CP40培训说明书 - 第7页

4  2  4 󰌧 / 󱯰 󰌧󲩥󲗶󰑫󱯵󰩲󰥥󱯰󱯵󱯵󲩥󲗶 SMC /SMD  SMT 󲛲󲣾󲜔󲻻 Chip: 󱿠󰽸 Ceramic: 󳎧󱈨 Polarity : 󰒲 Stagger: 󳉊󱎵 Hexagon inductor: 󲜃󱎵 A ir w ound coil: 󱞫󱎵󰋼󲲝󱎵󱐉󱰆󰾚 Cry stal oscillator: 󰎧…

2󱯵󲗶󱾫󱦬

SMT󱯵󲗶/󳒓󲖙󳒓󲩥󲗶󳒓󰬨󲩥󲗶󳒓󰬨󲩥󲗶󱡺

3󰸻󰃖󰋪󱦬

31󰨓󰸻󰃖

󲴺󲹾󰸻󰑫󲩥󰽸󱸧󰸻󰸻󰋊󲩥󰽸󱸧󰪳󰊨󰑠󱉙󰻅󲒾󰸻󰋊󱃠󰩲󱎵󰨓󳒓󲗶󰐺SMD

󱎵󰒰󰃖󲜗󱴽󰸻󰃖

32󰩲󰸻󰃖

󰸞󰋪󰐺󱯓󱯰󱯓󱯰󰸞󳗿󱯵VPS󰸞󰒰󰳱󱡺󲚲󰍠󲵋󲳸󱯓󱯰󲳁󰸞󳗿󱎵

󰉧󰥐󱨬󰥅󰳱󱎵󰸞󱸮󰒰󰸻󰋊󲴌󲕽󲸙󲸙󰸞

33󰸊󳇲󰸻󰃖

󱉙󰸊󳇲󰸻󳉒SMD󰒰󲴏󰃖󱎵󱉦󰃖󲜗󰸻󰃖󰌧󰸊󳇲󲚲󱐥󰃖󰃖󲜗󱉦󰒲󰸻

󰃖󰌧󳌥󲪶󲳸5󱜃󰌧󰸊󳇲󱎵󰭚󲳸󳠉󱽝󲴺󱉙270℃󱂸30W

4󲩥󲗶󲣯󱦬

41󰀺󲵐󱦬

󰐺󲵐󰑫󲵐󰑫󳠉󲵐󰑫

42󰀺󲩥󲗶󰋪󱦬

4.2.1󰐺󳖫

󰀺󱜼󲵁󳖫󲩥󲗶SMC/SMD󰕪󰂟PCB󱎵󰐥󲤴󰊥󲩥󲗶󱜼

422 󰌧

󱉙󱉙󰋊󱐉󰋊󲵋󲳸󰝒󰒰󰡒󰌧SMC/SMD󲩥󰉯PCB

423 󱯰

󱨬󳖫󲩥󲗶󰑫󰃃󰩲󰥥󱯰󳌥󱉙󲴲󰑫󰒵󲴏󰃖PCB󱉢󲴲󰑫󰒵󲴲󰤀󲩥󲗶󰑫󱎵󲩥󲗶

󲩥󲗶

424 󰌧/󱯰

󰌧󲩥󲗶󰑫󱯵󰩲󰥥󱯰󱯵󱯵󲩥󲗶SMC/SMD

SMT󲛲󲣾󲜔󲻻

Chip: 󱿠󰽸

Ceramic: 󳎧󱈨

Polarity: 󰒲

Stagger: 󳉊󱎵

Hexagon inductor: 󲜃󱎵

Air wound coil: 󱞫󱎵󰋼󲲝󱎵󱐉󱰆󰾚

Crystal oscillator: 󰎧,󰁠󲂒

Criteria: 󰔸󱎵

Notch: 󰜮,

Contour: 󲲟,󲳪

Stable: 󱝤󱎵

Burrs: 󱧈󲳪

Inferior: 󱎵,󱡺󱎵

Reliability: 󳒑󳒑

CSPchip scale package 󰎧󰽸󱯘󲗶

MCMmulti-chip model 󱿠󰽸󱯵

COBchip on board 󰒰󲲮󱿠󰽸

LSIlarge scale integrated circuit 󲛵󰝒󳏷󱉦󲬠LSIC

FCP: flip chip󲗶󱿠󰽸

DCAdirect chip attachment 󱐥󰃖󱿠󰽸󱯵󲗶

SBCsolder ball connect 󰸻󰋊󱄴󲴏󰃖󱾫

GLASSepoxy:󱃠󰥘󱎵󱃠󰥘󰕂󱸳

Asymmetrical: 󱎵󱜡󱎵

Diode: 󰒲󱣒

Trimmer (capacitor): 󲤴󰊥󲤴󱉦

Resistor: 󱉦󳍬

Capacitor: 󱉦

transistor: 󰎧󱣒

Rectangular: 󱔚󱎵󱐥󲜃󱎵

PGApin grid array) 󱹋󱲂󰕭󳍦󲗶

BGAball grid array) 󱄴󱔚󳍦󰃃󲗶

PQFPplastic quad flat package)󰋊󰋪󲗶

C4controlled collapse chip connection)󰃘󳎨󱿠󰽸󱶅󰑠

DIPdual in-line package) 󱐥󰄃󲗶

PLCCplastic leaded chip carrier) 󰋊󰐺󱹋󱿠󰽸󲲮󲗶

SOJsmall out-line J-lead)J󱹋󲗶

TSOPthin small out-line package)󲊵󲗶

TBGAtiny-BGA)󱄴󳍦󲗶

BLPbottom lead package)󲸙󱹋󲗶

UBGAmicro BGA)󱿠󰽸󳒓󱜠󲗶󳒓󱜠󰤅11.4