RAPID-MEM.pdf - 第2页
For more inf ormation, contact your local authorized K &S sales representativ e or visit www .kns.com © 2019 K ulicke & Soa Industries Inc. All specifications subject t o change without notice. T rademarks used h…
Enabling a Smart Future.
RAPID™ MEM introduces advanced process
capabilities, real-time monitoring and diagnostics to
ensure the best quality and ecient assembly
serving high-performance and high-reliability
semiconductor applications.
RAPID™ MEM is a K&S GEN-S Series Automatic
Bonder engineered to enable Industry 4.0
communication and is RoHS compliant.
KEY FEATURES
• Real-time Process & Performance Monitoring
• Equipment Health Monitoring
• Advanced Data Analytics & Traceability
• Predictive Maintenance Monitoring & Analysis
• Detection & Enhanced Post bond Inspection
• Latest Response Based Processes
- ProAu-2, ProAg-2
- PSP-Ag
- ProOverhang
- Multi-Stitch Bonding
AUTOMATIC WIRE BONDER
K&S SMART SERIES: GEN-S
The GEN-S Series of Ball
Bonders from K&S is a brand
new series of equipment
succeeding the Power Series
lines of bonding equipment.
In addition to its superior capability in wire bonding,
the GEN-S Series of bonders marks the
introduction of Smart bonding equipment.
Real-time Process Monitoring Equipment Health MonitoringDefect Traceability
For more information, contact your local authorized K&S sales representative or visit www.kns.com
© 2019 Kulicke & Soa Industries Inc. All specifications subject to change without notice.
Trademarks used herein are the property of Kulicke & Soa Industries, Inc. or their respective owners.
BB-035-07/2019 (rev)
WIRE BONDING CAPABILITY
Ultra Fine Pitch
35 μm inline bond pad pitch
Wire Size
0.6 mil to 2.5 mil Cu, Ag, or Au wire
Note:
Cover Gas Kit needed for Cu or Ag wire
Heavy Wire Kit needed for wire diameter > 2.0 mil
Bonding Area
X Axis: 56 mm
Y Axis: 80 mm (Standard), 87 mm (LA), 90 mm (ELA)
Total Bond Placement Accuracy
2.0 μm @ 3 sigma
Pattern Recognition/Optics/Vision
Higher Resolution Progressive Scan Vision System
CCD Camera
• Dual Magnification Optics (standard: 2x & 6x)
• Programmable Focus for High Magnification
Advanced Process Capability
ProAu-2 and ProAg-2
ProStitch PLUS-Ag
ProOverhang
Multi-Stitch Bonding with Full Missing Bond Detection
Program Compatibility
Compatible with all standard processes from existing models
Process programs are NOT backwards compatible. Programs taught
on a new bonder model will not run on an older bonder.
LOOPING CAPABILITY
Maximum Wire Length
7.6 mm with 1.0 mil wire
3.0 mm with 0.6 mil wire
Minimum Loop Height
Ultra-low loop with Power Series Low Loop
40 μm with 0.6 mil wire
Wire Sway
Wire length ‹ 2.54 mm: 25 μm @ 3 sigma
Wire length › 2.54 mm: ± 1% wire length @ 3 sigma
SET UP & CONVERSION TIMES
If Wire Type remains unchanged, the time estimated below applies.
If Wire Type changes, the time estimated would be doubled.
Same Leadframe Type: ‹ 4 min
Heat block insert & clamp changes, program load from disk
Dierent Leadframe Type: ‹ 8 min
Leadframe width & length changes, magazine size change, heat
block insert & clamp change, program load from disk
CONNECTIVITY ENHANCEMENTS
Standard – K&S Connect
K&S Connect enables automatic transfer of data generated by RPM
for future traceability.
Optional – KNet PLUS
KNet PLUS improves eciency and productivity, by monitoring
equipment status in real-time. It collects data and controls process
programs locally or from anywhere on a customer’s network.
Contact your K&S Sales Representative to learn more.
MATERIAL HANDLING CAPABILITY
Package/Leadframe Dimensions
Length: 90 to 300 mm
(L/F shorter than 100 mm will
require optional injector kit and
short magazine kit)
Width: 15 to 92 mm (Standard)
15 to 95 mm (LA)
25 to 100 mm (ELA)
Thickness: 0.10 to 0.9 mm
(L/F thicker than 0.9mm will require
optional Flat Boat Kit)
Die Pad Downset: Up to 2.3 mm
Magazine Dimensions
Width: 20 to 110 mm
Length: 127 to 305 mm
Height: 50 to 178 mm
Slot Pitch: 1.27 to 25 mm
Max. Weight: 5.22 kg
MAN-MACHINE INTERFACE
Monitor
21.5" color LCD display
Durable Control Panel
Function keys and dedicated buttons, and user-friendly mouse.
Industry-Recognized User Interface
Simple pull-down menus. Color-overlays of wire groups for easy
programming and teach.
FACILITY REQUIREMENTS
Minimum Air Pressure
3.52 kg/sq cm (50 psi)
Nominal Air Consumption (flow rate)
185 liters/min @ 4.6 kg/sq cm (6.5 CFM @ 65 psi)
Cover Gas Consumption for Cu & Ag wire bonding (flow rate)
Minimum 0.6 liters/min
Maximum 1.5 liters/min
Nominal 1.1 liters/min
Input Voltage
Standard
200 - 240 VAC; - 15% to + 10%
Single Phase 50/60 Hz (± 3 Hz)
Optional
100 - 115 VAC; - 15% to + 10%
Single Phase 50/60 Hz (± 3 Hz)
Power Consumption
1.5 KVA (nominal), 2.6 KVA (max.)
Footprint
Base machine with MHS
889 mm wide x 1009 mm deep (35” x 39.7”)
Weight (estimated)
Machine: 590 kg (1300 lbs)
Machine & Crate: 670 kg (1477 lbs)
TECHNICAL SPECIFICATIONS