00192231-09_VD_SSW 407.05_de en - 第28页
Software Version Description, Station Software Version 407.05 07/2008 Edition 5.7.5 Software Support for the "High Components" Special Design • Placement of high components As of a component height of 20 mm, a …
Software Version Description, Station Software Version 407.05 07/2008 Edition
5.7.4 Integration of the "Track Empty Max." Special Design
The integration of the "track empty max." special design gives you the flexibility of being able to adjust the
number of pick-up attempts to be made for the components to be placed. A value of 1, 2 or 3 can be
selected.
All values outside this range are limited to the lowest or highest value, as appropriate.
The setting is made by a service engineer in the "ref_lauf.ma" machine file (see sample file) and requires the
machine to be restarted manually.
{
\ File \ "REF_LAUF.MA"|
\ Version \ "70.407.mdd"|
\ Machine type \ "80F4"|
\ MA-Data: Options Referencerun \
\ \
\ Gantry Referencerun \ 1,
\ Vacuum Referencerun \ 1,
\ Hight Referencerun \ 1,
\ Repetitions Hight Referencerun \ 3,
\ \ 0, Í Parameter to be changed (without description)
\ \ 0,
\ \ 0,
\ \ 0,
\ \ 0,
\ \ 0,
\ \ 0,
\ \ 0
}
Note: The value set applies to all components to be placed.
There will be a different pick-up behavior until track-empty error between C&P and IC Head.
C&P Head:
It is not possible to avoid the first retry of the nozzle to get a component. The nozzle will try to pick up a
second time to get a component, even though there is a "1" entered for the parameter. If the parameter is "2"
the track empty error will occur as supposed after the real second pick up retry. So, there is no difference in
the behavior between entering a "1" or a "2".
IC Head:
Here the track-empty error will occur after the number of retries entered in ref_lauf.ma.
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Software Version Description, Station Software Version 407.05 07/2008 Edition
5.7.5 Software Support for the "High Components" Special Design
• Placement of high components
As of a component height of 20 mm, a new sequence starts in the machine. In this sequence, the gantry
must not move until the Z-axis has returned to its original position. This sequence applies exclusively to
the IC head.
• WPC sequence
If high components are set up on the wafflepack changer, the process for the transportation of the
wafflepack changer trays changes. Trays with high components must not be transported as long as the
C&P head is engaged in placement.
For the location position recognition of the wafflepack changer, the tray transported is the one that is
required next so that a component can be picked up. However, if this is a tray with high components, a
tray with low components is transported instead.
A tray with low components must already be set up for this to happen!
If the PCB does not require a "low" component, a "dummy component" must be set up at one of the
levels of the wafflepack changer. It is advisable to use a tray on the level following that of a high-
component tray in order to minimize transport times.
Once a printed circuit board has been fitted successfully, the wafflepack changer replaces a tray
containing high components with a tray containing conventional components so that no collisions occur
with the next printed circuit board.
Warning: A tray containing both low and high components is automatically treated as a tray containing
high components.
• Parking the C&P head:
Once the C&P head has finished placement, the star is moved into the parking position in order to
provide the height clearance required for the high components.
• Parking the 6-nozzle head: There is one empty segment. The star moves the empty segment to the
6 o'clock position.
• Parking the 12-nozzle head: There are two empty segments. These are parked in an intermediate
position.
To obtain further information or order the special design, please contact L&A EA CS AP SOKO.
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Software Version Description, Station Software Version 407.05 07/2008 Edition
5.7.6 Revision of the User Interface and Improved Fiducial and Ink Spot
Recognition
A new fiducial recognition system (synthetic fiducials) and a new ink spot recognition system (fast ink spots)
have been implemented in version 407.01. To further improve the handling of these new processes, the user
interface for the manipulators for the creation of models for and testing of synthetic fiducials and fast ink
spots has been revised in version 407.02. However, the functionality behind the graphical user interface
remains largely the same. There are only two differences worth mentioning: Firstly, the model type (synthetic
fiducial, fast ink spot or 2D fiducial) now has to be specified when a new descriptive model is created.
Secondly, the search area for synthetic fiducials is now defined by a square, the edge length of which is
obtained from the model dimensions plus the size tolerances plus the artwork tolerances. It thus describes
that part of the camera image used by the analysis system for the purpose of fiducial recognition. Up to now,
only the artwork tolerance had to be specified here.
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