M3plus_OperationManual_e - 第4页
iii 2. Parts parameters .................................................................. 4-4 2.1 Alternativ e components .................................................................... 4-4 2.1.1 Component switchin…
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3.4.1 Conveyor width ............................................................................................. 2-14
3.4.2 Push-up pins .................................................................................................. 2-15
4. Starting and finishing production .................................... 2-16
4.1 Starting production .........................................................................2-16
4.2 Finishing PCB production ................................................................ 2-28
Chapter 3 Creating the PCB data
1. Overview ............................................................................... 3-1
2. Registering and selecting the PCB name .......................... 3-2
2.1 Registering PCB names ...................................................................... 3-2
2.2 Selecting the PCB data ......................................................................3-4
3. Creating the PCB information ............................................. 3-5
3.1 Board parameters ..............................................................................3-6
3.2 Mount parameters .............................................................................3-9
3.3 Offset parameters............................................................................3-11
3.3.1 Pitch distribution function .............................................................................. 3-13
3.3.2 Block distribution function ............................................................................. 3-15
3.4 Fiducial parameters .........................................................................3-17
3.4.1 Board fiducial function .................................................................................. 3-19
3.4.2 Block fiducial function ................................................................................... 3-19
3.4.3 Local fiducial functions .................................................................................. 3-20
4. Creating the component information ............................... 3-22
4.1 Creating procedure ......................................................................... 3-23
4.2 Basic parameters .............................................................................3-24
4.3 Pick parameters ...............................................................................3-29
4.4 Mount parameters ...........................................................................3-32
4.5 Vision parameters............................................................................3-33
4.6 Shape parameters ............................................................................3-34
4.7 Tray parameters ............................................................................... 3-40
4.8 Option parameters ..........................................................................3-42
4.9 Parts Adjust mode ...........................................................................3-43
4.9.1 Parts Adjust mode .......................................................................................... 3-44
4.10 Using component feeders other than tape feeders .......................... 3-49
4.10.1 Setting the stick feeder component data ......................................................... 3-49
4.10.2 Tray shuttle feeder .......................................................................................... 3-53
5. Creating the mark information .......................................... 3-59
5.1 Creating procedure ......................................................................... 3-60
5.2 Basic parameters .............................................................................3-61
5.3 Shape parameters ............................................................................3-62
5.4 Vision parameters............................................................................3-64
5.5 Mark Adjust mode ...........................................................................3-66
Chapter 4 Using the advanced functions
1. Board parameters ................................................................ 4-1
1.1 Using the badmark functions ............................................................4-1
1.1.1 Badmark parameters ........................................................................................ 4-3
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2. Parts parameters .................................................................. 4-4
2.1 Alternative components .................................................................... 4-4
2.1.1 Component switching flow .............................................................................. 4-4
2.1.2 Setting the alternative components ................................................................... 4-5
2.2 Using "Parts Group No." .................................................................... 4-7
3. Mark parameters .................................................................. 4-8
3.1 Pattern matching ...............................................................................4-8
3.1.1 Pattern registration ........................................................................................... 4-9
3.1.2 Using the data for pattern matching ............................................................... 4-13
4. Setup parameters ............................................................... 4-14
4.1 Halfway Continue function ............................................................. 4-14
4.1.1 Loading the saved data ................................................................................... 4-15
4.1.2 Editing mount flags ........................................................................................ 4-15
5. Edit Assistant function ...................................................... 4-16
5.1 Switching to the Edit Assistant screen .............................................4-16
5.2 Selecting a range of rows ................................................................ 4-17
5.3 Editing rows .................................................................................... 4-18
5.4 Find and replace .............................................................................. 4-19
5.5 Renumber........................................................................................4-20
6. Recognition image check and save function .................. 4-21
7. Fixed board matching ........................................................ 4-23
7.1 How to set up the fixed board matching function ...........................4-25
Chapter 5 Editing the PCB data
1. Using the Editor ................................................................... 5-1
1.1 Jump.................................................................................................. 5-1
1.1.1 Specifying the line number to jump ................................................................. 5-1
1.1.2 Jump to the top line ......................................................................................... 5-2
1.1.3 Jump to the bottom line.................................................................................... 5-3
1.1.4 Copying and pasting the data ........................................................................... 5-4
1.2 Filtering ............................................................................................. 5-6
1.2.1 Filtering............................................................................................................ 5-6
1.2.2 Canceling the filter ........................................................................................... 5-7
1.3 Find and Replace ............................................................................... 5-8
1.3.1 Find ................................................................................................................. 5-8
1.3.2 Replace .......................................................................................................... 5-10
1.4 Sort ................................................................................................. 5-12
1.5 Multiplying the Component Data .................................................... 5-13
2. Block offset......................................................................... 5-14
2.1 Creating the block offset data ......................................................... 5-14
2.2 Block offset conversion and reconversion ....................................... 5-17
2.2.1 Executing the block offset conversion ............................................................. 5-17
2.2.2 Reconverting to the multi-block data .............................................................. 5-19
3. Optimizing the data ............................................................ 5-20
3.1 Setting the optimizing conditions .................................................... 5-21
3.2 Executing......................................................................................... 5-24
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4. PCB file format conversion ............................................... 5-25
4.1 Converting VIOS into XML ..............................................................5-25
4.2 Converting XML into VIOS ..............................................................5-27
Chapter 6 Managing the data
1. Data backup .......................................................................... 6-1
1.1 Creating a PCB data disk ...................................................................6-1
1.1.1 Data backup .................................................................................................... 6-2
2. Creating the user database ................................................. 6-4
2.1 Copying the data into the database ...................................................6-4
3. Creating XML library ............................................................ 6-6
3.1 Setting the library path ......................................................................6-6
3.2 Setting the PCB data links .................................................................6-8
3.2.1 Setting links from the VGOS ............................................................................. 6-8
3.2.2 Setting links from the Editor ........................................................................... 6-10
3.2.3 Using library matching (Editor only) ............................................................... 6-11
3.3 Saving the library data.....................................................................6-13
Appendix
1. Specifications ...................................................................... A-1
1.1 Air regulator unit ............................................................................. A-1
1.2 Connection between machines ........................................................ A-2
1.2.1 PREVIOUS INTERFACE connector.................................................................... A-3
1.2.2 NEXT INTERFACE connector ............................................................................ A-3
1.3 Power connection terminals ............................................................. A-4
2. Alignment Type glossary.................................................... B-5
2.1 Alignment Type ................................................................................. B-5
2.1.1 Alignment Type definition ................................................................................ B-7
2.1.2 Detecting the component center and tilt .......................................................... B-9
2.2 Using special recognition settings .................................................. B-10
2.2.1 QFP recognition mode ................................................................................... B-10
2.2.2 Single connector recognition mode ................................................................ B-10
2.2.3 4-way connector recognition mode (Con-NSEW) ........................................... B-10
2.2.4 Mark recognition mode .................................................................................. B-11
2.2.5 Special rectangle (Sp. Quad) recognition mode .............................................. B-18
2.2.6 PLCC (SOJ) base recognition mode ................................................................ B-19
2.2.7 Center-of-gravity detection (probe recognition mode)..................................... B-21
Index .......................................................................................... S-1