M3plus_OperationManual_e - 第89页

3 - 24 3 Creating the PCB data 4. Creating the component information 4.2 Basic parameters Basic parameters 27412-5E-20 A: Alignment Group Select from "Chip", "IC", "Ball", "Connector&qu…

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4. Creating the component information

Creating the PCB data

4.1 Creating procedure

After selecting the PCB name, press the [Parts] button in the main menu button area to

open the component information screen. Enter the component name and comment in the

data No. list on the upper part of the screen, and set the parameters in the right lower list,

as explained below.

Press the [Parts] button to open the component information screen.

Step 1 Step 2 Step 3

Step5

Step 4

Step 7

Component information screen

27411-5E-20

Enter the component name in the Part Name column.

Enter the name printed on the tape reel or on the component itself within 20 alphanu-

meric characters. A space cannot be included in the name.

Enter a comment.

Type any desired comment in the Parts Comment column as necessary. You can omit

entering comments here.

Set the parameters.

While selecting the [Basic], [Pick], [Mount], [Vision], [Shape] tabs and so forth, set the

necessary parameters in the right lower list.

Adjust the parameters in the Parts Adjust mode.

Press the [Adjust] button to open the Parts Adjust screen that allows you to adjust or

check the parameters of the selected component. (For more details, see "4.9 Parts

Adjust mode" in this chapter.)

Repeat the above steps for other components.

Repeat the same procedure from step 2 to register all components to be mounted on

the PCB.

Save the data.

Press the [Save] button to store the data.

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Creating the PCB data

4. Creating the component information

4.2 Basic parameters

Basic parameters

27412-5E-20

A: Alignment Group

Select from "Chip", "IC", "Ball", "Connector" or "Special".

B: Alignment Type

Specify the type of component by referring to the descriptions below.

Chip

• Std.Chip (Standard chip)

This setting does not identify the component, but detects the four corners of the component and

then calculates the center and angle of the component. Select this setting first when recognizing

box type chips. If the component cannot be recognized by this setting, try using "Sp.Chip" or

"Small Chip".

•Melf Chip

This is specially for Melf chips.

• Bare Chip

This is specially for bare chips.

• Cylinder

This is suited for components with a cylindrical shape and no direction.

• Sp.Chip (Special chip)

This setting has a parameter used to recognize "Lead Width" in addition to the "Std.Chip" setting.

Select this to recognize box type chips which cannot be recognized correctly by the "Std.Chip"

setting. If it is still difficult to recognize the component by this setting, try with "Odd.2Ends".

• Small Chip

This is suited for small chip components such as 0603 whose light-reflecting area is smaller than

the actual size.

• Odd.2Ends

This mode has a parameter used for recognizing the lead width and length by using "LeadWidth"

and "ReflectLL." in addition to the "Std.Chip" mode. This mode is suited for recognizing box type

chips which cannot be recognized by "Std.Chip" or "Sp.Chip".

• Mini Tr/SOT

This mode is for mini mold components with the same shape leads in the N and S direction, but

whose number of leads in each direction is different.

•P-Tr

This mode is for components having leads in the N and S direction, and whose number of leads in

each direction is different like "Mini-Tr/SOT", and also the shape of opposing leads is different.

• SOP

This is for components having the same shape leads and same number of leads in the E and W

direction, and whose leads protrude out from the molded body.

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4. Creating the component information

Creating the PCB data

•SOJ

This is for components having the same shape leads and same number of leads in the E and W

direction like "SOP", but whose leads do not protrude out from molded body.

• QFP

This is for components having the same shape leads in four directions of N, S, E and W, and the

same number of oppositely positioned leads (N to S and E to W), and whose lead protrudes out

from molded body.

• PLCC

This is for components having the same shape leads in four directions of N, S, E and W, and the

same number of oppositely positioned leads (N to S and E to W) like "QFP", but whose leads do

not protrude out from molded body.

• OffLead

This is used for components which can be defined by "Con-NSEW" but some of the leads are

removed. Input this setting for each direction.

Ball

• Simple BGA

This is specially for BGA components. The number of ball leads can be checked, but the ball lead

positions and nicks are not checked.

• BGA

This is specially for BGA components. The ball lead positions can be edited to check the lead

positions and nicks.

• FlipChip

This is specially for flip chip components and can be used only when a vision camera with a side

lighting unit is used.

Connector

• Con-E (Connector E)

This is for components having the same leads only in the E direction.

• Con-NSEW (Connector NSEW)

This setting is suited for components having leads in four directions of N, S, E and W, but the

number of leads and their shape in each direction are different. Only one type of lead shape can be

set for each direction.

• Odd.Con

Use this setting for connectors suitable for "Con-E" having off leads.

• Special

This can be used for components having irregularly arranged leads. For example, components

having leads in four directions of N, S, E and W like "Con-NSEW", but whose number of leads and

the shape in each direction are different. Although "Con-NSEW" allows setting only one type of

lead shape in each direction, "Special" allows setting two types, making it usable for various

components with irregular shapes. This setting cannot be used with the lead coplanarity function.

Odd.Chip

• Odd.Chip

This setting automatically determines whether to recognize a component as "white" or "black",

making it suited for components such as bare chips which are difficult to judge as reflective or

non-reflective against the background (PCB). This mode is also appropriate for BGA components

with a light reflective portion on the body.

• AsMark

This setting recognizes components as a mark and is therefore suited for specially shaped compo-

nents.

• Sp. Quad

This is used for square or rectangular components which reflect light at the four sides of the

package making it difficult to distinguish the leads from the package.

• Gravity

This detects the center-of-gravity of a target (black or white) in the specified area, allowing

reliable recognition of various components with irregular shapes. When using this setting, test-

mount the component after setting the data, and check the mounting shift (distance from center of

mounting position to center of the component). Then enter the shift amounts in "Cntr. Offset XYR"

of the Shape parameters.