2020 DS X1hash EN.pdf - 第2页
X1# Specic ations Applic ations Electronic c omponents and sold er joint A unique advanc ed algorithm library is availab le for electronic applic ations, specic ally for nal assemb ly tasks and solder-joint inspection…
X-series
SMT setup
FATP AXI Platform
X1#
The X1# is a high-quality, high-resolution, low-footprint and portable x-ray in-
spection system for nal assembly inspection and advanced failure analysis applica-
tions. Featuring the Teach&Go function of the Matrix Image Processing Software
(MIPS), the X1# is an easy to learn and easy to use system designed to enable the
fastest possible inspection program creation. The above feautres make this platform
the industry leading solution for automated assembly inspection tasks. The small
footprint allows passage through a standard door width.
The X1# system is available with Transmission (2D) imaging with SFT
TM
to enable
superior image quality with background removal, resulting in outstanding re-
peatability of the measurement values. An advanced algorithm library is part
of the standard image processing package. Customized algorithms are available
upon request.
Inspection & Process Software
PC- Station with multi - core processor setup
Windows 10 platform
MIPS 5 Inspection Platform
Advanced algorithm library
CAD import for automatic inspection list generation
Automatic Tree Classication (ATC) for Auto-Rule-Genera-
tion
Oine programming for AXI program generation & simula-
tion, tuning and defect reference catalogue
Verication & Process control
MIPS Verify link with closed loop repair
MIPS Process with real time SPC
Features and Benets
Oine AXI system
Microfocus X-ray tube (sealed tube / maintenance free)
Digital CMOS atpanel detector
Automatic grey-level and geometrical calibration
Barcode scanner for serial number and product type
selection
Full product traceability via various Industry 4.0 MES-In-
terfaces
IPC-CFX ready
Final Assembly
Test (Consumer)
X1#
Specications
Applications
Electronic components and solder joint
A unique advanced algorithm library is available for electronic
applications, specically for nal assembly tasks and solder-joint
inspection for PCB assemblies.
Assembly completion test
Specic BGA and QFN algorithm
Final production quality test
All standard SMDs and THT/PTH components
For more information,
speak with your
Nordson MATRIX
representative.
Germany/ Headquarters
Feldkirchen (Munich)
+49.89.2000.338.200
info@nordsonmatrix.com
Hungary/ Europe
+36.30.876.5038
hungary@nordsonmatrix.com
Americas
+1.760.930.3301
serviceusa@nordsonmatrix.com
South East Asia
+65.6552.7533
sea@nordsonmatrix.com
China
+86.512.6665.2008
china@nordsonmatrix.com
Japan
+81.3.3599.5920
info@nordsonmatrix.com
Korea
+82.31.736.8321
info@nordsonmatrix.com
Taiwan
+886.963.004.675
cs.taiwan@nordson.com
India
+91 44 4353902
sea@nordsonmatrix.com
Facilities
Dimensions: 1330 mm (H) x 850 mm (W) x 880 mm (D)
Weight: 731 kg
Safe Operating Temperature: 15° - 32 °C optimal 20° - 25° C
Power Consumption Max. 6kW
Line Voltage: 220 VAC, 50/60 Hz 3 phase, 16 A
Air:
6 Bar
X-ray Image Chain
X-ray Source (sealed tube)
Energy: 120kV or 130 kV/40 W
Grey resolution: 14 Bit
CMOS Flatpanel Detector 50 µm pixel size (5 MPix)
Inspection features
Max. carrier size: 94 mm x 54 mm
Max. inspection area: 50 mm x 50 mm
Resolution down to 10 µm /pix
Options
Barcodereader
+49.89.2000.338.200 Phone
+49.89.2000.338.400 Fax
info@nordsonmatrix.com
nordsonmatrix.com
Matrix Technologies GmbH
Kapellenstraße 12
85622 Feldkirchen (Munich)
Germany
Copyright © 2020 Matrix Technologies GmbH
Specication subject to change without further notice
DSB58/01