TDS_InJet_3179_CRD_ENG.pdf - 第2页

InJet ® 3179 CRD TECHNICAL DATA SHEET 2 www.dct.cleaning GENERAL INFORMATION The InJet ® 3179 CRD including 100% closed loop with processes of cleaning, rinsing and drying technologies. All of the processes are fully aut…

100%1 / 8
www.dct.cleaning
TECHNICAL DATA SHEET
InJet
®
3179 CRD
Big board
www.dct.cleaning
CHAMBER
Big board
STENCIL, MISPRINT, SQUEEGEE cleaning
PUMPRINT cleaning
PCB cleaning
InJet
®
3179 CRD
TECHNICAL DATA SHEET
2
www.dct.cleaning
GENERAL INFORMATION
The InJet
®
3179 CRD including 100% closed loop with
processes of cleaning, rinsing and drying technologies.
All of the processes are fully automated, and take place
in one process chamber.
The InJet
®
3179 CRD is designed to remove solder pastes
and SMT adhesives from non-standard oversized stencils
up to 1170 x 2160 x 2015 mm or 46.1 x 85 x 79.3 in,
respectively.
Depending on your cleaning requirements,
the DCT project manager, in collaboration
with a local distributor, will advise you
on a suitable water-based cleaning fl uid
and the correct setup of the entire process.
InJet
®
3179 CRD
TECHNICAL DATA SHEET
3
www.dct.cleaning
Application
name
Recommended
application
Recommended
temperature
Total cleaning
process time
Capacity
per 8 hours
Stencil, misprint, squeegee
20 – 40°C 68 – 104 °F 18 min. 54 / 27 ***
Pumprint
40 – 55°C 104 – 131 °F 18 min. 54 / 27 ***
PCB
35 – 55°C 95 – 131 °F 30 min. 768 *
4 INDIVIDUAL PROCESSES
CLEANING PARAMETRES
C
CLEANING
RINSING
DRYING
D
CR
D
R
highly recommended recommended applicable
* PCB eurocards / per 8 hours (calculated for dimension of 100 x 160 mm / 3.94 x 6.3 in)
* * Parts in soldering palette / per 8 hours (320 x 500 x 50 mm / 12,6 x 19,7 x 1,97 in)
* * * Stencils, pumpprints larger than 736 x 736 mm / 29 x 29 in
LEGEND: