Nexus_en - 第4页
4 › Heating and cooling on a usable area of 500 mm x 500 mm › Clearance of 100 mm above heating plate › Max. operating temperature 400 °C * , optional up to 450 °C › Heating rate max. 150 K/min * , cooling rate max. 180 …
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Oxide and void-free joint surface between chip and interconnected device
Integrated or separate cleaning and de-scaling processes
Simple proling and fast heating and cooling rates
Assembly under high level of vacuum
Integration of drying and degassing processes
Optimum dispersal of waste heat
Reliable contact soldering
The Nexus makes it possible!
The Rehm Thermal Systems vacuum soldering oven is ex-
ceptionally well suited for production facilities which pursue
flux-free and void-free soldering in various inert gases (N
2
,
H
2
, N
2
/H
2
95/5).
The use of lead-free and lead-containing pastes and pre-
forms with/without flux is also possible. Miniaturization in
the elds of advanced packaging and semiconductors can
be further developed by means of vacuum technology.
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› Heating and cooling on a usable area of
500 mm x 500 mm
› Clearance of 100 mm above heating plate
› Max. operating temperature 400 °C
*
,
optional up to 450 °C
› Heating rate max. 150 K/min
*
,
cooling rate max. 180 K/min
*
› Vacuum up to 1mbar (optional 0,1 mbar)
› Fluxless activation with different gases possible
› One gas line for N
2
with pressure regulator and gas
monitoring; proportional valve
› Each gas supply line is equipped with a switch to save
purging gas while the machine is not in use
› The vacuum system can be equipped with adjustable
ow ratios. The volumetric ow rate for process gases is
adjustable and controlled by a proportional valve.
› Fluxless operation with 100 % nitrogen, forming gas,
formic acid or up to 100 % hydrogen
› Formic acid bubbler with fill level compensation to keep
the saturation always at the same level (saturation level
of N
2
depends on the fill level of the bubbler)
› Optional Residue Management System for use with
solder paste
Benets for exible processes
Nexus at a glance
*
related to contact plate
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Operating principles
Heating and cooling
A major benet of the Nexus contact soldering system is that the heating or cooling gradient can be predened based on pre-
determined parameters. The gradients can be preset as required. Within these specication limits, the temperature is adjusted
automatically by the Nexus so that these limit values are not exceeded. This eliminates the possibility of a malfunction of the
assembly to be soldered.
The heating output of the Nexus has been designed for a uniform heating process when fully loaded with high-mass assemblies
meaning that short cycle times are also no problem. Sensor components determine and verify the temperatures recorded on the
goods carrier support.
0
50
100
150
200
250
300
2200 2300
2400 2500
2600 2700 2800
Temperature in °C
Time in s
Set value
Controller 1
Controller 2
Controller 3
The vacuum soldering process generates temperatures of
up to 400 °C and is an ideal solution for void-free and flux-free
applications. The Nexus not only provides your manufactu-
ring operation with advantages for the soldering process, but
rather for bonding processes as well.
heating plate
PCB cooling
hermetically sealed process chamber
direct
heat transfer