MX3000-8028202-Rev_A.pdf - 第2页

Multi-Reec tion Suppr ession (MRS) T echnology MX3000™ oers unmat ched accuracy with the revolutionary MRS technology by meticulously identifying and r ejecting reections caused by shiny c omponents and reective sold…

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MX3000™ 3D AOI
Contact CyberOptics today for more information
+1 800.366.9131 or +1 763.542.5000 | CSsales@cyberoptics.com | www.cyberoptics.com
Copyright © 2019. CyberOptics Corporation. All rights reserved. Specications subject to change without notice. 8028202 Rev A
MX3000
™
Automated Final Vision Inspection
The Ultimate in Speed and Accuracy for Memory Module Inspection
Inspection Capabilities
Inspection Speed 50 cm
2
/sec (2D+3D)
Minimum Component Size 0402 mm (01005 in.)
Board Length Min. 25 mm / Max. 140 mm
Board Width Min. 17 mm / Max. 35 mm
Component Height Clearance (max) 35mm
Component Types Inspected Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header
pins, and more
Solder Joint Defects Categories Solder bridge, opens, lifted leads, wettability, excess and insucient solder, debris, and more
3D Measurement inspection Lifted lead, package coplanarity, polarity dimple and chamfer identication
Other Items Detected Gold-nger contamination, pin-in-hole, bent pins, debris, OCR/OCV and many others
Component Measurement
Categories
Component X, Y position and Rotation
Vision System
Imagers Multi-3D sensors
Image Transfer Protocol PCIe
Resolution Sub 10 µm
Image Processing Autonomous Image Interpretation (AI²) Technology, coplanarity and lead measurement
Programming Simple inline or oine
CAD Import
Any column separated text le (Standard information required - ref designator, XY, Angle, Part no.,)
System Specications
Power Requirements AC 220V, 3 phase, 60 Hz, 4 wire, Amp: 50A
System Dimensions 2.69m x 2.83m x 2.38 m (W x D x H)
Weight 4.0 tons
Options
SPC Software, Alignment Target, Tray Loader/ Unloader Elevated Card, 2nd Review Station
Front Side
Powered by
MRS Technology
Powered by
2
MRS Sensors
Simultaneous Dual-Sided 3D Inspection with
Inline Multiple Module Gripper to Minmize
Handling Tact Time.
Multi-Reection Suppression (MRS) Technology
MX3000™ oers unmatched accuracy with the revolutionary MRS
technology by meticulously identifying and rejecting reections caused
by shiny components and reective solder joints. Eective suppression
of multiple reections is critical for highly accurate measurements
making MRS an ideal technology solution for a wide range of
applications including those with very high quality requirements.
Flexibility At Its Best
The MX3000™ 3D Automated Optical Inspection (AOI) system
enables high resolution, dual-sided nal vision inspection that
doubles productivity. In-line multiple module grippers minimize
handing tact time, and autoconversion supports various memory
module form factors (RDIMM, SODIMM, VLPDIMM, UDIMM and
others.)
The system provides in-line defect review stations and auto sorts
false calls into good trays after review, is fully automation-ready,
SECS/GEM and S2/S8 compliant.
Post-test defect types and pre-shipping inspection capabilities
include:
- Components Edge
- Damaged PCB Corner
- Goldnger Discolored / Burnt / Badly Scratched
- Gold Tab Inspection - Lifted Tie Bar, Burnt, Contamination
- Physically Damaged Components
MX3000
™
The Ultimate in Speed and Accuracy
High Precision Accuracy with Multi-Reection
Suppression (MRS) Sensor Technology
The MX3000™ is powered by CyberOptics’ breakthrough 3D sensing
technology comprising of two MRS Sensors delivering simultaneous
dual-sided automated nal vision inspection for singulated memory
modules - for metrology grade accuracy at production speed.
CyberOptics’ unique sensor architecture simultaneously captures
and transmits multiple images in parallel while proprietary 3D fusing
algorithms merge the images together. The result is ultra-high quality
3D images and high-speed inspection.
Faster, Smarter Programming
With ultra-fast programming capabilities, auto tuning
and other enhancements, CyberOptics’ AOI software
signicantly speeds set-up, simplies the process,
reduces training eorts and minimizes operator
interaction.
AI
2
(Autonomous Image Interpretation) technology is
all about keeping it simple - no parameters to adjust
or algorithms to tune. And, you don’t need to
anticipate defects or pre-dene variance either - AI
2
does it all for you.
With AI
2
, you have the power to inspect the most
comprehensive list of features and identify the widest
variety of defects. AI
2
oers precise discrimination with
just one panel inspection making it a perfect solution
for high-mix and high-volume applications.
Fast, Scalable SPC Solution
CyberReport™ oers full-edged machine-level to
factory-level SPC capability with powerful historical
analysis and reporting tools delivering complete
traceability for process verication and yield
improvement. CyberReport™ is easy to setup and simple
to use while providing fast charting with a compact
database size.
Factory-level SPC
Line-level SPC
Machine-level SPC
Yield
Intuitive, Easy-to-Use Software
The MX3000™ software is a powerful yet extremely simple
design with an intuitive interface that reduces training eorts
and minimizes operator interaction – saving time and cost. The
software includes multi-touch controls and 3D image visualization
tools, taking ease-of-use to a whole new level.
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
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PRINTOPTIMIZER
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PRINTOPTIMIZER
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
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PRINTOPTIMIZER
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