Viscom_Brochure_AXI_X7056-II_en.pdf - 第2页
3D A OI vie w in the A OI/ AXI combined inspection V ersatile, High-P ower 3D Inspection V er sion as 3D AXI system or 3D AXI / 3D A OI combination X-ray inspection with resolution as low as 6 µm High-pow er 3D A OI came…
X7056-II
xFastFlow Option
WINNER
Winner of the
innovation award 2017
3D AXI/3D AOI
3D AXI
In-Line X-ray and
Optical Inspection for
High-End Electronics Production
3D AOI view in the AOI/
AXI combined inspection
Versatile, High-Power 3D Inspection
Version as 3D AXI system or
3D AXI / 3D AOI combination
X-ray inspection with
resolution as low as 6 µm
High-power 3D AOI
camera technology
Handling with xFastFlow
in down to 4 seconds
Simple, intuitive operation
with vVision or EasyPro
High-quality 3D AXI volume
calculation with planar CT
Faster inspection program optimiza-
tion through optimum 3D analysis
Versatile configuration
with different FPD sizes
Remote maintenance, hotline and on-site
service, competent and worldwide
Extremely fast handling,
first-class inspection quality
In safety-relevant areas of electronics production such as the automotive and
aerospace fields, the requirement to inspect the full scope of electronics as-
semblies instead of just as random samples is common. For hidden solder
joints, in-line X-ray is the ideal solution for the task. Consumer electronics
production presents another trend: Like with automatic optical inspection,
the ever-denser assembly, often on both sides, requires wide application of
3D inspection. In the X-ray inspection area, planar computed tomography is
successfully used for this.
Surface soldering
with voids
Slice image of a printed
circuit board section
with BGA
Head-in-pillow defect on
BGA component
2D image of a BGA:
Structures from the back side
are present in the image
3D image of a BGA:
Slice image with no
interfering structures
Comparison of 2D and 3D X-ray:
Trailblazing X-ray technology
and ultra-modern
XM camera technology in one system
The in-line X-ray system X7056-II is primarily distinguished by high throughput and
first-class 3D image quality. Its hardware components include high-performance
flat panel detectors (FPD) available in different sizes. Different FPD configura-
tions, e.g., with xy-table, can be selected for versatile 3D image acquisition
positions. The resolution range is from 6 to 32 µm/pixel. The revolutionary
xFastFlow handling concept cuts time for automatic printed circuit board
changes down to 4 seconds. Inspection depth and throughput can be op-
timally adapted to meet individual requirements. It is also possible to
combine 2D and 3D inspections on one PCB.
3D reconstruction with the X7056-II is based on planar CT. For com-
plex overlapping, as is virtually the rule with printed circuit boards
assembled on both sides, leveraging the superb three-dimensional
inspection possibilities offered by the system makes all significant
features sharply visible in
clear slice images to enable precise
evaluations – even for shadowing by components or on multi-layer
boards. This means false calls are effectively prevented while
inspection program creation is simplified.
The X7056-II reliably detects defects such as air inclusions
(voids), bridge, HiP (head in pillow) and others. The Viscom user
interfaces vVision and EasyPro can be selected for system
operation. Viscom Quality Uplink enables very effective
networking and process optimization. Statistical process control
is ideally realized with Viscom SPC.
The X7056-II can be upgraded to a combined solution with
additional 3D AOI. With this approach, a single system can be
deployed for different inspection tasks, covering practically all typ-
ical defect types. In addition to more open production area comes
the advantage of uniform operation. The proportion of 3D AXI to
3D AOI can be individually determined depending on requirements.
The same technical high-end options already successfully used
around the world in pure 3D AOI systems from Viscom, such as the
S3088 ultra, are available for equipping the X7056-II with an optical
component.