TDS_InJet_888_CRRD_2F_ENG.pdf - 第2页

InJet ® 888 CRRD – 2F TECHNICAL DATA SHEET 2 www.dct.cleaning GENERAL INFORMATION The InJet ® 888 series cleaning systems represent unique horizontal Spray-In-Air technology developed and manufactured by DCT. Systems wit…

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REFLOW and SOLDERING PARTS cleaning
PCB cleaning
STENCIL, MISPRINT, SQUEEGEE cleaning
www.dct.cleaning
TECHNICAL DATA SHEET
InJet
®
888 CRRD – 2F
www.dct.cleaning
CHAMBER
InJet
®
888 CRRD – 2F 
TECHNICAL DATA SHEET
2
www.dct.cleaning
GENERAL INFORMATION
The InJet
®
888 series cleaning systems represent
unique horizontal Spray-In-Air technology developed
and manufactured by DCT.
Systems with horizontal spraying technology excel in high
pressure and high liquid  ow. Thanks to their large process
chamber they have a large capacity basket, which also
facilitates loading and unloading of the cleaned parts.
The basket can be pulled out of the cleaning chamber on
built-in rails or onto a separate loading and handling trolley.
The InJet
®
888 CRRD-2F including 100% closed loop
with processes of cleaning, pre-rinsing, rinsing and drying
technologies. All of the processes are fully automated, and
take place in one process chamber.
TheInJet
®
888 CRRD-2F is designed primarily for removing
ux residues from soldered boards. It is possible to insert
and clean a stencil or misprints at the same time.
The 2F designation refers to a 2-storey solution where
smaller parts can be cleaned in two baskets simultaneously
to maximize cleaning capacity. After easy removal of the
rotation arm, large parts can be cleaned in one (lower)
basket.
Depending on your cleaning requirements,
the DCT project manager, in collaboration
with a local distributor, will advise you
on a suitable water-based cleaning fl uid
and the correct setup of the entire process.
InJet
®
888 CRRD – 2F 
TECHNICAL DATA SHEET
3
www.dct.cleaning
R
R
D
C
Application
name
Recommended
application
Recommended
temperature
Total cleaning
process time
Capacity
per 8 hours
Re ow and soldering parts
30 – 50°C 86 – 122 °F 40 min. 240 *
PCB
35 – 55°C 95 – 131 °F 60 min. 2016 *
Stencil, misprint, squeegee
20 – 40°C 68 – 104 °F 20 min. 24
4 INDIVIDUAL PROCESSES
CLEANING PARAMETRES
C
R
D
R
CLEANING
PRE–RINSING
RINSING
DRYING
highly recommended recommended applicable
* PCB eurocards / per 8 hours (calculated for dimension of 100 x 160 mm / 3.94 x 6.3 in)
* * Parts in soldering palette / per 8 hours (320 x 500 x 50 mm / 12,6 x 19,7 x 1,97 in)
* * * Stencils, pumpprints larger than 736 x 736 mm / 29 x 29 in
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