MRS-SEMI-8027019-REV_F.pdf - 第2页
Contact C yberOptics today for mor e information +1 800.366.9131 or +1 763.542.5000 | CSsales@cyberoptics.com | www.cyberoptics.c om Copyright © 2019-2021. C yberOptics Corporation. All rights reserved. Specications sub…
MRS SENSOR
MRS
™
Sensor Technology
High Precision Optical Sensor for Semiconductor Applications
Measure. Analyze. Improve.
CyberOptics is a leading global developer and manufacturer of
high precision sensing technology solutions. CyberOptics’ 2D
and 3D sensors are used in SMT, semiconductor and metrology
markets to signicantly improve yields and productivity.
Metrology-Grade Accuracy with MRS Technology
– Sub-micrometer accuracy for features as small as 25 µm
– Accurately inspect shiny or mirror-like surfaces with sensor technology that rejects spurious reections.
– Attain repeatable and reproducible measurements.
Fast, Superior Inspection Performance
– Increase throughput with the MRS sensor that is 2-3X faster, delivering greater than 25 wafers (300mm) per
hour.
– Conduct 100% 3D and 2D metrology and inspection versus sampling-only methods.
– Attain 3D and 2D measurements in one pass vs. multiple separate scans.
Versatility for Mid-End and Advanced Packaging Applications
– Measure and inspect a wide range of applications including gold bumps, solder balls and bumps, wafer
bumps, copper pillars and other mid-end and advanced packaging applications.
– Achieve high speed, highly accurate, 3D and 2D metrology and inspection for critical packaging features
including bump height, coplanarity, diameter and shape, relative location and variety of other measurements.
Powered by
MRS Technology
High Precision Accuracy with Multi-Reection Suppression™
(MRS) Sensor Technology
Proprietary MRS sensor technology, deemed best-in-class, enables
metrology grade accuracy by inhibiting optical measurement distortions
and reections. CyberOptics’ unique sensor architecture simultaneously
captures and transmits multiple images in parallel while proprietary 3D
fusing algorithms merge the images together. The result is ultra-high
quality 3D images and high-speed inspection.
Copper Pillar Flip Chip (c4)Micro Bumps
Contact CyberOptics today for more information
+1 800.366.9131 or +1 763.542.5000 | CSsales@cyberoptics.com | www.cyberoptics.com
Copyright © 2019-2021. CyberOptics Corporation. All rights reserved. Specications subject to change without notice 8027019 Rev F
Specications NanoResolution
MRS Sensor (3D+2D)
Minimum Feature Diameter 25 µm
FOV 15x15 mm
Lateral Resolution 3 µm
3D Sensor Height Resolution 0.05 µm
3D Repeatability 0.3 µm @ 3σ (VLSI standard)
3D Accuracy 0.2 µm (VLSI standard)
Height Measurement Range 0.25 mm
3D Acquisition Time, typical 150 msec
Illumination Integrated 2D Illumination