D3操作手册 - 第12页

12 Placement Hea ds Collect & Place Heads Technical Data for the C & P Heads 12-nozzle Collect & Place he ad (standard- componen t cam era) 12-nozzl e Colle ct & Plac e head (high-re solution comp onent c…

Placement Heads

6-Nozzle Collect&Place Head for High-

Speed IC Placement

Description

The 6-nozzle Collect & Place

head also works on the Col-

lect & Place principle. The

high-resolution digital com-

ponent camera allows the

6-nozzle Collect & Place head

to optically center and place

component sizes ranging

from 0201 to 27 x 27 mm².

Checking and self-learning

functions

The checking and self-learn-

ing functions described on

page 10 for the 12-nozzle

Collect & Place head also

apply to the 6-nozzle Collect

& Place head.

Component vision module

DP axis:

Rotate component

to placement angle

Z axis

Pick up or place component

DR axis:

Rotate star

Reject component,

pull off or

insert sleeve

Placement Heads

Collect&Place Heads

Technical Data for the C&P Heads

12-nozzle

Collect & Place head

(standard-

component camera)

12-nozzle

Collect & Place head

(high-resolution

component camera)

6-nozzle Col-

lect&Place head

Component range

a) Please note that the range of components that can be placed is also affected by the pad geometry,

customer-specific standards, component packaging tolerances and component tolerances.

0402 to PLCC44, BGA,

μBGA, flip-chip, TSOP,

QFP, SO to SO32, DRAM

01005

0201

to flip-

chip, bare die, PLCC44,

BGA, μBGA, TSOP, QFP,

SO to SO32, DRAM

b) 01005 optional, from April 2007

c) with 0201 package

0201 to 27 x 27 mm²

Component specification

max. height

min. lead pitch

min. ball pitch

min. ball diameter

min. dimensions

max. dimensions

max. weight

6 mm

0.5 mm

0.45 mm

0.25 mm

0.5 x 0.5 mm²

18.7 x 18.7 mm²

2 g

6 mm

0.3 mm

0.25 mm

0.14 mm

0.3 x 0.3 mm²

18.7 x 18.7 mm²

2 g

8.5 mm

0.3 mm

0.25 mm

0.35 mm

0.14 mm

0.2 mm

0.3 x 0.3 mm²

27 x 27 mm²

5 g

d) for components < 18 x 18 mm²

e) for components ≥ 18 x 18 mm²

Programmable placement

force

2.4 N - 5.0 N 2.4 N - 5.0 N 2.4 N - 5.0 N

Nozzle types 9 xx 9 xx 8 xx, 9 xx

X/Y accuracy ± 45 μm/3 σ

± 60 μm/4 σ

± 41 μm/3 σ

± 55 μm/4 σ

± 45 μm/3 σ

± 60 μm/4 σ

Angular accuracy ± 0.5°/3 σ

± 0.7°/4 σ

± 0.5°/3 σ

± 0.7°/4 σ

± 0.2°/3 σ

± 0.3°/4 σ

Placement Heads

TwinHead for High-Precision IC Placement

Description

This sophisticated placement

head consists of two place-

ment heads of the same type

coupled together (twin

head). Both heads work

using the Pick & Place prin-

ciple. The TwinHead is suit-

able for processing

particularly difficult or large

components. Two compo-

nents are picked up by the

placement head, optically

centered on the way to the

placement position and ro-

tated into the necessary

placement angle. The com-

ponents are then placed

gently and accurately on the

board.

The placement head can also

use the nozzles for the Pick &

Place head (used on the F5

HM) in addition to the

nozzles recently developed

for the TwinHead.

Collect &Place head nozzles

can also be used.

Checking and self-learning

functions

The TwinHead's reliability

can be further increased with

various checking and self-

learning functions.

• For example, vacuum

checks at the nozzles indi-

cate whether the compo-

nent was picked up or

correctly.

• High-resolution, digital

component vision camer-

as such as the Fine-pitch

and Flip-chip vision camer-

as (optional) identify the

smallest deviations in the

component position. The

digital vision system cor-

rects such deviations, thus

guaranteeing a correct

placement position. The

digital component camer-

as are permanently fixed

to the machine frame.

• The component package

form is also checked and

the component is not

placed if the geometric

data thus determined dif-

fers from the programmed

data.

• A force sensor measures

and monitors the specified

component placement

forces.

Z axis

DP axis

How the TwinHead works