ASM-SX-V3-设备性能参数-DMS - 第12页

12 Machine performance Placement head types SIPLACE S peedS tar (C&P20 P2) SIPLACE MultiS tar (CPP) SIPLACE T winS tar (TH) Placement performanc e The placement performan ce is inf l uenced by the different head c om…

Modular machine concept

Example of SIPLACE SX1 with WPC5/WPC6

PLEASE NOTE: For all possible head config-

urations please refer to section Machine per-

formance from page 12.

COT 30 Out Component trolley with 30

tracks in the outer position

COT 60 In Component trolley with 60

tracks in the inner position

WPC Waffle Pack Changer,

type

5 or type 6

Head Placement head in acc.

with head configuration

NC Nozzle changer in acc.

with head configuration

IC Stationary camera

FC Flip chip camera

G1 Gantry 1

PA Placement area

Machine performance

Placement head types SIPLACE SpeedStar (C&P20 P2)

SIPLACE MultiStar (CPP)

SIPLACE TwinStar (TH)

Placement performance

The placement performance is influenced by the different head combinations and head positions, plus the

conveyor configurations. Individual options and customized applications also influence the placement perfor-

mance. On request, ASM can calculate the actual performance of your product on your machine configuration.

IPC value [components/h]

According to the vendor-neutral conditions of the IPC 9850 standard published by the Association of Connect-

ing Electronics Industries.

SIPLACE benchmark value [components/h]

The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the con-

ditions set out in the ASM scope of service and supply.

SIPLACE SX2 placement

machine

Placement area IPC value Benchmark value

C&P20 P2 / C&P20 P2 66,000 86,500

C&P20 P2 / CPP

a) MultiStar CPP: low installation position

52,500 66,000

CPP

/ CPP

38,000 46,000

CPP / TH

b) MultiStar CPP: high installation position

23,100 27,000

TH / TH 10,200 11,000

SIPLACE SX1 placement

machine

Placement area IPC value Benchmark value

C&P20 P2 33,000 43,000

CPP

19,000 23,000

TH 5,100 5,500

Placement heads

General

Head modularity

The SIPLACE placement

machines are distinguished

by maximum flexibility in the

production process. This

flexibility is in part due to the

head modularity of the place-

ment machines, which allows

different placement head

variants to be configured to

suit the production require-

ments.

The SIPLACE SpeedStar

and the SIPLACE MultiStar

operate according to the

Collect&Place principle i.e.

one cycle includes pickup or

"collection" of 20 or 12 com-

ponents, their optical center-

ing on the board and their

rotation into the required

placement angle and posi-

tion. They are then placed

gently and accurately onto

the PCB. This principle is

particularly suitable for high-

speed placement of standard

components.

The SIPLACE MultiStar also

functions according to the

Pick&Place principle. Two

components are picked up

by the SIPLACE MultiStar,

optically centered on the way

to the placement position

and rotated into the required

placement angle. This princi-

ple is particularly suitable for

fast and precise placement

of large components.

The SIPLACE MultiStar uses

both the Collect&Place and

the Pick&Place principle.

Mixed Mode allows com-

bined use of these two

modes, which were previ-

ously separated from one

another, in one placement

cycle.

Pick&Place mode (Twin

Head)

The high-precision SIPLACE

TwinStar functions according

to the Pick&Place principle.

Two components are picked

up by the SIPLACE Twin-

Star, optically centered on

the way to the placement

position and rotated into the

required placement angle.

This principle is particularly

suitable for fast and precise

placement of special compo-

nents, such as those

required for grippers etc.

Control and self-learning

functions

The reliability of the

SIPLACE placement heads

can be enhanced even fur-

ther with various checking

and self-learning functions.

• Component sensor

Checks the presence of

the components on the

nozzle before the pickup

and placement process

• Digital camera

Checks the position of

each component on the

nozzle. This check is per-

formed in a single step,

with no extra time involved

but with optimum scan-

ning of each individual

component.

• Force sensor

Monitors the prescribed

component set-down

force.

The sensor stop proce-

dure enables compensa-

tion of height differences

during pickup and PCB

warpage during place-

ment.

• Vacuum sensor

Checks whether the com-

ponent was correctly

picked up or placed.

Collect&Place mode

Pick&Place mode

(SIPLACE MultiStar)

Mixed mode