DEK Horizon iX Technical Specification - 第8页

8 DEK Hori zon iX Printer S tand ard C onfigu ration Services Specification Voltage 100 Volts to 240 Volts ± 10%. Single phase 50/60 Hz Maximum Curr ent at 11 5V 15 Amps wit h vacuum pu mp 6 Amps w ithou t vacu um pump M…

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DEK Horizon iX
Printer Standard Configuration
Vision
Specification
Vision System
SFF
Fiducial Recognition
Automatic fiducial teach and find incorporating 0.3mm
fiducial capture
Fiducials
2 or 3
Fiducial Types
Synthetic fiducial library or unique pattern recognition
Fiducial Size
0.3mm to 3mm*
Fiducial Locations
Anywhere on substrate
Fiducial Error Recovery
Auto lighting adjustment
Auto fiducial search
Camera Lighting
Software controlled programmable LED lighting
*0.1mm to 3mm available via RFQ
Standard C Chase
Specification
Screen Frame Size (maximum)
736mm x 736mm (29” x 29”)
Screen Frame Thickness
25mm to 38mm (1” to 1.5”)
Image Position
Front
Centre
Custom
Operating Environment*
Specification
Temperature
10° to 35°C (50° to 95°F)
Humidity
30% to 70% relative humidity (non-condensing)
Altitude
Maximum 2,000 metres (6,500 feet)
Location
Internal only, not suitable for wet locations
*as described in the IPC Standard J-STD-001G-Reqirements for Soldered Electrical and Electronic
Assemblies Section 4 with respect to the following:
• Facilities - Cleanliness and ambient environments in all work areas be maintained at levels that
prevent contamination or deterioration of tools, materials, and surfaces to be soldered or
conformally coated. Eating, drinking, smoking, including use of e-cigarettes, and/or use of
tobacco products be prohibited in the work area.
• Environmental Controls - The soldering facility (controlled work area) be enclosed, temperature
and humidity controlled, and maintained at a positive pressure.
• Controlled Work Area (CWA) For the purpose of this statement, a Controlled Work Area
(CWA) is defined as an enclosed assembly / processing area maintained to a high degree of
shop cleanliness, environmental control, and foreign object debris (FOD) mitigation, either by
process or procedure, to limit the entry of contamination.
DEK Horizon iX
Printer Standard Configuration
Services
Specification
Voltage
100 Volts to 240 Volts ±10%. Single phase 50/60 Hz
Maximum Current at 115V
15 Amps with vacuum pump
6 Amps without vacuum pump
Maximum Current at 230V
8 Amps with vacuum pump
3 Amps without vacuum pump
Over Current Protection
An external circuit breaker ≤20 Amps is required to be
fitted in line with the machine supply
Air Supply
To ISO 8573.1 Standard Quality Class 2.3.3
Pressure 5 bar to 8 bar
General usage 5 litres/minute at 5 bar to 8 bar
Maximum usage 226 litres/minute at 6 bar
Shipping Information
Specification
Approximate Weight
810kg boxed (dependent upon configured options
selected with machine)
600kg unboxed (dependent upon configured options
selected with machine)
Approximate Dimensions
2060mm x 1500mm x 1570mm
(81.1” x 59” x 61.8”)
Certification
Specification
CE
98/37/EC
89/336/EEC
73/23/EEC
Subsequent amendments
Acoustic Noise Level
Less than 70dB 2003/1/EC
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DEK Horizon iX
Printer Productivity Options
Process
Specification
Cycle Time Upgrade
10 seconds to 8 seconds
Print Method
Paste Dispenser
Paste Roll Height Monitor
ProFlow® ATx
Ball Placement
Printing Environment Control
Static – Air Ioniser
Temperature – Temperature Control Module (TCM)
Recommended Stencil Frame
VectorGuard
Adjustable Stencil Mount (ASM)
Frame variants – Fully adjustable to accommodate
frame sizes in the range of 305mm to 736mm
(12”* to 29”) by 38mm height.**
Image position: Centre/Front/Custom
Under Stencil Cleaning
Interchangeable Under Stencil (IUSC) cleaner, fully
programmable with wet/dry/vacuum wipe with external
solvent tank. Specify length (300mm, 400mm, 520mm)
Typhoon Under Stencil Cleaner, fully programmable
with wet/dry/vacuum wipe with external solvent tank
Specify length (300mm, 400mm, 460mm, 515mm)***
Vacuum Assist for Under Stencil
Cleaning
On board vacuum unit 35 litres/second airflow
On board vacuum unit 25 litres/second airflow
On board venturi vacuum unit
Stencil Positioning
Automatic loading incorporating squeegee drip tray
Semi automatic loading incorporating squeegee drip
tray
Semi automatic loading without squeegee drip tray
Temperature/Humidity Sensor
Monitoring of the process environment
* Minimum screen width limited to 381mm (15”) with 300mm IUSC and 250mm board clamps
**Not available for Dual Lane Configuration
*** If configured with an ASM, the cleaner chamber size should be matched with the minimum ASM
width and stencil frame width being used
Long Board Accommodation
Specification
Substrate Handling Size (maximum)
620mm (X) x 508.5mm (Y)
Under Stencil Cleaning
Typhoon Under Stencil Cleaner (620mm, poly blade
insert only)
Software & Communications
Specification
Substrate Handling
Flexible boards
Selective print pass through
Singulation
Virtual Panel Tooling (VPT)
Top Reference System (TRS)
Software & Communications
GEM on TCP/IP
Offline Programming
Statistical Process Control
On board, reported via operator interface (QC-CALC)