MIRTEC_MV-9_3D_AOI_Series_Data_Sheet-REV2.pdf - 第2页
Standard Features: Options: Sy stem Specifications: Option 1 Pixel Resolution: 15 um 58.56 mm x 58. 56 mm (2. 31” x 2.31”) Option 2 Pixel Resolution: 10 um 39.04 mm x 39. 04 mm (1. 54” x 1.54”) Option 1 Pixel Resolution:…
Exclusive 15MP/25MP CoaXPress Camera System
OMNI-VISION
®
3D Digital Tri-Frequency Moiré Technology
Leading-Edge 12 Projection Blue DLP Technology
Precision Compound Telecentric Camera Lens
Eight Phase Color Lighting System
10MP/18MP SIDE-VIEWER
®
Camera System
Programmable Z-Axis Multi-Focus System
INTELLI-PRO
®
Automatic Programming Software
Multi-Functional AOI-SPI Fusion Technology
INTELLISYS
®
Industry 4.0 Intelligent Factory Automation System
www.mirtecusa.com
PREMIER INSPECTION
3D Gull-Wing Co-Planarity Inspection
3D Solder Fillet Inspection
Standard Features:
Options:
System Specifications:
Option 1 Pixel Resolution: 15 um 58.56 mm x 58.56 mm (2.31” x 2.31”)
Option 2 Pixel Resolution: 10 um 39.04 mm x 39.04 mm (1.54” x 1.54”)
Option 1 Pixel Resolution: 7.7 um 39.42 mm x 39.42 mm (1.55” x 1.55”)
1,200 Kg (2,645.55lbs.)
1,500 Kg (3,306.93lbs.)
1,400 Kg (3,086.47lbs.)
Power Requirements
Single Phase 200~240V 50~60Hz; 1.1 KW, Breaker Capacity: 25 Amp
Air Requirements
5 Kgf / cm² (0.5 Mpa); (71 PSI)
Maximum 3D Inspection Height
25 mm @ ±3 um
PCB Thickness Range
Standard: 0.5 mm - 3 mm / Optional: 0.5 mm - 5 mm
Minimum Component Inspection
0402 Chip (mm) / 01005 Chip (in) / 0.3 Pitch (mm)
Robot Positioning System
Precision Linear Drive System, Resolution: 0.2 um / Repeatability: ±2 um
PCB Surface Clearance
Top-Side Clearance: 45 mm / Bottom-Side Clearance: 50 mm
PCB Edge Clearance
Top-Edge Clearance: 3 mm / Bottom-Edge Clearance: 3.5 mm
Maximum PCB Warpage
±2 mm
Maximum PCB Weight
Standard: 4 Kg (8.82 Lbs.)
Additional Specifications
Lens Configuration
Precision Telecentric Compound Lens Design
Quantity Four - 10MP Color Side-Angle Cameras
1,400 mm L x 1,650 mm D x 1,600 mm H (55.12" x 64.96" x 62.99")
MV-9U
MV-9DL OMNI (Dual Lane)
Single Lane: 50 mm x 50 mm to 460 mm x 590 mm (2.0" x 2.0" to 20.1" x 23.23") /
Dual Lane: 50 mm x 50 mm to 460 mm x 300 mm (2.0" x 2.0" to 20.1" x 11.81")
OMNI-VISION® Inspection Technology
3D Inspection Technology
Quantity Four - 18MP CoaXPress Color Side-Angle Cameras
SIDE-VIEWER® Camera System
Machine Dimensions and Weight
MV-9
MV-9 3D AOI Series Specifications
Vision System (FOV Size)
Digital Tri-Frequency Moiré Technology - 12 Projection Blue DLP
2D Inspection Technology
15MP / 25MP CoaXPress Camera System
25MP CoaXPress: (5,120 x 5,120 @ 72 fps)
MV-9DL
Lighting System
Eight Phase Color Lighting
1,250 mm L x 1,500 mm D x 1,600 mm H (49.21" x 59.06" x 62.99")
Component Height, Position, Lifted Package, Lifted Lead, Solder Fillet, Excessive Solder,
Insufficient Solder, Solder Bridge, Open Solder, Etc
3D Inspection Item
1,250 mm L x 1,500 mm D x 1,600 mm H (49.21" x 59.06" x 62.99")
15MP CoaXPress: (3,904 x 3,904 @ 120 fps)
Intel
®
Multi-Core PC, 32” Flat Screen LCD Monitor, Windows 10
TM
OS, HDD, Mouse & Keyboard, Network LAN Card.
OMNI-VISION
®
- Digital Tri-Frequency Moiré Technology - 12 Projection Blue DLP - 25mm 3D Inspection Capability.
Three Stage High-Speed Conveyor System with Programmable Width Control and Automatic PCB Support.
Advanced Eight (8) Phase Color LED Lighting System
Pre and Post Reflow Inspection Capability.
60 mm x 60 mm to 660 mm x 610 mm (2.36" x 2.36" to 26.0" x 24.1")
MV-9DL Shuttle Conveyor Options: Input Shuttle Conveyor, Output Shuttle Conveyor.
Automatic Teach Tool (ATT) Software - Automatic Programming Using Centroid Data.
Comprehensive Package Type Library - Provides Simple "Drag and Drop" Component Programming.
Local System Software: Repair Plus Software, Statistical Process Control (SPC) Software.
15 Mega Pixel or 25 Mega Pixel CoaXPress Top-Down Color Camera System (See Specifications).
2D Inspection Item
Missing Component, Wrong Component, Mis-Alignment, Skewed Component, Polarity,
Tombstone, Solder Bridge, Flipped Device, Solder Ball, Etc
50 mm x 50 mm to 510 mm x 460 mm (2.0" x 2.0" to 20.1" x 18.1")
SIDE-VIEWER
®
Camera System - Quantity (4) 10MP or 18MP CXP Side-Angle Digital Color Cameras. (See Specifications).
Programmable Z-Axis Multi-Focus System - Provides Optimal Focus Level for Taller Devices.
ePM-AOI CAD Import Software. ODB++ Import Module Sold Separately (Requires ePM AOI).
AOI-SPI Fusion Technology - Provides Both AOI and SPI Capability in a Single Platform.
2D Bar Code Reader Options: Gun Type, Camera Type and External Mount.
PCB Indexing Mode: 50 mm x 50 mm to 1,020 mm x 460 mm (2.0" x 2.0" to 40.16" x 18.1")
MV-9
PCB Inspection Area
PCB Indexing Mode: 60 mm x 60 mm to 1,320 mm x 610 mm (2.36" x 2.36" to 51.97" x 24.1")
MV-9U
Remote PC - Software Purchased Separately.
Remote Software: Repair System Software, Statistical Process Control (SPC) Software, Off-Line Teaching Software (OLTT).
Total Remote Management Software (TRMS) - Requires Server Software for Remote PC and Client Software on All Machines.
INTELLI-TRACK
®
Process Control Software - Requires Server Software for Remote PC and Client Software on All Machines.
SVN Multi-System Version Control Software - Requires Separate PC Server.
(Subject to change without prior notice)