DEK NeoHorizon 01iX Tech Spec.pdf - 第6页
6 DEK Neo H oriz on 01 iX Machine S t andard C onf igurati on Standard C onfiguratio n Specifi cation Machine A lignment Capabi lity > 2.0 C mk @ +/ - 12. 5µ m, (± 6 Si gma ) Sy st em Alignment Capabil ity > 2.0 C …
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DEK NeoHorizon 01iX
Machine Description
DEK NeoHorizon iX
platform – More
reliability and efficiency
for future-proof printing
The DEK NeoHorizon iX
shines with more than
new design. It’s modular
interior is much improved
and highly reliable.
Whether in high-mix
contract manufacturing or
high-volume applications
with high throughput
requirements – the DEK
NeoHorizon iX is the right
printing platform.
Benchmark for accuracy
The DEK NeoHorizon iX
platform is based on an
exceptionally stable frame
design. With its torsional
rigidity and high intrinsic
resonance frequency, the
machine’s frame provides
the foundation for
longevity and long-lasting
accuracy. With its
advanced controllers and
bus systems, the DEK
NeoHorizon 01iX
achieves a system
alignment capability of
±15µm @ 2 Cmk (6
Sigma).
The frame provides lots of
space and the bus system
a wide range of interfaces
for basic components like
precision drives, digital
camera modules and high
precision guides and
slides, as well as for many
productivity-enhancing
options: the DEK
Productivity Tools.
State-of-the-art
software: DEK Instinctiv
With its touchscreen,
keyboard and trackball
operation, graphical
interfaces, multiple
languages and integrated
video-based help, the
DEK Instinctiv software
supports the easy, quick
and error-free operation of
the NeoHorizon iX printer.
With ISCAN (Intelligent
Scalable Area Network),
the new configuration can
be scanned with just a
few clicks and additional
performance is available.
And thanks to its
interfaces, the DEK
NeoHorizon can fine-tune
its printing process based
on data imported from
modern SPI systems.
The right configuration
for every job
High-speed production,
high-mix runs of small
lots, pin-in-paste, ultra-
fine apertures for super-
small components,
stepped stencils, PCBs
with unusual substrates,
many different paste
types – no matter what
the production
requirements are and
what processes are being
used: the DEK
NeoHorizon iX platform
always accommodates
the right configuration for
the printing process.
B2B setup: Flexible on
two tracks
The DEK NeoHorizon
Back-to-Back setup
makes for a uniquely
flexible dual-track
solution. Both units
remain separately
controllable, can be split
up again at any time and
use the full-size printing
area.
Faster cleaning, more
throughput
The DEK NeoHorizon
01iX offers selectable
versions of the new DEK
Typhoon high-speed
under stencil cleaning
system featuring the new
optional plenum inserts
Hard Top – for standard
cleaning, Poly Blade for
cleaning irregular
undersides.
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DEK NeoHorizon 01iX
Machine Standard Configuration
Standard Configuration Specification
Machine Alignment Capability
> 2.0 C
mk
@ +/- 12.5µm, (±6 Sigma)
System Alignment Capability > 2.0 C
mk
@ +/- 15µm, (±6 Sigma)*
Wet Print Capability
> 2.0 C
pk
@ +/- 20µm, (±6 Sigma)
Core Cycle Time 6.5 secs**
Maximum Print Area
510mm*** (X) x 508.5mm (Y) (for Single Stage Mode)
Printer Construction One piece optimised welded frame
ISCAN
TM
Machine Control
Motion control using CAN BUS network
Operating System Windows 10 IoT Enterprise
Operator Interface
Colour TFT touch screen display, keyboard and trackball with
DEK Instinctiv
TM
software. Machine mountable on either left or
right hand side.
Camera HawkEye® 1700 digital camera, using IEEE 1394 interface.
Multi-channel. LED lighting. FOV 11.3mm x 8.7mm.
Inspection window 75mm
2
Camera Positioning
Rotary motors and encoders with 4 micron resolution
Squeegee Pressure Mechanism Software controlled, motorised with closed loop feedback
Stencil Positioning
Automatic loading incorporating squeegee drip tray
Stencil Alignment Motorised via actuators X, Y, and Theta
Under Stencil Cleaning
Typhoon Under Stencil Cleaner, fully programmable with
wet/dry/vacuum wipe with external solvent tank
Specify length (300mm, 400mm, 460mm, 515mm)****
Vacuum Assist for Under Stencil Cleaning On board vacuum unit 35 litres/sec airflow
Squeegee
Clamped double trailing edge squeegee (1 set included)
Tooling Deviation Monitor Verification of tooling setup via squeegee pressure feedback
Machine Interface
Upline and downline FMI included
Connectivity RJ-45LAN (networking) and USB2/3 interface available
Tri Colour Beacon
Programmable with audible alarm
ESD Compatibility
Compliant with EN/IEC 61340-5-1, EN/IEC 61340-5-2,
ANSI/ESD SP10.1, ANSI/ESD S20.20
Temperature & Humidity Sensor
Monitoring of the process environment
Documentation Hard copy manuals comprising: Operator, Installation,
Electrical Drawings. On board technical manuals and tutorials
supporting operator functions. DVD containing manuals and
tutorials.
* System Alignment Capability is certified by a 3
rd
party software QC Calc and undertaken by applying board
loading/unloading, board clamping, camera/rising table movement and print process.
Accuracy and Repeatability qualifications are certified by CeTaQ and AVS to deliver highly confident wet print
process.
** Measured using the ASM defined Core Cycle Time test parameters, for details contact the Product Manager
*** For print area up to 600mm long please contact the Product Manager
**** If configured with an AWSM, the cleaner chamber size should be matched with the minimum AWSM width and
stencil frame width being used
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DEK NeoHorizon 01iX
Machine Standard Configuration
Transport System
Specification
Type
3-Stage High Throughput Conveyor with DSM
Width Adjustment
Programmable motorized rear rail
Transport Direction
Left to right
Right to left
Left to left*
Right to right*
Substrate Handling Size (minimum)
50mm (X) x 40.5mm (Y)
Substrate Handling Size (maximum)
370mm (X) x 508.8mm (Y) (3-Stage Mode)
510mm (X) x 508.5mm (Y) ( Single Stage Mode)
Substrate Thickness
0.2mm to 6mm
Substrate Weight (maximum)
1kg
Substrate Warpage
Up to 7mm including substrate thickness
Substrate Fixture
Over the top clamps
Substrate Handling Features
Soft rail lift/land
Board clamp regulator
Substrate Underside Clearance
Programmable 3mm to 42mm
*Available in single stage only
Process Parameter
Specification
Print Pressure
0kg to 20kg
Print Speed
2mm/sec to 300mm/sec
Print Gap
0mm to 6mm
Substrate Separation
Speed: 0.1mm/sec to 20mm/sec
Distance: 0mm to 20mm
Print Modes
ProFlow®
Print/Print
Print/Flood
Flood/Print
Adhesive
Paste Knead
Programmable: number; period; on demand