement of nozzles with a pad or nozzles (e.g., 205A) the top of which is
dished.
・Purchase on a per-table (front / rear) basis.
*1) Breaks, sliding failures in nozzle holders
Multi-recognition camera: For type 2, in addition to the function in type 1, it equips with the part thickness
measurement and flip-over detection function to improve placement quality.
●Regarding the machines released later than NPM-D3 / NPM-W2 / NPM-TT2 and equipped with multi-
recognition camera, the component library for the conventional line camera may not be partially compatible.
(When the function such as illuminance check of recognition option is used)
NPM-TT2 EJM1EE-MB-06O-04
Specifi-
cation
Machine specifications/
Basic performance 5
6-1-1-9
Operating procedure
6-1-1
■3D measurement function (multi-recognition camera: [Type 3])
Multi-recognition camera: For type 3, in addition to the function in type 2, it is possible to detect the coplanarity
and XY-directional position of all leads such as the ones of QFP / SOP and the at a high speed.
Presence / absence or chipping of each ball on BGA / CSP can be detected.
Recognition
method
Recognition
speed
Example of
applicable
components
Minimum lead /
Minimum ball pitch
Minimum lead
width /
Minimum ball
diameter
Minimum ball
height
Batch
recognition
3D high speed
QFP, SOP 0.4 mm
*1)
0.12 mm ―
BGA, CSP 0.5 mm
*2)
0.3 mm 0.25 mm
*1) For QFP/ SOP whose lead pitch is 0.4 mm or less, consult us.
*2) For CSP whose ball pitch is 0.5 mm or less, consult us.
QFP recognition condition (Type 3)
Conditions of QFP which can be placed are as follows
*1)
.
8-nozzle head
3-nozzle head
Outer dimensions 2 x 2 to 32 x 32 mm 2 x 2 to 80 x 80 mm
*2)
Thickness 1.0 to12 mm 1.0 to 30 mm
Lead pitch 0.4 mm, 0.5 mm, 0.65 mm, 1.0 mm, 1.27 mm, 1.5 mm
Lead width 0.2 mm or longer
Lead shape The amount of lead protrusion from the mold should be 1 mm or more.
Supply type: Tape, tray
・The measurement range of lead coplanarity is ±0.5 mm.
・The planar portion of the lead under surface needs to be 0.2 mm or more in length.
・Depending on the recognition speed or the number of leads, it may take a certain amount of time to wait for
recognition processing at the time of placement.
*1) Basically, assess the availability of recognition by reviewing / conducting experimental placement using
samples.
*2) If outer dimensions of a component exceeds 45 45 mm, split recognition is performed.
●For details, contact us.
The planar portion of the under surface
0.2 mm or more
Recognition unit configuration 3
●Regarding the machines released later than NPM-D3 / NPM-W2 / NPM-TT2 and equipped with multi-
recognition camera, the component library for the conventional line camera may not be partially compatible.
(When the function such as illuminance check of recognition option is used)