SQ3000-DD-8025061-Rev_F.pdf - 第2页
Multi-Reec tion Suppr ession (MRS) T echnology SQ3000-DD™ oers unmat ched accuracy with the revolutionary MRS technology by meticulously identifying and r ejecting reections caused by shiny c omponents and reective s…
SQ3000-DD™ 3D AOI
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+1 800.366.9131 or +1 763.542.5000 | CSsales@cyberoptics.com | www.cyberoptics.com
Copyright © 2018. CyberOptics Corporation. All rights reserved. Specications subject to change without notice. 8025061 Rev F
SQ3000-DD
™
3D AOI
The Ultimate in Speed and Accuracy
Dual Lane - Dual Sensor Inspection System
Powered by
MRS Technology
Powered by
2
MRS Sensors
Inspection Capabilities MRS Sensor Ultra High Resolution MRS Sensor
Inspection Speed 40 cm
2
/sec (2D+3D), High Speed option
available: 50 cm
2
/sec (2D+3D)
15 cm
2
/sec (2D+3D)
Minimum Component Size 0402 mm (01005 in.) 0201 mm (008004 in.)
PCB Size (Max.) Single Lane: 510 x 510 mm (20 x 20 in.)
Dual Lane: 510 x 330 mm (20 x 13 in.)
Component Height Clearance Top: 50 mm
Bottom: 35 mm
PCB Thickness 0.3 - 5 mm
Component Types Inspected Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips,
connectors, header pins, and more
Component Defects Missing, polarity, tombstone, billboard, ipped, wrong part, gross body and lead damage,
and more
Solder Joint and Other Defects Gold nger contamination, excess solder, insucient solder, bridging, through-hole pins
3D Measurement Inspection Lifted Lead, package coplanarity, polarity dimple and chamfer identication
Measurement Gage R&R <10% @ ±3σ (±80 µm process tolerance)
Z Height Accuracy 1 µm on certication target
Z Height Measurement Range 6 mm at spec, 24 mm capability 3 mm at spec, 10 mm capability
Vision System & Technology
Imagers Multi-3D sensors
Resolution Sub 10 µm 7 µm
Image Processing Autonomous Image Interpretation (AI
2
) Technology, Coplanarity and Lead Measurement
Programming Time <15 minutes (for established libraries)
CAD Import Any column-separated text le with ref designator, XY, Angle, Part no info; Valor process
preparation
System Specications
Machine Interface SMEMA, RS232 and Ethernet
Power Requirements 100-120 VAC or 220-240 VAC, 50/60 hz, 10 amp max.
System Dimensions 170.5 x 162 x 152 cm (W x D x H) Height excludes signal-light pole and leveling feet
Weight ≈1596 kg (3519 lbs.)
Options
Barcode Reader, Rework station, SPC Software, Alignment Target
Standard SQ3000, SQ3000-X (Large Board Capability), and SQ3000-D (Dual Lane) models available
Front Side
Multi-Reection Suppression (MRS) Technology
SQ3000-DD™ oers unmatched accuracy with the revolutionary MRS
technology by meticulously identifying and rejecting reections caused
by shiny components and reective solder joints. Eective suppression of
multiple reections is critical for true height measurement making MRS
an ideal technology solution for a wide range of applications
including those with very high quality requirements.
CyberOptics has advanced the proprietary Multi-Reection
Suppression (MRS) sensor to an even ner resolution.
The Ultra-High Resolution MRS sensor enhances the
SQ3000-DD™ 3D AOI platform, delivering superior
inspection performance, ideally suited for the 0201 metric
process and micro-electronic applications where an even
greater degree of accuracy and inspection reliability is
critical.
Flexibility At Its Best
The SQ3000-DD™ 3D Automated Optical Inspection (AOI) System is an
extension of the award-winning SQ3000™ 3D AOI platform. The dual
lane, dual sensor system maximizes exibility catering to varying PCB
widths. This unique design provides the ability to inspect high volume
assemblies, the convenience of inspecting dierent assemblies and
board sizes simultaneously on dierent lanes, or even switching from
dual lane to single lane mode to inspect very large boards.
Not only does the SQ3000-DD™ provide PCB exibility, it also provides
the exibility to choose two of the same or two dierent proprietary
MRS sensors.
SQ3000-DD
™
The Ultimate in Speed and Accuracy
High Precision Accuracy with Multi-Reection
Suppression (MRS) Sensor Technology
The SQ3000-DD™ is powered by CyberOptics’ breakthrough 3D sensing
technology comprising of two MRS Sensors delivering metrology
grade accuracy at production speed. CyberOptics’ unique sensor
architecture simultaneously captures and transmits multiple images
in parallel while proprietary 3D fusing algorithms merge the images
together. The result is ultra-high quality 3D images and high-speed
inspection.
Billboard
Lifted Leads Insucient Solder
AI
2
- Faster, Smarter Programming
AI
2
(Autonomous Image Interpretation) technology is all about keeping it simple - no parameters to adjust
or algorithms to tune. And, you don’t need to anticipate defects or pre-dene variance either - AI
2
does it
all for you. With AI
2
, you have the power to inspect the most comprehensive list of features and identify the
widest variety of defects. AI
2
oers precise discrimination with just one panel inspection making it a perfect
solution for high-mix and high-volume applications.
Fast, Scalable SPC Solution
CyberReport™ oers full-edged machine-level to
factory-level SPC capability with powerful historical
analysis and reporting tools delivering complete
traceability for process verication and yield
improvement. CyberReport™ is easy to setup and simple
to use while providing fast charting with a compact
database size.
Factory-level SPC
Line-level SPC
Machine-level SPC
Yield
Intuitive, Easy-to-Use Software
The SQ3000-DD™ software is a powerful yet extremely simple
design with an intuitive interface that reduces training eorts
and minimizes operator interaction – saving time and cost. The
software includes multi-touch controls and 3D image visualization
tools, taking ease-of-use to a whole new level.
510 mm (20”)
510 mm (20”)
330 mm (13”)
330 mm (13”)
510 mm (20”)
510 mm (20”)
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER