pressurecureoven.pdf - 第3页

Pressure Cure Applications Underfill Curing Die Attach Curing W afer Lamination Film & T ape Bonding PCO

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System Overview
Pressure Cure Oven (PCO) or Autoclave is used to
minimize voiding and increase adhesion strength for
bonding processes typically used in die attach and
underfill applications
PCO pressurizes air into a rigid vessel and heats & cools
with forced convection
¬ Heaters, heat exchangers and blowers are internal to
the pressure vessel
When the curing process is complete, the pressure oven
automatically relieves its pressure to 1atm and cools
Pressure Cure Applications
Underfill
Curing
Die Attach
Curing
Wafer
Lamination
Film & Tape
Bonding
PCO
Process Specification
• Process time: Generally 120 min or User’s spec
• Operating temp: 60
o
C ~ 200
o
C
• Maximum temp: 220
o
C
• Operating pressure: 1 bar – 10 bar
• Capacity: 24 Magazines (typical)
• Cooling method: PCW (17
o
C - 23
o
C)
• Cooling water pressure: 25 – 40 psi
200℃
60℃
0
Temp.
30min 90min 120min Time
10 bar
0
20min 90min 110min Time
Cooling
process
Curing
process
Rising
process
Pressure.
Representative Pressure/Temp Profiles (User Configurable)