ASM 贴片机 SIPLACE TX V2机器性能参数 - 第8页

8 SIPLACE placement heads General Head modularity The SIPLACE placement machines are disting uished by maximum flexibility in the production proce ss. This flexibility is in part due to the head modularity of the place -…

Machine performance

Placement head types SIPLACE SpeedStar (C&P20 P2)

SIPLACE MultiStar (CPP)

SIPLACE TwinStar (TH)

Placement performance

The placement performance is influenced by the different head combinations and head positions, plus the con-

veyor configurations. Individual options and customized applications also influence the placement performance.

On request, ASM can calculate the actual performance of your product on your machine configuration.

IPC value [components/h]

Conducted with 0201 components, in accordance with the layout of the IPC 9850 standard of Association Con-

necting Electronics Industries.

SIPLACE benchmark value [components/h]

The SIPLACE benchmark value fulfills the requirements in the ASM scope of delivery and performance.

Theoretical maximum output value [components/h]

The theoretical maximum output value is calculated from the most favorable conditions for each machine type

and setting, and corresponds to the theoretical conditions normally used in the industry.

SIPLACE TX2i placement

machine

Placement area IPC value Benchmark value

C&P20 P2 / C&P20 P2 79,000 96,000

CPP_L/CPP_L 46,000 51,000

SIPLACE TX2 placement

machine

Placement area IPC value Benchmark value

C&P20 P2 / C&P20 P2 72,300 85,500

C&P20 P2 / CPP_L 57,800 66,600

CPP_L/CPP_L 43,300 47,700

CPP_H / CPP_H 40,800 44,700

TH / CPP_H 25,500 29,000

SIPLACE TX1 placement

machine

Placement area IPC value Benchmark value

C&P20 P2 36,100 44,000

CPP_H 20,500 22,500

TH 5,050 5,500

CPP_H = Multistar CPP in high assembly position

CPP_L = Multistar CPP in low assembly position

SIPLACE placement heads

General

Head modularity

The SIPLACE placement

machines are distinguished

by maximum flexibility in the

production process. This

flexibility is in part due to the

head modularity of the place-

ment machines, which allows

different placement head

variants to be configured to

suit the production require-

ments.

The SIPLACE SpeedStar

and the SIPLACE MultiStar

operate according to the

Collect&Place principle i.e.

one cycle includes pickup or

"collection" of 20 or 12 com-

ponents, their optical center-

ing on the board and their

rotation into the required

placement angle and posi-

tion. They are then placed

gently and accurately onto

the PCB. This principle is

particularly suitable for high-

speed placement of standard

components.

The SIPLACE MultiStar also

functions according to the

Pick&Place principle. Two

components are picked up

by the SIPLACE MultiStar,

optically centered on the way

to the placement position

and rotated into the required

placement angle. This princi-

ple is particularly suitable for

fast and precise placement

of large components.

The SIPLACE MultiStar uses

both the Collect&Place and

the Pick&Place principle.

Mixed Mode allows com-

bined use of these two

modes, which were previ-

ously separated from one

another, in one placement

cycle.

Pick&Place mode (Twin

Head)

The high-precision SIPLACE

TwinStar functions according

to the Pick&Place principle.

Two components are picked

up by the SIPLACE Twin-

Star, optically centered on

the way to the placement

position and rotated into the

required placement angle.

This principle is particularly

suitable for fast and precise

placement of special compo-

nents, such as those

required for grippers etc..

Control and self-learning

functions

The reliability of the

SIPLACE placement heads

can be enhanced even fur-

ther with various checking

and self-learning functions.

• Component sensor

Checks the presence of

the components on the

nozzle before the pickup

and placement process

• Digital camera

Checks the position of

each component on the

nozzle. This check is per-

formed in a single step,

with no extra time involved

but with optimum scan-

ning of each individual

component.

• Force sensor

Monitors the prescribed

component set-down

force.

The sensor stop proce-

dure enables compensa-

tion of height differences

during pickup and PCB

warpage during place-

ment.

• Vacuum sensor

Checks whether the com-

ponent was correctly

picked up or placed.

Collect&Place mode

Pick&Place mode

(SIPLACE MultiStar)

Mixed mode

Placement heads

SIPLACE SpeedStar (C&P20 P2)

SIPLACE SpeedStar(C&P20 P2)

With component camera type 48

Component range

a) Please note that the placeable component range is also affected by the pad geometry, the customer-

specific standards, the component packaging tolerances and the component tolerances.

0.12 mm x 0.12 (0201 metric) to 2220, Melf, SOT, SOD, Bare-

Die, Flip-Chip

Component spec.

Max. height

Min. lead pitch

Min. lead width

Min. ball pitch

Min. ball diameter

Min. dimensions

Max. dimensions

Max. weight

2 mm

/ 4 mm

70 µm

30 µm

100 µm

50 µm

0.12 mm x 0.12 mm

8.2 mm x 8.2 mm

1 g

b) Only 2 mm possible for SIPLACE TX2i.

Programmable set-down

force

Touchless Placement, 1.3 N ± 0.5N (standard value)

0.5 N - 4.5 N

Nozzle types 40xx/60xx

X/Y accuracy

c) The accuracy values fulfill the conditions in the SIPLACE scope of supply and services.

± 25 µm/3

Angular accuracy ± 0.5° / 3

Illumination level 5