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1 Introduction and technical data User Manual SIPLACE F5/F5 HM 1.13 Overview o f the modules - placement heads Software version SR. 407.xx 01/2001 US E dition 60 1.13.7 Structure of the 6-segment C&P head with standa…

User Manual SIPLACE F5/F5 HM 1 Introduction and technical data
Software version SR.407.xx 01/2001 US Edition 1.13 Overview of the modules - placement heads
59
1.13.5 Description of the Pick&Place head
The Pick&Place head works according to the pick&place principle, which means that a compo-
nent is picked up by the nozzle with the aid of a vacuum. After optical centering with the fine-pitch
or flip-chip vision module, the component is turned to the correct placement angle, and inserted
into the PCB with high precision. The Pick&Place is particularly striking because of its high angu-
lar accuracy. 1
1.13.6 Technical data - Pick&Place head
Component range up to 55mm x 55mm
Max. height
Component height ≤ 13.5mm- PCB thickness
- PCB sagging
Option:
Component height ≤ 20mm- PCB thickness
- PCB sagging
Min. lead pitch 0.4mm (standard), 0.25mm (option)
Max. dimensions
up to 32mm x 32mm with single measurement
up to 55mm x 55mm with quadruple measurement
Max. weight 25 g
Programmable placement
force
1 - 10 N
Nozzle types
4xx, 5 standard nozzles including flip-chip nozzle with nozzle
changer
Component centering
Fine-pitch component vision module (standard)
Flip-chip vision module (option)
Benchmark placement rate 1,800 components/hour
D axis resolution 0.005°
Angular accuracy ± 0.052° / 3 σ, ± 0.07° / 4 σ, ± 0.105° / 6 σ
Placement accuracy ± 37.5 µm / 3 σ, ± 50 µm / 4 σ, ± 75 µm / 6 σ

1 Introduction and technical data User Manual SIPLACE F5/F5 HM
1.13 Overview of the modules - placement heads Software version SR.407.xx 01/2001 US Edition
60
1.13.7 Structure of the 6-segment C&P head with standard CO vision module
1
Fig. 1.13 - 3 Overview of the 6-segment Collect&Place head with standard component vision module
(1) Star with 6 sleeves
(2) Motor for "Reject" valve adjustment drive
(3) Turning station
(4) Standard vision module
(5) Z axis driving mechanism
(6) Star motor

User Manual SIPLACE F5/F5 HM 1 Introduction and technical data
Software version SR.407.xx 01/2001 US Edition 1.13 Overview of the modules - placement heads
61
1.13.8 Description of the 6-segment Collect&Place head
The functionality of the 6-segment Collect&Place head is similar to that of the 12-segment Col-
lect&Place head. With its standard vision module, the 6-segment Collect&Place head can quickly
and accurately place ICs with an edge length of up to 32mm x 32mm. It really comes into its own
when there is a very high proportion of ICs in the placement process. The cycle time of the 6-seg-
ment Collect&Place head depends on the dimensions and number of component leads or
bumps. 1
1.13.9 Technical data of the 6-segment C&P head with standard component
vision module
Component dimensions
Max. height
Max. weight
0.5mm x 1.0mm to 32mm x 32mm
8.5mm
5 g
Travel of the Z axis Max. 16 mm
Programmable placement force 2.4 to 5.0 N
Max. placement rate 8,000 components/hour
Angular accuracy ± 0.225° / 3 σ, ± 0.30° / 4 σ, ± 0.45° / 6 σ
Placement accuracy of the standard vision
module
± 52.5 µm / 3 σ, ± 70 µm / 4 σ, ± 105 µm / 6 σ