TDS_InJet_888_CRD_1F_ENG.pdf - 第2页

InJet ® 888 CRD – 1F TECHNICAL DATA SHEET 2 www.dct.cleaning GENERAL INFORMATION The InJet ® 888 CRD - 1F, including a 100% closed loop, with cleaning, rinsing, and drying technology processes. All of the processes are f…

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REFLOW and SOLDERING PARTS cleaning
PCB cleaning
STENCIL, MISPRINT, SQUEEGEE cleaning
www.dct.cleaning
TECHNICAL DATA SHEET
InJet
®
888 CRD – 1F
www.dct.cleaning
CHAMBER
InJet
®
888 CRD – 1F
TECHNICAL DATA SHEET
2
www.dct.cleaning
GENERAL INFORMATION
The InJet
®
888 CRD - 1F, including a 100% closed
loop, with cleaning, rinsing, and drying technology
processes.
All of the processes are fully automated, and take place
in one process chamber.
The InJet
®
888 CRD-1F is developed primarily for the
removal of smelting residues from soldering frames, and the
maintenance cleaning of soldering equipment components.
Depending on your cleaning requirements,
the DCT project manager, in collaboration
with a local distributor, will advise you
on a suitable water-based cleaning fl uid
and the correct setup of the entire process.
InJet
®
888 CRD – 1F
TECHNICAL DATA SHEET
3
www.dct.cleaning
R
C
D
C
CLEANING
RINSING
DRYING
R
D
Application
name
Recommended
application
Recommended
temperature
Total cleaning
process time
Capacity
per 8 hours
Re ow and soldering parts
30 – 50°C 86 – 122 °F 40 min. 240 **
PCB
35 – 55°C 95 – 131 °F 55 min. 1100 *
Stencil, misprint, squeegee
20 – 40°C 68 – 104 °F 20 min. 24
3 INDIVIDUAL PROCESSES
CLEANING PARAMETRES
highly recommended recommended applicable
* PCB eurocards / per 8 hours (calculated for dimension of 100 x 160 mm / 3.94 x 6.3 in)
* * Parts in soldering palette / per 8 hours (320 x 500 x 50 mm / 12,6 x 19,7 x 1,97 in)
* * * Stencils, pumpprints larger than 736 x 736 mm / 29 x 29 in
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