OptoLux-23032018.pdf - 第2页
WIRE BONDING CAP ABILITY Bonding Area X Axis: 56 mm Y Axis: 80 mm T otal Bond Placement Accuracy 3.0 μm @ 3 sigma Speed 21 wires per second (2 mm wire length) Pattern Recognition/Optics/Vision Progressive Scan Vision Eng…
Features
▪ High Speed X-Y-Z motion control system
▪ New Interactive Programmable
Look-Ahead Vision for ease of setup
during first time
▪ Automatic recovery paths for common
production stoppages
▪ WAVI (Wide Angle Vertical Illumination)
system with programmable red and
blue lighting
▪ Low angle oblique illumination
▪ Single magnification optics at 2X
▪ Quick-LED Suite Processes and
AccuBump-LED Processes
▪ Auto-BITS self-teach and optimization
▪ Optional Micro Environment kit to support
Ag alloy, PdCu or Cu wire
* Microscope Assembly is an
optional configuration
The OptoLux
TM
High Speed Wire
Bonder is the latest generation ball
bonder that sets new standards and
benchmark in the LED market.
Automatic Wire Bonder
WIRE BONDING CAPABILITY
Bonding Area
X Axis: 56 mm
Y Axis: 80 mm
Total Bond Placement Accuracy
3.0 μm @ 3 sigma
Speed
21 wires per second
(2 mm wire length)
Pattern Recognition/Optics/Vision
Progressive Scan Vision Engine
CCD Video Camera
- 2X Magnification Optics
LOOPING CAPABILITY (with 25.4 μm wire diameter)
Maximum Wire Length
5 mm
Minimum Loop Height
65 μm Quick Loop-LED supports for flexible loop shapes
for improved reliability
Wire Sway
Wire length < 2.54 mm: 25 μm @ 3 sigma
Wire length > 2.54 mm: ± 1 % wire length @ 3 sigma
CONVERSION TIMES
Same Leadframe Type: < 5 min
(Heat block insert & clamp changes, program load from disk)
Different Leadframe Type: < 20 min
(Leadframe width & length changes, magazine size change,
heat block insert & clamp change, program load from disk)
MATERIAL HANDLING CAPABILITY
Package/Leadframe Dimensions
Length: 100 to 300 mm
Width: 25 to 90 mm
Thickness: 0.10 to 0.9 mm
Die Pad Downset: Up to 2.3 mm
Magazine Dmensions
Width: 30 to 98 mm
Length: 127 to 310 mm
Height: 50 to 180 mm
Slot Pitch: 2.5 to 25 mm
Max. Weight: 4.0 kg
KNET PLUS ASSEMBLY EQUIPMENT NETWORK
KNet PLUS improves efficiency and productivity, by monitoring equipment
status in real-time. It collects data and controls process programs locally or
from anywhere on a customer’s network. Contact your K&S Sales
Representative to learn more.
MAN-MACHINE INTERFACE
Monitor
17” color LCD display
Durable Control Panel
Function keys and dedicated buttons, and user-friendly mouse
Industry-Recognized User Interface
Simple pull-down menus. Color-overlays of wire groups for easy
programming and teach
FACILITY REQUIREMENTS
Minimum Air Pressure
3.52 kg/sq cm (50 psi)
Nominal Air Consumption (flow rate)
185 liters/min @ 4.6 kg/sq cm (6.5 CFM @ 65 psi)
Input Voltage
Standard
200 - 240 VAC; -15 % to + 10%
Single Phase 50/60 Hz (± 3 Hz)
Optional
100 - 115 VAC; -15 % to + 10%
Single Phase 50/60 Hz (± 3 Hz)
Power Consumption
1.3 KVA (nominal), 2.0 KVA (max.)
Footprint
Base machine with MHS
889 mm wide x 990 mm deep (35” x 39”)
Weight (estimated)
Machine 556 kg (1226 lbs)
Machine & Crate 670 kg (1477 lbs)
For more information, contact your local authorized K&S sales representative or visit www.kns.com
© 2018 Kulicke & Soa Industries Inc. All specifications subject to change without notice.
Trademarks used herein are the property of Kulicke & Soa Industries, Inc. or their respective owners.
BB-033-03/2018
Automatic Wire Bonder