PI series 3D SPI-brochure.pdf

1 My cr onic inspec tion solut io ns P I s e r i e s 3 D S P I A c curate so ld e r pa ste in s p ec t ion w it h un prec edented sim plic it y

Mycronic inspection solutions

PI series 3D SPI

Accurate solder paste inspection

with unprecedented simplicity

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Goodbye defects.

Hello solder paste perfection.

What are the most common defects in your SMT line? And what would you

save if you could catch them earlier in your process – or even eliminate them

from your design altogether?

If you’re like most manufacturers, the answers to these questions will likely

bring you back to the solder paste printing process. Because this is where more

than 61% of all SMT defects originate, according to our latest industry survey.

Whether the problem is solder shorts or insu cient solder paste deposits,

accurate solder paste inspection is often the most economical way to detect,

predict and prevent defects before they occur.

As solder paste deposits continue to decrease in size, the value of advanced

SPI analysis will only grow over time. This is precisely what makes the innovative

PI Series 3D SPI system an increasingly critical part of a complete metrology

solution. It allows you to measure paste volume with unmatched accuracy and

unprecedented simplicity. So that you can continually improve your process

and tolerance settings – and take advantage of the unambiguous real-time

information you need to take your yield to new heights.

It’s one more part of the Mycronic 4.0 intelligent factory,

and one step closer to perfection.

France-based Vi TECHNOLOGY, a global pioneer in 3D AOI and

SPI, is now part of the Mycronic Group. Already used by leading

global manufacturers of aerospace, automotive and consumer

electronics, Vi TECHNOLOGY’s inspection solutions o er

a uniquely integrated, accurate and scalable architecture –

an ideal complement to the Mycronic 4.0 intelligent factory.

France-based Vi TECHNOLOGY, a global pioneer

in 3D AOI and SPI, is now part of the Mycronic Group.

Already used by leading global manufacturers of

aerospace, automotive and consumer electronics,

Vi TECHNOLOGY’s inspection solutions o er a

uniquely integrated, accurate and scalable

architecture – an ideal complement to the

Mycronic 4.0 intelligent factory.

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PI series 3D SPI

Perfect solder joints

made simple

Measure paste volume with extreme precision. Improve your

process and tolerance settings with automatic pad grouping.

And monitor your process in real time, both online and o ine.

The PI series gives you highly accurate SPI data, combined

with a range of smart auto-programming functions that ensure

high-quality inspection regardless of operator experience.

ACCURATE Z-REFERENCING TECHNOLOGY

Captures hundreds of references across an

ultra-large 55 x 350 mm 3D ﬁ eld of view.

SIMPLE AUTO-PROGRAMMING

Ensure high-quality inspection regardless of

operator experience with the industry’s only

auto-programming SPI.

REPEATABLE PROCESS RESULTS

Unique warp compensation delivers accurate

measurements in real production environments,

with no false calls.