Power-C-November-2020.pdf - 第2页
For sales, service and manuf acturing locations, visit www .kns.com © 2020 K ulicke & So a Industries, Inc. Specifications may change without notice . The Po wer-C logo , Pow er-C, K&S logo, and K ulicke & So…
Dedicated Wedge Bonder for Single-Row TO Package
Power-C
TM
Wedge Bonder is built specifically for single-row TO package power devices. These bonders
are driven by proven and powerful direct-drive motion systems, bondheads, ultrasonic generator systems
and wire feeding mechanisms, that are on the PowerFusion
TM
and Asterion
TM
platforms. In addition,
expanded pattern recognition capabilities deliver industry leading productivity and reliability.
Key Features
Productivity
Horizontal Moving Anvil
▪
Robust clamping solution for single-row TO application
▪
Horizontal Anvil movement supports leads including overhanging leads
▪
Clamping scheme similar to Orthodyne M360CHD model
Improved MTBA with Enhanced Pattern Recognition
▪
Improved Hardware
▫
High resolution digital camera
▫
Improved Optics - image clarity
▫
Co-axial ring light - less susceptible to die tilt
▪
Enhanced Pattern Recognition Modes - Feature Find Mode
▫
Robust & easy to program
▫
Less line stoppages despite surface variations
Bond Quality Control and Assessment
▪
Multi-segment bonding for enhanced process control on sensitive dies
▪
Bonded device review enables visual bond assessment
▫
Turn on / off on the go
▫
Displays up to 9 images
▪
Bond head ALC non-destructive pull test
▪
In-line non-destructive pull test system - supports maximum 4x per bond head
▪
Bond Process Monitoring (BPM) enables monitoring within defined limits
Ease of Use
▪
Gaugeless wedge tool replacement
▫
Consistent tool replacement
▪
Global parameter change
▫
Change specific bond parameters across multiple process programs with
the click of few buttons
Maintenance & Reliability
▪
Reduced maintenance
▫
X, Y, Z & T direct drive servo system with fewer moving parts
▪
Better accessibility with modular design
▪
Proven field performance
For sales, service and manufacturing locations, visit www.kns.com
© 2020 Kulicke & Soa Industries, Inc. Specifications may change without notice.
The Power-C logo, Power-C, K&S logo, and Kulicke & Soa are trademarks of
Kulicke & Soa Industries, Inc.
WB-013-11/2020
Enhancements
Specifications
Name
Power Requirement
Compressed Air
Foot Print
Weight
X, Y Axis
Bond Area (X x Y)
Z Axis
Theta
Wire Range and Material
Vision System
Pattern Recognition Modes
Magazine Size (Length x Width x Height)
Leadframe Size (Length x Width x Thickness)
Downset
L/F Positioning Repeatability
Clamp Station
Inline Pull Tester
Bond Head Pull Test
Power-C
Electrical 180-240 VAC, Single Phase, 50/60HZ, 4.0kVA
85 liter/min, 5.5 bar, Clean Dry Air
1,828mm x 1,219mm x 1,676mm
800kg
Linear Motors, 0.1μm Resolution
80mm (X) x 68mm (Y)
Voice Coil, 0.1μm Resolution; 50mm Z-Stroke
Direct Drive; ±220°, 0.0057° Resolution
4mil - 20mil; Al Wire
GS4 Pattern Recognition System
Feature Find, Single Point PR with Angle
115 - 305mm (L) x 20 - 115mm (W) x 50 - 200mm (H)
110 - 300mm (L) x 15 - 50mm(W) x 2mm max. (T)
3mm Max.
±35μm @ 3 sigma
Horizontal Moving Anvil (HMA)
1x per Transport (Standard)
Yes (ALC Bond Head)
Horizontal moving anvil
Robust Pattern Recognition system
Bonded Device ReviewMulti-Segment bonding feature
▪ Graphical Tooling Setup Aid option reduces tooling setup time and improves clamp positioning
▪ Bond Porcess Monitoring (BPM) verifies bonding process consistency
▪ SECS-GEM option for factory automation and communication
▪ Non-destructive Pull Testers for bond quality checks
▪ Leadframe and magazine orientation kits to minimize operator error during material loading
Configurable Options
Non-Destructive Pull Testers Maximum 4x per Transport
Graphical Tolling Setup Aid License Dongle Needed
SECS-GEM G84, E142 Compatible
License Dongle Needed
Bond Process Monitoring (BPM) License Dongle Needed
Tooling Kit Universal Tooling Kit
Leadframe Orientation Sensor Hardware Part Add on
Magazine Orientation Kit Hardware Part Add on
Options