EXQS Datasheet EN.pdf - 第2页

DS-EXQS-270224 For more inf ormation, speak with your Nordson represent ative or c ontact your Nordson re gional oice Nordson T est & Inspection Europe, SEA, Africa ti-sales-eu@nordson.com Nordson T est & Inspec…

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The EX-QS is an EX-Q wafer mapping sensor repackaged in a smaller case to accommodate
applications where space is limited, or where a smaller sensor footprint is desired.
The EX-QS enables reliable detection of semiconductor wafers and slotting errors in cassettes
or FOUPs. It can be used with mixed wafer batches, for example dark or coated wafers can be
combined with bright wafers and it is compatible with flatted or notched wafers of any size
including 300mm. Available in two stando distances.
Metrology Sensors
EX-QS
Wafer Mapping Sensor
Semiconductor fabs and OEMs worldwide value the accuracy,
precision and versatility of TEST &INSPECTION’s semiconductor measurement devices.
The most eicient and eective measurement devices for tool optimization, stabilization
and standardization.
Save Time Save Expense Improve Yields
DS-EXQS-270224
For more information,
speak with your Nordson
representative or contact
your Nordson regional oice
Nordson Test & Inspection
Europe, SEA, Africa
ti-sales-eu@nordson.com
Nordson Test & Inspection
Americas
ti-sales-us@nordson.com
Nordson Test & Inspection China
ti-sales-cn@nordson.com
Nordson Test & Inspection Japan
ti-sales-jp@nordson.com
Nordson Test & Inspection
Singapore
ti-sales-eu@nordson.com
Nordson Test & Inspection
Taiwan
ti-sales-tw@nordson.com
Nordson Test & Inspection Korea
ti-sales-korea@nordson.com
www.nordson.com/TestInspect
Insensitive to Interference
Insensitive to interference from the
mapping environment.
Beam geometry and built-in ambient
light filters minimize stray reflections
and ambient lighting influences.
Accommodates all SEMI standard wafers,
regardless of size or edge geometry,
through patented dual and wide beam
technologies.
There are no moving parts that can result
in particulate contamination.
Dark or Coated Wafers
Excels at detecting dark or coated wafers at
factory gain setting.
Laser transmitters and receivers are fine-
tuned for maximum sensitivity to perform
out of the box.
Reliably Detects
Cross-slotted and ultra-thin wafers.
Thin laser stripe (0.05mm) combined with
multiple apertures and spatial filtering
reduces noise, improving mapping accuracy.
Wafer Mapping Sensor
Specifications EX-43S EX-73QS
Method of
Detection
Dual Wide Beam
Optimum
Detecting
Distance
1.5”
2.2”
Maximum
Detecting Range
1.4” to 1.6”
2.05” to 2.35”
Supply Voltage
9 to 24V DC
Current
Consumption
130 mA typical, 200 mA max.
Light Source
2 X 850 nm diode lasers
- at Exit Port
2 X 0.600 mW max.
- at CDRH
Aperture
0.077 mW max.
Laser Class
Class 1 (CDRH)
Detectable
Objects
Transparent, opaque and mirror-surfaced objects
Laser Spot Size
10mm x 0.05mm
16mm x 0.06mm
Working Angle
Range
± 16 degrees relative to
the sensor front surface
± 11 degrees relative to the sensor
front surface
Operation
Light-ON/Dark-ON switch, Enable, Gain setting
Response Time
400-μs max.
Minimum
Pulse Width
5 msec. (Options available)
Indicator
Laser power - RED led, Signal OUT - GREEN led
Control Output
MOSFET open drain, Low-True, 80mA max @24V DC
Connections
16”, 4 conductor cable (Options available)
Temperature
Limits
Operating: 32 to 104ºF (0 to 40ºC) Storage: -20 to 130ºF (-30 to 55ºC)
Materials
Lenses: glass, plastic; Case: aluminum
Weight
4.3 oz (122g)
Careful alignment and adjustment of the sensor is required for
optimal performance. Read the instructions before installation.
Failure to properly install, align, or use the EX-QS wafer mapping
sensor may reduce its performance.
EX-QS laser photoelectric sensors contain no user serviceable parts.
Refer all servicing to Nordson Corporation. Semiconductor lasers
used in the EX-QS wafer mapping sensor generate Class 1 invisible laser
radiation. Avoid looking directly at the laser beam.
These sensors conform to IEC 60825-1 (2001-08) (laser safety) and to the
laser safety requirements of SEMI S2-0200.
EX-QS
Dimensions