Essemtec_-_Valves_Portfolio_Flyer_A4_2024.pdf - 第2页
l Strong l Mid l Low - Level of r ecommendation Depending on application, other rec ommendation possible. Medium, substrate, volume & speed, pr ecision & repeatability needs. UNDERFILL GL OBE TOP ENCAPSUL A TION …
Essemtec AG
.
Mosenstrasse 20
.
CH-6287 Aesch/LU
Tel: +41 41 919 60 60
.
essemtec.info@nano-di.com
PIEZO JET
VJV
SHOCKWAVE JET
VDST
VOLUME
VVD
MICRO SCREW
VSR
TIME PRESSURE
VTP
HIGH-SPEED
For a wide range of
applications, special
for adhesives
Viscosity: low-high
Speed
*
~150.000 dots/h
IPC9850A
~60.000 dots/h
HIGH-SPEED
Special for
solder paste
Viscosity: very high
Speed
*
~180.000 dots/h
IPC9850A
~80.000 dots/h
(Estimated)
MEDIUM SPEED
For sealing, gasketing, dam
& ill applications, small to
high volumes
Viscosity: low-high
Speed
*
~28.000 dots/h
IPC9850A
~20.000 dots/h
LOW/MEDIUM SPEED
For all adhesives
& solder paste,
dam applications
Viscosity: medium
Speed
*
~24.000 dots/h
IPC9850A
~18.000 dots/h
MEDIUM SPEED
For simple glue & solder
paste, ill applications,
mid to high volumes
Viscosity: medium
Speed
*
~28.000 dots/h
IPC9850A
~20.000 dots/h
*
Dotmatrix (1000 dots), 1x1 mm grid (0.5 mm dot)
Dispensing speed varies based on board design
l
Strong
l
Mid
l
Low - Level of recommendation
Depending on application, other recommendation possible.
Medium, substrate, volume & speed, precision & repeatability needs.
UNDERFILL GLOBE TOP ENCAPSULATION GASKETING DAM & FILL 3D DISPENSING
DISPENSING
ON FOIL
SOLDER PASTE SILVER EPOXY UV ADHESIVE SMD ADHESIVE
l l l l l l l l l
l
l l l l l l l l l l
l
l l l l l l
l
l l l l l l
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PIEZO JET
VOLUME
SHOCKWAVE JET
SCREW
TIME PRESSURE