D3操作手册 - 第31页

31 Component Feeding Matrix Tray Changer Technical Data Electrical ratings Nois e emissio ns Permitted environmen tal fact ors Supply voltage 3 x 400 VAC, 50 Hz (Europe) 3 x 208 VAC, 60 Hz (USA) Total power 1.5 kW Rated …

Component Feeding

Matrix Tray Changer

Technical Data

Tray supply 1 (XL) Tray supply 2

Dimensions

Length x width

Height

1305 x 600 mm²

1490 mm for 830 mm PCB transport height

1560 mm for 900 mm PCB transport height

1590 mm for 930 mm PCB transport height

1640 mm for 950 mm PCB transport height

Weight (basic equipment)

approx. 500 kg (with PCB magazines

and waffle-pack tray holders)

Weight (fully equipped)

approx. 534 kg (with components)

Weight (moving mass)

approx. 80 kg approx. 43.5 kg

PCB magazine size (L x W x H)

391.2 x 305.6 x 93.3 mm³ 352.7 x 154.8 x 133.8 mm³

PCB magazine weight

(fully equipped)

(without waffle-pack tray holders)

approx. 11 kg

approx. 1.7 kg

approx. 7.5 kg

approx. 1.35 kg

Waffle-pack tray holder weight

850 g 150 g

Waffle-pack tray holders dimensions

(L x W x H)

386.5 x 295.8 x 11.1 mm³ 371 x 146 x 10.1 mm³

Distance from PCB magazine to maga-

zine

96 mm 135 mm

Distance from level to level

12 mm 11.8 mm

Vertical travel

444 mm

(1st to 30th waffle-pack

tray holder)

511.2 mm

(1st to 40th waffle-pack tray

holder)

Horizontal travel between

outgoing and pick-up position

approx. 647 mm approx. 638 mm

Storage capacity

30 XL waffle-pack tray hold-

ers with 60 JEDEC or

30 special magazines of

maximum size

40 waffle-pack tray holders

with

40 JEDEC waffle-pack trays

Changeover time (over 5 levels)

approx. 2 sec approx. 1.5 sec

Max. height of component and waffle

tray, including tolerances

all levels filled

one level free

two levels free

8.5 mm

19.5 mm

31.5 mm

8.5 mm

19.5 mm

–

Component Feeding

Matrix Tray Changer

Technical Data

Electrical ratings

Noise emissions

Permitted environmental factors

Supply voltage 3 x 400 VAC, 50 Hz (Europe)

3 x 208 VAC, 60 Hz (USA)

Total power 1.5 kW

Rated current 2.7 A at 3 x 400 VAC

4.2 A at 3 x 208 VAC

Fuses 3 x 16 A

Rated power consumption of the largest consumer 2 A

Maximum noise emissions 74 dB (A)

Room temperature between 15 °C and 35 °C

Atmospheric humidity 30 - 75 %

(No higher than 45% on average to prevent any possibil-

ity of condensation on the machine)

Vision Sensor Technology

PCB Position Recognition

Technical data

PCB fiducials

Local fiducials

Library memory f. recog-

nition of bad panels

up to 3 (subpanels and multiple panels)

up to 6 for the Long board option

(Optional PCB fiducials are output by

the optimization.)

up to 2 per PCB (may be of different

type)

up to 255 fiducial types per subpanel

Image analysis Edge detection method (Singular fea-

ture) based on grayscale values

Lighting method Front lighting

Fiducial recognition time 0.1 s

Field of vision 5.78 x 5.78 mm²

Camera’s field of view

Pixel

Ink spot, e.g. square

Evaluation window

Edge detection method

The size of the fiducial is pro-

grammed at the station com-

puter. From this time on form

and size of the fiducial is de-

fined and known. With these

data the PCB vision module is

able to search and recognize

the fiducial at the predefined

position on the PCB or ceram-

ic substrate without further

assistance. For this reason it

places several small evalua-

tion windows at the assumed

border of the fiducial. Within

these evaluation windows

the vision system looks for

contrast transitions between

bright and dark. After finding

such contrasts the actual

position of the fiducial can be

assigned by comparison with

the predefined – and thus

known – shape and size.

The analysis operations can

be used to determine any off-

set with respect to the DE-

SIRED position in the X and Y

directions and the angular

position.

Alternatively, a fiducial may

be taught as a pattern.

Additional functions of the

PCB vision module are recog-

nition of the position of the

feeder modules and ceramic

substrate (optional) and

recording of the machine

data including mapping.

The bad board detector

(GOOD/SCRAP scan) is also

moved over the ink spot

using the PCB vision module.

Description

SIPLACE has a number of

vision modules and a central

vision system to evaluate the

recorded image data ensur-

ing high placement accuracy.

At the machine's X-gantry

the PCB vision module is

mounted. It is used to find

the PCB's positioning-offsets

within the conveyor system.

This vision module is also

required to measure the

machine origin and/or the

feeder module positions on

one side of the table. Each

vision module consists of a

single CCD camera with inte-

grated lighting and optics.

The offsets in the position of

the PCBs are determined with

the help of at least two but

generally three reference

fiducials on the PCB. When

the PCB arrives at the place-

ment area the positioning

system with its PCB vision

module moves to the pro-

grammed fiducial.

The edge detection method

allows to choose predefined

fiducials from a menu (e.g.

cross, circle, square).