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For sensitive components Individually programmable placement process with touchless pickup and zero-force placement Die crack/die chipping detection For minimal dpm rates: The vision system recognizes even the nest com…
A MILESTONE FOR ADVANCED PACKAGING
AND HIGH-DENSITY APPLICATIONS
With the SIPLACE TX micron, you run advanced packaging and high-den-
sity applications with the performance of state-of-the-art SMT technology
(up to 96,000 cph) and unprecedented precision. Three precision classes
in a single machine: 25, 20 and 15 µm @ 3 σ with placement pitches of as
little as 50 µm. The performance and upgradeability of the SIPLACE TX
micron protect your investment.
Smart features such as die crack inspection and die chipping detection
ensure the highest yields and maximum productivity.
FASTER AND MORE ACCURATE
SIPLACE TX micron
SIPLACE SpeedStar
▪ Component spectrum: 0201metric to
8.2 mm × 8.2 mm × 4 mm
▪ For the most sensitive components:
Thin dies with heights up to 50 µm
(minimum height)
▪ Extremely fast: Up to 48,000 cph
▪ Extremely precise: Up to ±15 µm @ 3 σ
SIPLACE MultiStar
▪ Switches from pick-and-place to
collect-and-place to mixed mode
based on software commands
▪ Component spectrum: 0402 metric
to 27 × 27 mm x 6 mm
▪ High speed: Up to 23,850 cph
▪ Extremely precise: Up to ±20 µm @ 3 σ
TWO
PLACEMENT HEADS
HIGHLY PRECISE AND ULTRA-FLEXIBLE
The entire placement process can be programmed in detail for
each component and placement position – including touchless
pickup and zero-force placement.
NEW
For sensitive components
Individually programmable placement process with
touchless pickup and zero-force placement
Die crack/die chipping detection
For minimal dpm rates: The vision system recognizes
even the nest component damage and hairline
cracks without slowdowns.
Vision system with blue light
High-contract images of even the smallest
components (01005, 0201m) and diff erentiation
of special characteristics (copper pillars)
Maximum performance
With its two gantries and innovative placement
modes, the SIPLACE TX micron reaches
speeds of up to 96,000 cph.
Flux detection/inspection
Optical control ensures high yields when
using dipping units.
Cleanroom certifi cation
Class 7 certi cation as per
DIN EN ISO 14644-1 and SEMI S2/S8.
FOR SENSITIVE COMPONENTS:
MAXIMUM PRECISION
PERFECT COMPONENT SUPPLY
NEW
SMART FEEDERS
PERFECT INTERACTION
With its many innovations, the SIPLACE TX micron overcomes traditional
placement accuracy limitations. Its perfect interaction of temperature-resis-
tant glass scales, ducials, high-resolution optical sensors and innovative
vacuum toolings ensures extremely precise positioning while delivering
maximum performance. Your gain: Maximum quality and productivity even
for extremely small components and the tightest component pitches with
maximum accuracy.
MANY INNOVATIONS:
ACCURACY BY DESIGN
SIPLACE Smart Feeder Xi
▪ New 4-mm, 8-mm and 2 × 8-mm
feeder modules
▪ Microtape-ready
▪ Ready for pickup: Vacuum ensures
level blister pocket bottoms for faster,
more accurate component pickups
PERFECT COMPONENT SUPPLY
(
More about
SIPLACE TX
micron
SIPLACE TX micron
www.asm-smt.com
SIPLACE TX micron
The new standard in advanced production
Advanced packaging, one of today’s key technologies in elec-
tronics production, blurs the lines between semiconductor
production/OSATs, IDMs, and demanding SMT applications. In
times of rising time, cost and eciency pressures, the produc-
tion of SiPs and SoCs as well as the processing of dies and
ip-chip modules on high-precision SMT platforms is becoming
more common every day. With the SIPLACE TX micron you
can use the performance of state-of-the-art SMT technologies
in advanced packaging and high-density applications to replace
signicantly less ecient bonding solutions.
As the world's largest supplier to the electronics industry, ASM
serves the backend segment for semiconductor manufactur-
ers and OSATs as well as classic SMT production facilities. The
development of the new SIPLACE TX micron was based on de-
cades of experience and the latest technologies from both elds
to raise advanced packaging and high-density applications to a
new level of productivity.
YOUR TECHNOLOGY PARTNER FOR
ADVANCED PACKAGING
ASM Assembly Systems GmbH & Co. KG
Issue 1/02-2021 | All rights reserved | Order No.: A10011-ASM-135-EN | Printed in Germany | © ASM Assembly Systems GmbH & Co. KG
The information in this brochure consists only of general descriptions and/or performance features which may not always apply to concrete
products as described or which may change as a result of technical developments or advances. Any specific performance features and/or
capabilities will only be binding if contractually agreed upon. All product names are brands or trademarks of ASM Assembly Systems GmbH & Co.
KG or other suppliers. Their use by third parties may violate the rights of their owners.
Placement heads SIPLACE SpeedStar (CP20M3) SIPLACE MultiStar
Speed (benchmark rating)
Up to 48,000 cph Up to 23,850 cph
Component spectrum
0.12
× 0.12 mm to 8.2 × 8.2 mm* 0.11 × 0.11 mm to 27 × 27 mm**
Min. lead pitch 70/50* µm 120 µm
Min. lead width 30/25* µm 50 µm
Min. ball pitch 100/50* µm 140 µm
Min. ball diameter
50/25* µm 70 µm
SIPLACE TX micron
Speed (benchmark rating) Up to 96,000 cph
Placement accuracy (3 σ) Up to 20 µm Up to 15 µm
PCB dimensions
(L x W)
50 mm × 45 mm to 375 × 260 mm (dual-lane mode)
50 mm × 45 mm to 375 × 460 mm (single-lane mode)
50 mm × 55 mm to 250 × 100 mm
Machine dimensions
(L x W x H) 1.00 m × 2.23 m × 1.45 m
Component supply Up to 80 8-mm feeders, JEDEC trays
Power consumption (avg.)
2.0 kW for SIPLACE TX2i micron with CP20M3 (1.2 kW for SIPLACE TX2 micron with CPPM)
Air consumption 120 Nl/min (2 x SIPLACE SpeedStar)
Certifications Semi S2/S8, Clean Room Class ISO 7
Data interfaces IPC-HERMES-9852, IPC-CFX, IPC-SMEMA-9851
* With optional high-resolution camera (SST49) with blue light
** With optional high-resolution camera (SST30)