ATPremier_PLUS_Brochure.pdf - 第2页

For sales, servic es and manufacturing locations, visit: www .kns. com © 2017 Kulick e & Soffa Industries, Inc. Specifications ma y change without notice. The A TPr emier PLUS logo, A TPr emier PLUS, K&S logo and…

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The Power Series of
Semiconductor Assembly
Equipment from K&S has
established itself as the
leading capability in
package assembly. These
products reinforce two key
principles, the Powerful
performance built into these
products, and the Power
of K&S as the Technology
Leader of its market space
for more than five decades.
The Power Series has set
new standards for
performance, productivity,
upgradeability, and ease of
use. The technical success
and customer acceptance
of the Power Series products
since their introduction are
evidence of the K&S continued
commitment for providing
products with the Power to
handle not only today’s most
challenging packaging
applications, but also
tomorrow’s.
From K&S —
the most Powerful name in
Package Assembly.
The ATPremier
PS
PLUSTM is another
extension of the successful Power
Series platform. The superior wafer
level stud bumping and wire
bonding of the ATPremier PLUS
delivers high productivity with
increased eciency.
Wafer Level Bonder
Features
▪ Able to bond up to 300 mm diameter wafers,
ceramics or substrates
▪ Bond Placement Accuracy
- ± 3.5 μm @ 3 sigma (200 mm work piece)
- ± 5.0 μm @ 3 sigma (300 mm work piece)
▪ Power Series Advanced Hardware and
Software controls
▪ Best-in-Class Low Temperature Gold Bumping
▪ Improved Serviceability with easy access to
lower console
▪ Programmable Power Supply System with
back-up
▪ Upgradeable Capabilities
- Optional Copper or Silver Allow capability
and kits
- Optional Wafer Level Wire Bonding
capability
▪ Smallest footprint in the market
For sales, services and
manufacturing locations, visit:
www.kns.com
© 2017 Kulicke & Soffa Industries, Inc. Specifications may change without notice.
The ATPremier PLUS logo, ATPremier PLUS, K&S logo and Kulicke & Soffa are trademarks of Kulicke & Soffa Industries, Inc.
ATP-001-08/2017
Power Series
Wafer Level Bonder include:
User interface that retains the
familiar K&S look and feel;
minimal training needed to
become familiar with new
performance enhancing and
productivity increasing features
Semi E10 Compliance for
Run Time Statistics and
MTBA / MTBF calculations
Programmable Power Supply
System to bond through factory
power spikes or dips
Optional standalone
Wafer Mapping SW capability
PROCESS CAPABILITY
Pitch
50 μm in-line @ 3 sigma
Total Bond Placement Accuracy
± 3.5 μm @ 3 sigma (200 mm work piece)
± 5.0 μm @ 3 sigma (300 mm work piece)
Standard User Processes
Standard Bump
AccuBump
Stack Bump
Bump Height Variation
AccuBump: ± 3 μm @ 3 sigma
Standard Bump: ± 15 um @ 3 sigma
Optional Process Loops (Wire Bonding)
Standard Forward Loop
Stand o Stitch Bump (SSB)
Security Loop / Bump
Vertical Wire
Maximum Wire Length
5.0 mm
Minimum Loop Height
100 μm Forward Loop
70 μm SSB (reverse loop)
Wire Sway
Wire Length < 2.54 mm: 25 μm @ 3 sigma
Wire Length > 2.54 mm: ± 1 % wire length @ 3 sigma
MATERIAL HANDLING CAPABILITY
BARE WAFER / SUBSTRATES / WAFER IN FRAME /
RECONSTRUCTED
Diameter: 50 mm - 300 mm
Min. thickness: 75 μm
(Min. thickness varies with manual or auto wafer
loading. Thickness can be < 75 μm with wafer
mounted on frame)
MAN-MACHINE INTERFACE
Monitor
17” color LCD display
Durable Control Panel
with function keys and dedicated buttons, and
user-friendly mouse
Compatibility
ATPremier bond programs are upwardly compatible
Industry-Recognized User Interface
Simple pull-down menus. Color-overlays of wire
groups for easy programming and teach
FACILITY REQUIREMENTS
Minimum Air Pressure
3.52 kg / sq cm (50 psi)
Nominal Air Consumption (flow rate)
185 liters / min @ 4.6 kg / sq cm (6.5 CFM @ 65 psi)
Input Voltage
Standard
200 to 240 VAC; - 15 % to + 10 %
Single Phase 50 / 60 Hz (± 3 Hz)
Optional
100 to 115 VAC; - 15 % to + 10 %
Single Phase 50 / 60 Hz (± 3 Hz)
Power Consumption
2.0 KVA (nominal), 2.4 KVA (max.)
Footprint
780 mm wide x 1118 mm deep (31” x 41”)
Weight (estimated)
Machine 680 kg (1499 lbs)
Machine & Crate 770 kg (1698 lbs)
Wafer Level Bonder