180803_KY8030-3 ENG - 第4页
User Friendl y Softwar e R eal-Time Warp C ompensa tion 3D Mea sur ement Ba sed SM T Pr ocess C ontr ol System Automa ted Solder P a ste Dispensing: Auto-R epair Conveyor Width Adjustment Conveyor Fix Type ● Automatic ● …
The KSMART Process Optimizer assists with real-time communication of monitoring data from
the screen printing processes including insufficient paste, excessive paste, shape deformity ba-
sed on 3D volume and shape measurements, as well as instances of no paste, bridging, and
placement errors.
Real-time alerts prevent print quality problems and monitor printer hardware engagement and
print ready status via Pre DOE, while automatically optimizing printer parameters. It provides
real-time alarms based on printing quality during DOE through PDM Lite and verification of prin-
ting results following application of recommended parameters resulting in significant print quality
improvements and increased yield.
High Speed for Maximum Throughput
By achieving industry-leading inspection speeds of
0.24sec/FOV, KY8030-3 enhances productivity while
speeding up processes.
Using Koh Young’s patented 3D dual-
inspection technology, the KY8030-3
eliminates critical shadow problems all
3D SPI systems are vulnerable to.
Dual Projection Technology
Camera
Projection
light
Projection
light
KY8030-3 adds automated solder paste dispensing as an optional add-on. The high-precision, user-
friendly dispensing system helps to eliminate costly mistakes due in large part to insufficient solder
in open joints, lean fillets, and weak joints. The KY8030-3’s automatic dispensing option repairs
such issues before pass through, resulting in enhanced first pass yield and reduced operational costs.
PCB Warp 3D Display
Z-tracking 3D Compensation
Pad Referencing 2D Compensation
Before Warp
Compensation
After Warp
Compensation
The KY8030-3 module allows for clear three-dimensional visualiza-
tion of SPI-AOI communication to review printing, pick-and-place
and reflow processes. The system traces defects to their origin
and then stores the inspection results from Koh Young’s 3D SPI
and 3D AOI Systems for later use in data review and overview of
the entire production process.
3 Point View
SPC Dashboard Inspection Analysis
The KY8030-3 also comes with a
reliable 3D-Data based Statistical
Process Control which lets manu-
facturers evaluate data using an
intuitive graphic interface.
It also helps increase the speed of root-cause analysis to provide
users with enhanced equipment uptime.
World-Fastest True 3D Solder Paste Inspection
Real-Time Warp Compensation
Automated Solder Paste Dispensing: Auto-Repair
SPC
Link
Test Results Test Results
Small
Sized Pad
BGA
Pad
The KY8030-3’s moiré technology enables realtime
measurement and compensation of board warp, solv-
ing the PCB Warp issues with respect to the ideal
plane that impact inspection accuracy and reliability.
The high-quality IR light provides for automatic for fast
and easy reference teaching even without the CAD file.
Moreover, the KY8030-3 allows manufacturers to match
non-inspection objects (patterns and fiducial marks) on
ideal PCB stencil designs with the ideal PCB pad oca-
tions defined by the CAD file in real time with minimum
hassle.
KSMART: Cutting-Edge Process Optimization Tools for
Smart Factory Realization
KSMART Process Optimizer
Process
Optimizer
The KSMART Process Optimizer assists with real-time communication of monitoring data from
the screen printing processes including insufficient paste, excessive paste, shape deformity ba-
sed on 3D volume and shape measurements, as well as instances of no paste, bridging, and
placement errors.
Real-time alerts prevent print quality problems and monitor printer hardware engagement and
print ready status via Pre DOE, while automatically optimizing printer parameters. It provides
real-time alarms based on printing quality during DOE through PDM Lite and verification of prin-
ting results following application of recommended parameters resulting in significant print quality
improvements and increased yield.
High Speed for Maximum Throughput
By achieving industry-leading inspection speeds of
0.24sec/FOV, KY8030-3 enhances productivity while
speeding up processes.
Using Koh Young’s patented 3D dual-
inspection technology, the KY8030-3
eliminates critical shadow problems all
3D SPI systems are vulnerable to.
Dual Projection Technology
Camera
Projection
light
Projection
light
KY8030-3 adds automated solder paste dispensing as an optional add-on. The high-precision, user-
friendly dispensing system helps to eliminate costly mistakes due in large part to insufficient solder
in open joints, lean fillets, and weak joints. The KY8030-3’s automatic dispensing option repairs
such issues before pass through, resulting in enhanced first pass yield and reduced operational costs.
PCB Warp 3D Display
Z-tracking 3D Compensation
Pad Referencing 2D Compensation
Before Warp
Compensation
After Warp
Compensation
The KY8030-3 module allows for clear three-dimensional visualiza-
tion of SPI-AOI communication to review printing, pick-and-place
and reflow processes. The system traces defects to their origin
and then stores the inspection results from Koh Young’s 3D SPI
and 3D AOI Systems for later use in data review and overview of
the entire production process.
3 Point View
SPC Dashboard Inspection Analysis
The KY8030-3 also comes with a
reliable 3D-Data based Statistical
Process Control which lets manu-
facturers evaluate data using an
intuitive graphic interface.
It also helps increase the speed of root-cause analysis to provide
users with enhanced equipment uptime.
World-Fastest True 3D Solder Paste Inspection
Real-Time Warp Compensation
Automated Solder Paste Dispensing: Auto-Repair
SPC
Link
Test Results Test Results
Small
Sized Pad
BGA
Pad
The KY8030-3’s moiré technology enables realtime
measurement and compensation of board warp, solv-
ing the PCB Warp issues with respect to the ideal
plane that impact inspection accuracy and reliability.
The high-quality IR light provides for automatic for fast
and easy reference teaching even without the CAD file.
Moreover, the KY8030-3 allows manufacturers to match
non-inspection objects (patterns and fiducial marks) on
ideal PCB stencil designs with the ideal PCB pad oca-
tions defined by the CAD file in real time with minimum
hassle.
KSMART: Cutting-Edge Process Optimization Tools for
Smart Factory Realization
KSMART Process Optimizer
Process
Optimizer
User Friendly Software
Real-Time Warp
Compensation
3D Measurement Based
SMT Process
Control System
Automated Solder Paste
Dispensing: Auto-Repair
Conveyor Width Adjustment
Conveyor Fix Type
●
Automatic
●
Front / Rear Fixed (factory setting)
PCB
Handling
●
1D & 2D Handy Barcode Reader
●
1D & 2D Inline Barcode Reader
●
Offline Programming Station
●
Offline SPC Plus Station
●
Standard Calibration Target
●
UPS
●
Remote Monitoring System
●
Pad Referencing
●
Review Station
●
KSMART Process Optimizer
●
Auto-Repair*
Add-on
Solutions
Software
Supported Input Format
Programming S/W
Operating System
Operator User-friendliness
Statistical Process Control Tool
●
Library Manager@KSMART
●
KYCal: Auto-Camera Calibration, Auto-Illumination Calibration
Auto-Height Calibration
●
Windows 7 Ultimate 64bit
●
Remote Monitoring System
●
Gerber Data (274X, 274D), ODB++ (optional)
●
ePM-SPI
●
SPC@KSMART
-
Histogram, X-bar & R-Chart, X-bar & S-Chart, Cp & Cpk, %Gage R&R
-
Real Time SPC & Multiple Display
-
SPC Alarm
※ Above specifications are subject to change without notice.
※ Machine dimensions, PCB size and clearance will change if the Auto-Repair option is selected.
Requirements
Solution to Shadow Problem
Real time PCB Warp Compensation (2D+3D Solution)
Operator User-friendliness
Inspection Range
Foreign Material Inspection
Solutions
●
3D Shadow-Free Moiré Technology & Dual Projection
●
Warp Compensation (Z-tracking + Pad Referencing (optional))
●
Renewal GUI, Real Color 3D Image
●
Up to 2mm (4 Way Projection / optional)
●
3D Foreign Material Inspection
Metrology Capability
Types of Defects
●
Volume, Area, Height, Offset, Bridging, Shape Deformity, Coplanarity
●
Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity, Paste Offset, Coplanarity
Inspection
Items
Camera Resolution
FOV Size
Full 3D Inspection Speed
with High Speed Option
Min. Distance between Paste Deposit
Camera
Illumination
Z Resolution
Height Accuracy (on KY Calibration target)
01005mm Inspection Capacity Gage R&R (±50% tolerance)
Max. Inspection Size
Max. Inspection Height
Min. Distance between PADs
Multi-colored PCB Inspection
●
10×10mm 0.39×0.39 inches
●
400μm 15.75 mils
●
100μm (
based on 150
μm
paste height
)
●
Possible
3.94 mils (
5.91 paste height
)
●
4M Pixel Camera
●
IR-RGB LED Dome Style Illumination (Optional)
●
0.37μm
●
1μm
●
< 10% at 6σ
10μm 15μm 20μm
100μm (3.94 mils) 150μm (5.91 mils) 200μm (7.87 mils)
13.7~43.5 cm²/sec
(Inspection speed varies by PCB and inspection condition.)
16.2 ~ 50.8 cm
2
/sec
(Inspection speed varies by PCB and inspection condition.)
20×20mm(0.79×0.79 inches) 30×30mm(1.18×1.18 inches) 40×40mm(1.57×1.57 inches)
Koh Young Technology Inc. All rights reserved.
Inspection
Performance
Must-check Requirements of 3D SPI System
●
4 Way Projection
●
Panasonic APC
●
Link@KSMART
●
SPC@KSMART
●
IR-RGB Light
08588
+82-2-6343-6000
+82-2-6343-6001
H
W D
F
(Front-Fix)
(PCB Height 950mm)
PCB Transfer Height
870~950mm
1182mm
418mm
167mm
475mm
(PCB Height 950mm From Bottom Clearance)
The World’s Fastest True 3D Solder Paste Inspection Solution
XL
Min. PCB Size
PCB Thickness
Max. PCB Weight
Machine
Weight
W
D
H
M L
Dual Lane
Single Lane
Dual Lane
Single Lane
Dual Lane
Single Lane
Max. PCB Size
(X x Y)
330 X 330 mm
(12.9 x 12.9
inches)
510 x 510 mm
(20.0 x 20.0
inches)
850 x 690 mm
(33.4 x 27.1
inches)
Single Mode:
330x580 mm
(12.9x22.8 inches)
Dual Mode:
330 x 325.5 mm
(12.9x12.8 inches)
Single Mode:
510 x 580 mm
(20.0x22.8 inches)
Dual Mode:
510 x 320 mm
(20.0x12.5 inches)
Single Mode:
850 x 580 mm
(33.4x22.8 inches)
Dual Mode:
850 x 320 mm
(33.4x12.5 inches)
Bottom Clearance
Supplies
L XL
50 x 50 mm (1.9 x 1.9 inches) 70 x 70 mm (2.7 x 2.7 inches)
0.4 ~ 4 mm (0.01 ~ 0.15 inches) 0.4 ~ 5 mm (0.01 ~ 0.19 inches) 0.6 ~ 8 mm (0.02 x 0.31 inches)
Standard: 2 kg (4.4 lbs), Heavy weight option: 5 kg (11.0 lbs) 10 kg (22.0 lbs)
550 kg
(1212.5 lbs)
820mm(32.2 inches)
820mm(32.2 inches)
1265mm(49.8 inches)
1445mm(56.8 inches)
1627mm(64.0 inches)
1000mm(39.3 inches)
1265mm(49.8 inches)
1627mm(64.0 inches)
1350mm(53.1 inches)
1445mm(56.8 inches)
1627mm(64.0 inches)
1350mm(53.1 inches)
1445mm(56.8 inches)
1627mm(64.0 inches)
1000mm(39.3 inches)
1445mm(56.8 inches)
1627mm(64.0 inches)
1627mm(64.0 inches)
600 kg
(1322.7 lbs)
600 kg
(1322.7 lbs)
700 kg
(1543.2 lbs)
50 mm (1.9 inches)
200~240VAC, 50/60Hz Single Phase, 5Kgf/cm
2
(0.45MPa)
850 kg
(1873.9 lbs)
900 kg
(1984.1 lbs)