Nexus_en - 第3页
3 Oxide and void-free joint surface between chip and interconnected device Integrated or separate cleaning and de-scaling processes Simple proling and fast heating and cooling rates Assembly under high level of vacuum I…
Void-free soldering with vacuum
Ideal for a great variety of applications
The Nexus guarantees high-quality results with a reow process using contact heat in
a vacuum. It thus meets the highest requirements of power electronics, in the advanced
packaging and semiconductor area.
The Nexus contact soldering system is best suited for void-free soldering of different
devices (e.g. IGBT) on DCB substrates. The combining of materials that are normally highly
dissimilar takes place in the vacuum at a reduced pressure at temperatures up to 400 °C
(optional 450 °C). The reduced pressure thereby helps to minimise oxidation on the compo-
nents and on the solder itself. The transfer of heat is via heat contact surfaces or optional
by radiation. The Nexus system is predominantly used in small and medium production
lines as well as in the eld of laboratory.
Contact
Soldering
Reliable and flexible
3
Oxide and void-free joint surface between chip and interconnected device
Integrated or separate cleaning and de-scaling processes
Simple proling and fast heating and cooling rates
Assembly under high level of vacuum
Integration of drying and degassing processes
Optimum dispersal of waste heat
Reliable contact soldering
The Nexus makes it possible!
The Rehm Thermal Systems vacuum soldering oven is ex-
ceptionally well suited for production facilities which pursue
flux-free and void-free soldering in various inert gases (N
2
,
H
2
, N
2
/H
2
95/5).
The use of lead-free and lead-containing pastes and pre-
forms with/without flux is also possible. Miniaturization in
the elds of advanced packaging and semiconductors can
be further developed by means of vacuum technology.
4
› Heating and cooling on a usable area of
500 mm x 500 mm
› Clearance of 100 mm above heating plate
› Max. operating temperature 400 °C
*
,
optional up to 450 °C
› Heating rate max. 150 K/min
*
,
cooling rate max. 180 K/min
*
› Vacuum up to 1mbar (optional 0,1 mbar)
› Fluxless activation with different gases possible
› One gas line for N
2
with pressure regulator and gas
monitoring; proportional valve
› Each gas supply line is equipped with a switch to save
purging gas while the machine is not in use
› The vacuum system can be equipped with adjustable
ow ratios. The volumetric ow rate for process gases is
adjustable and controlled by a proportional valve.
› Fluxless operation with 100 % nitrogen, forming gas,
formic acid or up to 100 % hydrogen
› Formic acid bubbler with fill level compensation to keep
the saturation always at the same level (saturation level
of N
2
depends on the fill level of the bubbler)
› Optional Residue Management System for use with
solder paste
Benets for exible processes
Nexus at a glance
*
related to contact plate