ASMPT_Brochure_SIPLACE_CA2_EN_241023 - 第4页

( Edition 4/10-2024 | All rights reserved. | Order No.: A22-ASMPT-A330-EN | Printed in Germany | © ASMPT GmbH & Co. KG All information and illustrations in this brochure are provided “as is” and without any warrantie…

THE HYBRID SIPLACE CA2 HIGH-SPEED PLATFORM

REVOLUTIONIZES SiP PRODUCTION

Only consistent miniaturization and increasingly complex electronics

make things like smart devices, autonomous driving and the 5G commu-

nication standard possible. The key technology is system-in-package

(SiP) because it combines ICs and SMT components into a compact,

highly innovative system.

As a hybrid combination of a SMT placement machine and a die bonder,

the new SIPLACE CA2 can process SMDs supplied from changeover tables

and feeders as well as dies taken directly from a sawn wafer in a single

workstep. By integrating the complex die bonding process into the SMT

line it eliminates the need for special machines in production. Reduced

personnel deployment, high connectivity and integrative data utilization

make the new SIPLACE CA2 the perfect match for the Intelligent Factory.

Placement directly from the wafer: more cost-eective and sustainable

Direct placement from the wafer eliminates the entire die taping process.

The result: less replenishment or splicing, less eort to feed material

to the line. Eliminating the tape feed for the sensitive dies also reduces

handling risk and increases production resiliency. All of these factors add

up to a signicant reduction in costs. At the same time, taping waste is

eliminated, making the manufacturing more environmentally friendly

and sustainable overall, while increasing ROI.

SMT AND DIE BONDING:

SIPLACE CA2

Placement Head CP20

▪ Component spectrum: 0201metric to

8.2 mm × 8.2 mm × 4 mm

▪ Touchless pickup and placement

▪ Placement force: 0.5 N – 4.5 N

▪ Extremely fast: Up to 38,000 cph

▪ Extremely precise: Up to ±10 µm @ 3 σ

Flexible combination

SMT and die bonding in one line simplify your

process ow and improve material logistics.

Space for JEDEC

tray feeder in case

Wafer Exchange

Unit is not used

5 × 8-millimeter

tape-and-reel

feeder

Place for

Multi Wafer

System

2.56 m

The SIPLACE CA2 can amortize itself

within a year by saving 800 km of tape

per year with full SiP production in

24/7 operation.

Maximum productivity

Processes SMT components and dies directly

from the wafer with die-attach and ip-chip

processes in the same work step.

Cost-saving

No taping cost, no associated quality cost of the die

taping process and no eorts for tape-waste disposal.

Unique exibility

Wafer system for up to 50 dierent wafers with a

wafer swap time of less than 10 seconds (“full multi-die

capability”). A wafer chuck, ux (linear) dipping unit (LDU)

and 10 x 8 mm tape-and-reel feeder tracks can be used

parallel to pick up from wafer.

Full traceability

Keep track of data for each die from its source

on the wafer to its placement position on the

circuit board (“full single-die-level traceability”).

Consistent sustainability

Processing dies directly from the diced wafer eliminates

the entire die-taping process – and lots of tape waste.

Maximum performance

Thanks to die buering and process parallelization,

the SIPLACE CA2 can place up to 54,000 components

per hour directly from wafer with an accuracy

of up to 10 μm @ 3 σ.

Comprehensive quality management

Multiple high-end vision system reliably

recognize even the smallest components and

elements for comprehensive process control.

MULTITALENT COMBINES

TWO WORLDS IN ONE MACHINE

Wafer Exchange Unit

▪ Extremely exible: Processes

up to 50 dierent wafers

▪ Extremely fast: Wafer swap in

only 10 seconds

More about

SIPLACE CA2

Access for

Overhead Hoist

Transport

Wafer Exchange Unit

with wafer swap in

10 seconds

Drawer for

wafer

magazine

2.5 m

2.56 m

(

All information and illustrations in this brochure are provided “as is” and without any warranties of any kind, whether expressed or implied, including but not limited to,

implied warranties of satisfactory quality, tness for a particular purpose and/or correctness.

The contents of this brochure are for general information purposes only, do not constitute advice, and are subject to change without notice. ASMPT therefore makes no

warranties or representations regarding the use of the content, details, specications or information contained in this brochure in terms of their correctness, accuracy,

adequacy, usefulness, timeliness, reliability or otherwise, in each case to the fullest extent permitted by law. Please contact ASMPT for the most current information.

Any specic performance features and/or capabilities will only be binding if contractually agreed upon.

All product names are brands or trademarks of ASMPT or other suppliers. Unauthorised use by third parties may violate the rights of their owners.

ASMPT GmbH & Co. KG

Rupert-Mayer-Strasse 48 | 81379 Munich | Germany | Phone: +49 89 20800-22000 | Email: smt-solutions.de@asmpt.com

asmpt.com | smt.asmpt.com

SIPLACE CA2

Placement speed (benchmark)

SMT up to 76,000 cph

Flip chip from wafer

up to 51,000 cph

Die attach from wafer

up to 54,000 cph

Wafer swap 10 seconds

Placement accuracy (3 σ) 20 μm / 15 µm / 10 μm (can be selected on placement position and component shape level)

20 µm @ 3 σ 15 µm & 10 µm @ 3 σ

PCB dimensions

(l × w)

50 mm × 45 mm to 375 mm × 260 mm (dual-lane mode)

50 mm × 45 mm to 375 mm × 430 mm (single-lane mode)

50 mm × 55 mm to 250 mm × 100 mm

Machine dimensions

(l × w × h) 2.56 m × 2.50 m × 1.85 m

Feeder slots

up to 80 × 8-millimeter tape-and-reel feeder or up to

2 × Multi Wafer System and 10 × 8-millimeter tape-and-reel feeder

Power consumption

(average) 1.9 kW

Air consumption 120 Nl/min (2 x SIPLACE CP20)

Certifications CE, SEMI S2/S8, Clean room class ISO 7

Data interfaces IPC-HERMES-9852, IPC-CFX, IPC-SMEMA-9851, SECS/GEM

Placement head SIPLACE CP20

Component range

from tape-and-reel: 0201m up to 8.2 mm

× 8.2 mm

from wafer: 0.3 mm

× 0.3 mm up to 8.2 mm × 8.2 mm

Min. lead pitch 70/50* µm

Min. lead width 30/25* µm

Min. ball pitch 100/50* µm

Min. ball diameter

50/25* µm

* with optional high-resolution camera (SST49)