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Ergonomic “Walk-in” Printer Walk-in design allows for easy access to tooling during changeover. All serviceable controls are also located in the front for easy access. Compact design minimizes floor space. Intueri GUI an…

Faster Throughput for a Better Process

Edison’s new parallel processing system is extremely fast resulting in a very

short cycle time. This helps increase throughput by shortening total time per

PCB printed. This leaves more time for key overhead functions that have the

biggest impact on print quality:

• Print at slower speeds to decrease variability

• Utilize slow stencil separation for optimal print definition

• Double stroke after wipe

• More frequent wiping resulting in higher yields

• Time leftover to optimize settings

for maximum possible yields

Unmatched Speed, Accuracy, and Capability

Edison delivers an unheard-of higher throughput than competitive printers

–15 seconds total throughput, including print and stencil wipe cycles. That’s

because individual print process

cycle times have been significantly

reduced, when possible by design,

for a cumulative time savings.

For Accuracy, Edison has no equal.

Edison has built-in ±8 micron

alignment, and ±15 micron wet

print repeatability (≥2 Cpk @ 6

sigma) proven through 3rd party

Print Capability Analysis (PCA)

testing. This represents a 25%

improvement in wet print accuracy

over current best-in-class printing

machines.

Machine Capability Analysis (MCA) confirms printer performance in term of

accuracy and stability using specific tools. Manufacturer specifications are used to

qualify the equipment. MCA, tested using a dedicated glass plate testing fixture

guarantees that machine performance is within the manufacturer’s specifications.

Edison

Back To Back (BTB) Configurable

BTB is a flexible dual lane solution

without adding line length; identical

single-lane printers are easily re-deployed

to other lines when needed. Use in BTB

configuration, or singly as a stand-alone.

Edison is an innovative

printer with a scalable set

of software, controls, and

advanced technologies.

Ideally suited for the

demanding Automotive,

Semiconductor and Smart

Device manufacturing

markets, Edison is built

to excel in every way,

with patented features

throughout its design.

Edison Delivers

Exceptional

Performance

• Fast: Best-in-class throughput

• Accurate: 25% improvement

in wet print accuracy over

current leading machines

• Fine Pitch Capable: Proven

print process capability greater

than 2 Cpk for 0201 metric

components

Ergonomic “Walk-in” Printer

Walk-in design allows for easy access to tooling

during changeover. All serviceable controls

are also located in the front for easy access.

Compact design minimizes floor space.

Intueri GUI and OpenApps

MPM Intueri is a simple, intuitive operator

interface with a flexible, wide array of

configuration variables. It is combined

with Open Apps for maximum capability

and connectivity and provides a portal to

Industry 4.0 concepts.

High Speed Vision Alignment

with Ultra-slim Camera

Overall Gantry thickness is only 39 mm

featuring ‘on the fly’ ‘POE’ (Power Over

Ethernet) camera; A single CCD split field

provides precision simultaneous up-down

image acquisition; FOV 9.0 x 6.0 mm.

Ultra-fast, High Efficiency

Wiping System

A super-size 65m paper roll allows 10,000

prints per change. Patented paper tension

control provides more effective wiping and a

separate wiping and printing zone prevents

cross contamination.

Advanced Print Head

Single axis closed-loop pressure control for dual squeegee

eliminates front-to-back variation; a single high precision load cell

provides squeegee force,

and a unique algorithm

calibrates out non-linearity,

maintaining the set pressure

across the entire board

surface.

Outstanding Features for Optimum

Performance and Value

Edison

NEW Board Staging

Ability to have three boards in the machine simultaneously,

reduced distance on input

conveyor by pre-loading

the board during the

print process results in

reduced transfer times and

improved cycle time.

NEW EdgeLoc™ II Board Clamping

The EdgeLoc system uses a side snugging technique that removes

the need for top clamps which interfere with the PCB to stencil

contact. The result is optimal gasketing and more volumetrically

consistent edge-to-edge prints. With EdgeLoc II, robust flippers

engage to secure the board across the top edge ensuring board

flatness then move out of the way once the board is firmly gripped

from the side. EdgeLoc+

board clamping can change

between edge and top

clamping simply through

software.

NEW Paste Height Monitor

The Paste Height Monitor is designed to prevent defects caused by

inadequate volumes of paste on the stencil. It combines advanced

software and sensor technology to accurately monitor the paste

bead for volume consistency. Upper and lower limit roll-height

monitoring eliminates

insufficient or excess

paste volumes. It is a non-

contact solution that can

automatically add more paste

to the stencil as it is needed.

BOARD HANDLING

Maximum Board Size (X x Y) 450 mm x 350 mm (17.72” x 13.78”)

A dedicated workholder is required for boards with an X size greater than 14”

Minimum Board Size (X x Y) 50 mm x 50 mm (1.97” x 1.97”)

Board Thickness

Foil Clamps 0.2 mm to 6.0 mm (0.007” to 0.236”)

EdgeLoc 0.8 mm to 6.0 mm (0.031” to 0.236”)

Maximum Board Weight 4.5 kg (10 lbs)

Board Edge Clearance 3.0 mm (0.118")

Underside Clearance 12.7 mm (0.5") standard Configurable for

25.4 mm (1.0”)

Board Hold-Down EdgeLoc II, centernest vacuum,

Optional EdgeLoc+

Board Support Methods Magnetic pins and blocks

PRINT PARAMETERS

Maximum Print Area (X x Y) 450 mm x 350 mm (17.72 x 13.78")

Print Gap (Snap-off) 0 mm to 6.35 mm (0" to 0.25")

Print Speed 305 mm/sec (12.0"/sec)

Print Force 0 to 20 kg (0 lb to 44 lbs)

Stencil Frame Size Adjustable Stencil Shelves is standard

584.2 mm x 584.2 mm (23” x 23”) to

737 mm x 737 mm (29" x 29")

Adapters available for smaller sizes

VISION

Vision Field-of-View (FOV) 9.0 mm x 6.0 mm (0.354” x 0.236”)

Fiducial Types Standard shape fiducials (see SMEMA

standards), pad/aperture

Camera System Single digital camera - patented split optics

vision

PERFORMANCE

Total System Alignment ±8 microns (±0.0003”) at 6 sigma,

Accuracy and Repeatability Cpk ≥ 2.0*

Qualification is performed using production environment process variables; print

speed, table lift and camera movement are included in the capability figure.

Wet Print Deposit ±15 microns (±0.0006”) at 6 sigma,

Accuracy and Repeatability Cpk ≥ 2.0*

Based upon actual wet printing with positional accuracy and repeatability verified

by a 3rd party measurement system.

Cycle Time

300 15 seconds including print and wipe

200 20 seconds including print and wipe

Based upon specific set of printing parameters, board size 5”x8”.

FACILITIES

Power Requirements 200 to 240 VAC (±10%) single phase @

50/60Hz, 15A

Air Supply Requirements 100 psi at 4 cfm (standard run mode) to 18

cfm (vacuum wipe) (6.89 bar @ 1.9 L/s to

8.5 L/s), 12.7 mm (0.5”) diameter line

Height (excluding light tower) 1580 mm (62.2") at 940 mm (37.0”)

transport height

Machine Depth 1442 mm (56.77")

Machine Width 1282 mm (50.47”)

Minimum Front Clearance 508 mm (20.0”)

Minimum Rear Clearance 508 mm (20.0”)

BTB Configuration 10 mm (0.39”)

* The higher the Cpk, the lower the variability with respect to the process specification limits. In a

process qualified as a 6 sigma process (i.e., one that allows plus or minus 6 standard deviations within

the specification limits), the Cpk is greater than or equal to 2.0.

Specification is subject to change without notice. Please consult factory for specifics.

ITW EAE maintains an ongoing program of product improvement that may affect design and/or price.

We reserve the right to make these changes without prior notice or liability.

www.itweae.com

ITW EAE is a division of Illinois Tool Works, Inc. It is a consolidation of all of its Electronic Assembly

Equipment and Thermal Processing Technology. The group includes world-class products from MPM,

Camalot, Electrovert (Speedline), Vitronics Soltec and Despatch.

MPM Edison Printer Specifications

MPM Printers – Built on a Solid Foundation.

Strength and stability are prerequisites for accuracy and precision when system parts are in motion and moving about at

high speed. The MPM® Edison’s major assemblies are driven by precision ball screws, not belts, which eliminate the need for

calibrations. The worknest and camera gantry are designed for optimum motion stability, shorter settling time, and faster board

and stencil alignment. MPM® Edison’s rigid frame is welded for low vibrations. This allows for higher repeatability and great

reliability over time. Alignment is achieved with minimum motion; thus the PCB travels to the stencil more quickly.