User-Manual-of-NeoDen4-PNP-machine.pdf - 第2页
Content 1. Brief Introduc tion........................... .................... ..................... .................... ..................... .................. 1 1.1 Product In troductio n.......................... ..…
Zhejiang NeoDen Technology Co.Ltd
User Manual
NeoDen4
Content
1.Brief Introduction............................................................................................................................... 1
1.1
Product Introduction................................................................................................................ 1
1.2
Structure of NeoDen4..............................................................................................................2
2. Operation Flow Chart........................................................................................................................ 4
3.Procedure for making a programming file......................................................................................... 5
4.Edit on the Operation Interface.......................................................................................................... 6
4.1
Edit on the Interface................................................................................................................. 6
4.2
PCB Information......................................................................................................................6
4.2.1 PCB Feed Settings........................................................................................................6
4.2.2 Setting Panelized PCB & first chip.............................................................................. 7
4.2.3 PCB fiducial setting......................................................................................................9
4.2.4 Component list settings.............................................................................................. 10
4.3
Feeder settings screen........................................................................................................... 12
4.3.1 Nozzle information.....................................................................................................13
4.3.2Feeder Basic information............................................................................................ 14
4.3.3 Tray feeder information (available for feeder 54-98)................................................ 16
4.4
Running the program...........................................................................................................16
4.5
Manual Test............................................................................................................................17
4.5.1 Placement head...........................................................................................................18
4.5.2 Rail control................................................................................................................. 19
4.5.3 Host control................................................................................................................ 20
4.5.4 Feeder test...................................................................................................................21
4.6
System setup.......................................................................................................................... 21
4.7
Feeder and peeler installation................................................................................................23
4.7.1 Physical installation of feeders...................................................................................23
4.7.2 Physical installation of peelers:..................................................................................24
4.7.3 SMD configuration page............................................................................................ 24
4.7.4 Feeder configuration...................................................................................................25
4.7.5 Peeler configuration page...........................................................................................26
4.7.6 System configuration..................................................................................................27
4.7.7 First trial and testing...................................................................................................33
4.7.8 P&P programming page............................................................................................. 34
5. Structure and maintenance instruction............................................................................................ 34
5.1
Structure chart........................................................................................................................34
5.1.1 Peeler......................................................................................................................... 35
5.1.2 Tape & Reel holder.................................................................................................... 36
5.1.3 Fixation support..........................................................................................................36
5.1.4 Vibration feeder..........................................................................................................37
5.2
Installing SMT components.................................................................................................. 37
5.2.1 Installing tape and reel components...........................................................................37
5.2.2 Installing tube-fed components.................................................................................. 38
5.2.3 Auto-rails....................................................................................................................40
5.3
Nozzle 42
5.4
Maintenance...........................................................................................................................43
5.4.1 Take effective measures to reduce/ avoid malfunction..............................................43
5.4.2 Maintenance of device................................................................................................44
5.5
Placement failure analysis and troubleshooting....................................................................45
5.6
Related issues during solder paste printing process............................................................. 46
EC Declaration of Conformity............................................................................................................ 48