Asterion_Brochure.pdf - 第2页

Enhanced Capability Hybrid W edge Bonder General Power Requirements (Electrical): 180-240V AC, Single Phase, 50/60Hz, 2.0kV A Nitrogen: Min 275kPa - Max 1000kPa, 2-10 L/min (Small wire only) Work Height: Adjustable 939mm…

Enhanced Capability

Hybrid Wedge Bonder

The Asterion Wedge Bonder is built on an enhanced architecture

that includes an expanded bond area, new robust pattern recognition

capabilities and extremely tight process controls. Together these

deliver heightened productivity, bonding quality, and reliability.

The enlarged bondable area enhances exibility and reduces line

integration costs. Asterion is driven by a precise new direct-drive

motion system that requires minimum maintenance and delivers

high repeatability. Powerful new software features, like the graphical

editor, make programming complex devices easier, and multi-

segmented bonding includes exible tools to deliver an optimized

bonding process.

Advantages

Productivity

• Large bondable area (300mm X 300mm) reduces indexing/loading time

• Improved MTBA with enhanced PR

• Faster cycle time with Direct Drive Motion System and advanced PR modes

Performance

• Very stable platform with minimal frame movement during operation

• Greater bond placement repeatability

• More consistent process results

Conguration Flexibility

• Multiple conguration options available on the same platform; Large wire, small wire and PowerRibbon

• The large work area envelope with extended side access accepts a full array of automated handling solutions

• Capable of multi-device and multi-lane material handling congurations

• Assorted bond head congurations are offered to meet the specic needs of a variety of applications

Lower CoO

• Reduced preventative maintenance requirements on major components

Advanced Capabilities

• Advanced interconnects with improved Congurable bond head (Cu, Al-Cu wire and ribbon)

• Loop Former option enables advanced square shaped loop proles

Ease of Use

• New bond head set-up aid option (GBS)

• Intuitive Graphical User Interface (Windows 7 OS)

• Program conversion from 3600/3700Plus to Asterion is supported

Maintenance and Reliability

• Highly reliable direct-drive XYZT motion system requires no adjustments and less frequent preventive maintenace

• Reduced preventive maintenance requirements on major components

One

Bonder,

Multiple

Interconnect

Materials

Large Wire

PowerRibbon

Small Wire

Copper Wire

AlCu Ribbon

Enhanced Capability

Hybrid Wedge Bonder

General

Power Requirements (Electrical): 180-240VAC, Single Phase,

50/60Hz, 2.0kVA

Nitrogen: Min 275kPa - Max 1000kPa, 2-10 L/min (Small

wire only)

Work Height: Adjustable 939mm - 985mm from Floor

Foot Print: 683mm (W) x 1500mm (D) x 1833mm (H)

Weight: 730kg Uncrated

CE Certication: Standard

Motion System

X,Y Axes: Linear motors, 0.1μm Resolution

Bond Area: 300mm x 300mm

Z-Axis: Voice Coil, 0.1μm Resolution; 50mm Z-Stroke

Θ-Axis: Direct Drive; ± 220°, 0.0057° Resolution

Repeatability: ±3.0μm at 3σ

Pattern Recognition/Optics/Vision

Vision System: GS4 Pattern Recognition System

New PR Modes: Feature Find, Single Point with Angle,

Geomodel

For sales, service and manufacturing locations,

visit: www.kns.com

Specications may change without notice.

The Asterion logo, Asterion, K&S logo, and

Kulicke and Soffa are trademarks of Kulicke &

Soffa Industries, Inc.

WB-005-01/2017

Specications

• Newly designed Graphical Bond head Set-up aid option (GBS) reduces consumable replacement time & ensures a repeatable set-up

• Bond Process Monitoring option (BPM) helps keep tight control of the bonding process

• SECS-GEM option enables factory automation and communication

• Off-line Programming Tool (OPT) creates bonder programs from CAD drawings

• Programmable status light can be programmed for customized conditions

Options

Interconnect Options

Large Wire

Wire Range: 100μm - 500μm Diameter

PowerRibbon

Ribbon Range: 500 x 100μm to 2000 x 250μm

Small Wire

Wire feed angle: 45° or 60°

Wire Range: 25μm - 75μm Diameter

Material Handler

Handler Bay:

With Insert: 710mm (D) x 225mm (H)

Open Bay: 710mm (D) x 460mm (H)

Standard Integrated Handlers Available

Non-destruct Pulltesting

Bondhead Pull Test:

Large Wire ALC bond head

Congurable bond head

Enhancements

Additional Enhancements:

• Light intensity calibration normalizes PR light settings across all machines

• Process programs, stored on a host for control, are available to download to individual bonders

• Process logging for each bond can be stored and accessed ofine for traceability

• Consumable tracking and bar code verication capability

Graphical Editor for convenient

program editing

Robust PR (GS4) with Feature Find and

Geometric Model modes developed for

difcult patterns like direct bonded copper

(DBC) substrates

Bonder Data such as user accounts, security

settings, bond parameter sets and wire

size data can be transferred from a host to

all machines to ensure commonality and

production line control

Multi-segmented Bonding cycle allows

precise control and exibility of the bonding

process

Loop Former option enables advanced

square shaped loop proles

Bonded Device Review can capture

camera images after bonding a device in

Auto and display them for review while

bonding the next device