ASM-SX-V3-设备性能参数-DMS - 第35页

35 Component feeding SIPLACE JTF-M Technical data SIPLACE JTF-M Width 177 mm Height 587 mm JEDEC waffle pack tray specifica- tion Storage capa city W affle pack tray , thin 18 JEDEC w affle pack trays Thick waffle p ack …

Component feeding

SIPLACE JTF-M

The SIPLACE JTF-M is an

automatic and fast changer

for standard JEDEC waffle

pack trays. On SIPLACE

SX1/SX2 machines, a JTF-M

tray feeder can be installed

on a fixed table instead of a

component trolley. The

SIPLACE JTF-M occupies a

fixed area of tracks on the

fixed table.

Depending on the magazine

type, the SIPLACE JTF-M

stores up to 18 thin or 14

thick JEDEC waffle pack

trays in an exchangeable

cassette and supplies them

as required. The placement

machine can therefore be

supplied with different com-

ponent types at variable

changeover times.

JTF-M

Fixed component table

Component feeding

SIPLACE JTF-M

Technical data

SIPLACE JTF-M

Width

177 mm

Height

587 mm

JEDEC waffle pack tray specifica-

tion

Storage capacity

Waffle pack tray, thin 18 JEDEC waffle pack trays

Thick waffle pack tray 14 JEDEC waffle pack trays

Waffle pack tray changeover time

Slot n to n+1 3.5 seconds

Slot 1 to 18 10 seconds

Slot 18 to 1 8.9 seconds

Cassette

Dimensions approx. 330 mm x 150 mm x 230 mm

Max. load capacity 2.7 kg (150 g each for 18 slots)

Pneumatics

5.2 bar to 9 bar

Compressed air consumption

< 28.3 NL/min.

SIPLACE Vision

OnBoard Inspection and Pattern Matching

OnBoard Inspection

The OnBoard PCB Inspec-

tion (SW option) uses the

PCB camera to inspect criti-

cal areas of the board, spec-

ified by the user, e.g. under

BGA or shields just before or

after placement, to make

sure that all components

were placed or to make sure

that there are no objects in

the way of the placement

process.

It is also possible to inspect

the solder paste to make

sure that it is present. How-

ever, this must always be

performed at the first place-

ment machine, before any

placement begins.

A requirement for all inspec-

tion tasks is that a "good pat-

tern" has been saved before

starting.

Pattern Matching

Pattern matching can be

used for components with

very fine contact pads, which

can not be detected with the

existing component camera

resolution. Searching and

detection is performed over a

larger area, which contains

unique structures (patterns).

Once the specified area has

been detected, the compo-

nent is aligned and placed

according to the position of

this area and in relation to the

substrate.