00195982-03_SM_SWS_EN.pdf - 第2页
All names identified by ® are registered trademarks of ASM Assembly Systems GmbH & Co. KG. The remaining trademarks in this publication may be trademarks whose use by third parties for their own purposes could violat…
SIPLACE Wafer System (SWS)
Service Manual
11/2018 EN
All names identified by ® are registered trademarks of ASM Assembly Systems GmbH & Co. KG. The remaining
trademarks in this publication may be trademarks whose use by third parties for their own purposes could violate
the rights of the owner.
We have reviewed the contents of this publication to ensure consistency with the hardware and software de-
scribed. Since variance cannot be precluded entirely, we cannot guarantee full consistency. However, the informa-
tion in this publication is reviewed regularly and any necessary corrections are included in subsequent editions.
Copyright © ASM Assembly Systems Technical data subject to change
ASM Assembly Systems GmbH & Co. KG
Rupert-Mayer-Strasse 44
81379 Munich
Germany
Item no.: 00195982-03
www.asm-smt.com Printed by ASM Assembly Systems
3Service Manual SIPLACE Wafer System (SWS) 11/2018
1 Introduction.. 13
1.1 Safety instructions.. 13
1.1.1 Conventions for the use of safety instructions and symbols.. 13
1.1.2 Safety instructions for the power supply.. 14
1.1.3 Safety instructions for the compressed air supply.. 14
1.1.4 Safety instructions on hazardous materials.. 14
1.2 Preparatory work..... 15
1.3 Other instructions.. 16
1.3.1 Environmentally-friendly disposal of materials and components.. 16
1.3.2 Use of original accessories and spare parts.. 16
1.3.3 Information about this service manual.. 16
1.3.4 ESD guidelines.. 17
1.3.4.1 What does ESD mean?.. 17
1.3.4.2 Important measures to protect against static charging.. 17
1.3.4.3 Handling ESD modules.. 17
1.3.4.4 Measurements and modifications to ESD modules.. 17
1.3.4.5 Dispatching ESD modules.. 18
1.3.5 Validity of document.. 18
1.3.6 Release history.. 18
1.3.7 SIPLACE on the World Wide Web (WWW).. 18
1.4 Staff qualifications and training.. 19
1.5 Abbreviations.. 19
2 Overview of the SIPLACE wafer system (SWS).. 21
2.1 Technical data.. 21
2.2 Overview of main assemblies.. 22
2.3 Detailed overview of main assemblies.. 25
2.3.1 Overview of assemblies in wafer table area.. 26
2.4 Description of SWS assemblies.. 27
2.4.1 Supply unit.. 27
2.4.1.1 Flip unit.. 28
2.4.1.2 Wafer camera system.. 30
2.4.1.3 Wafer table.. 30
2.4.1.4 Die ejector.. 33
2.4.1.5 Die ejector.. 35
2.4.1.6 Wafer changer system.. 37
2.4.2 Optional features.. 41
2.4.2.1 Linear dipping unit (LDU).. 41
2.4.2.2 Die attach unit.. 42
2.4.2.3 Small die kit.. 42
2.4.2.4 Wafer map system.. 43
2.4.2.5 Barcode scanner.. 43
2.4.2.6 SIPLACE SWS wafer stretcher.. 44
3 SIPLACE wafer system (SWS) function.. 47
3.1 SWS basic functions.. 47
3.2 Basic die presentation process.. 48
3.2.1 Flip chip process.. 49
3.2.2 Die attach process.. 50