3D SPI系列彩页.pdf - 第2页

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Support pins; ; ; ; Double-sided display(dual-track option)

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

23.6 inches touch screen display







Shadow effect

Traditional 3D SPI uses one projector to create the 3D picture. In this technology,

the pad is measured from one direction, which causes a blind spot on the

opposite direction and leads to inaccurate 3D shape.

Dual projector optical systemtechnology – Shadow free technology

Applying dual projectors hardware design,ALeader overcomes all

shadow effects and specular reflection problems. Therefore,

ALeader can have accurate 3D shape.

Uniformity of projection light systems

Brightness uniformity<70%

Large opticaldensity

Small optical density

Brightness uniformity

ALeader presents innovative micron projectors optic & advanced image acquisition system. Development was done with leading European 3D optic manufacture.

The result is ultra high accurate in height measurement.

Height accuracy is consistent through all parts of the PCB not effected by the position of the FOV.

Measuring dot on the left

Measuring dot on the right

Measuring dot in the middle

Height accuracy is consistent through all parts of the PCB

not effected by warpage.

3D compensation function

With the thickness variation

strips measurement technology

at different periods,ALeader

calculates&compensates for

warpage by measuringthe

base point of each pad.

Available in shortest time from Gerber to debugged program.

New interface utmostly facilitates the operation of users

Interface structure and intelligent interface optimized according to the

users’level,strengthen the operability

and improve the features of test results confirmation and processing.

Operators can process the date promptly and see the test data directly.

With the NG information interface of real image, it is easy to confirm NG

without comparing with the real boards.

Save the test data of ALeader 3D SPI and AOI to the central database. Show and judge the results of printing, SMD and after reflow on AOI simultaneously. With

the accurate 3D test data, the operator can optimize the whole processing procedure in a short time.

Management tool of Large data statistics

SPC makes it possible to provide multiple statistical data based on the test results.

ALeader Innovation programming minimize debug and avoid escapes file applying tight tolerances automatically. User debug reduce to 1\10 of the time of traditional SPI.

In traditional SPI 3D uniformity through the FOV is limited.It means that the

same pad in different locations across the FOV will give different results.

Brightness Uniformity <70%.

ALeader 3D SPI presents over 90% of 3D measurement uniformity

across the FOV.Same pad in different locations in the FOV will give

the same measurement result.

全球顶尖的3D SPI-精准、稳定、快速、简易

Global Leading 3D SPI-Accurate、Stable、Fast、Easy

传统3D SPI

Traditional 3D SPI

ALeader 3D SPI

阴影问题

传统3D SPI使用的单反

向照射光方式，不能检

测照射光反面的阴影区

域，导致不能精确测量

ALeader利用该技术

完全解决阴影问题与

镜面反射问题，能正

确进行锡膏3维测量

双方向投射光系

统的技术

投射光系统均匀度

传统3D SPI

Traditional 3D SPI

ALeader 3D SPI

亮度均匀度<70%

Brightness uniformity<90%

亮度均匀度<90%

光密度大

光密度小

亮度均匀

高一致性

High Consistency

欧洲深度定制的微米级投射光系统及图像采集系统，配合ALeader独有的测量技术，能确保极高的测量精度，并完全保证了PCB任一测量点的高一致性。

无论测量点处于FOV任一位置，测量点的测量精度均一致

测量点处于左侧

测量点处于右侧

测量点处于中间

无论PCB是否弯曲，测量点的测量精度均一致。

ALeader利用不同周期

的粗细条纹测量技术，

对基准面发生板弯差异

实时补偿。

3维补偿功能

Fast Programming

快速编程

编程调试更简单化，导入Gerber自动生成检测程序

新建程序

导入Gerber文件

完成

操作员使用便利性极大化的新界面

以按使用者级别最优化的界面结构及智能型界面，更加强化易操作性。

而且提高了检测结果确认及处理功能，操作员可迅速地处理数据及可

一目了然地看到检测数据。

利用实际图片不良信息界面，不需与实际板子比较可容易的确认不良。

GUI界面

GUI interface

不良焊盘显示-不良显示

NG pad display-NG display

2D和3D对比图片

2D image and 3D color image

Cloud computing analysis management(Display all test data on one screen)

云计算分析管理（二点照合/三点照合）

ALeader 3D SPI及AOI检测数据保存到中央数据库，在AOI上同时显示并判断印刷结果及贴片结果，炉后结果。基于准确的3维测量数据，

操作员可在短期内优化整个制程。

Remote engineering management&multi-line monitoring&debugging

3D SPI

AOI AOI

远程工程管理&

多条线监控&调试

大数据统计管理Tool

利用SPC，基于测量结果提供多种统计数据。