RV-2-3DHL_SPE_EN.pdf - 第9页
RV-2- 3D HL PRODUCT SPECIFICA T IONS 6 5. Inspection Function Spe cification Item Specificat ion T y pes of boards t hat can b e inspecte d After so lder print ing, b efore r eflow , after ref low Parts th at can be insp…
RV-2-3DHL PRODUCT SPECIFICATIONS
5
4. Applicable Boards
Applicable board specification
Item Specification
External board dimensions
■ Standard head
L 50 mm × W 50 mm to L 410 mm × W 590 mm
■ Longer-sized Specifications
L 50 mm × W 50 mm to L 650 mm × W 590 mm
■ Marking specification
L 50 mm × W 50 mm to L 330 mm × W 590 mm
Board thickness 0.3 to 8.0 mm
Maximum board height Standard Top side: 40 mm Bottom side: 70 mm
Payload
7.0 kg or less (The transfer speed is changed variably according to the
payload.)
* Please consult us if the weight exceeds the limit.
∗ The maximum board dimensions need to be changed according to the board weight and shape.
Loading a board having a part whose height exceeds 40 mm on the top side or 70 mm on the bottom side
may damage the board or cause the device to malfunction. The above dimensions provide clearances
from the shafts and lights when boards are transferred and inspected.
If a part or solder is installed/applied within 3 mm of either end of the board in the transfer direction, the
board cannot be transferred or positioned.
The maximum payload of the board is 7 kg. When you convey a board of weight more than 1 kg, you lower
the conveyance speed, and please use it. Let me carry in a board after cooling off enough so that board
surface temperature is as follows 60 °C Celsius after reflowing it. It causes belt damage, the loser when it
cannot cool off enough. (exchange indication 0.5 years)
Marking can not be used with inspection data with Longer-sized selection enabled for Longer-sized and
marking unit combination equipment. Marking can be used only in normal board mode.
Board W
Board L
Transfer rail part
RV-2-3DHL PRODUCT SPECIFICATIONS
6
5. Inspection Function Specification
Item Specification
Types of boards that can be
inspected
After solder printing, before reflow, after reflow
Parts that can be inspected
Square chips of 0402 or more, cylindrical chips, tantalum capacitors,
aluminum chip capacitors, transistors, SOP/QFPs (0.3 mm or greater
pitch), connectors, leads of discrete parts
* If resolution 5.0 μm / pixel, Square chip 0201 or more, SOP / QFP (0.2
mm or more pitches)
Inspection item
Lack of parts, offset, polarity, front-side back, no solder, bridge, solder
amount, disconnected insertion part, etc
RV-2-3DHL PRODUCT SPECIFICATIONS
7
6. Hardware Specification
Item Specification
Image processing system
Color image processing
- 1200-million-pixel CMOS color camera,
- High-brightness white LEDs, coaxial illumination
Resolution Standard: 12.0 μm/pixel, Optional: 5.0 μm/pixel
Image range Standard: 48.0 x 36.0 mm, Optional: 20.0 x 15.0 mm
Transfer conveyor type Single track
Transfer conveyor width
adjustment
Automatic adjustment
Height of transfer conveyor 900 mm -20 mm to +70 mm Adjustable using the adjuster feet
Processing time 0.20 second/1 screen
Positioning Reference on end face of board
Electric power
3-phase 200 to 230 V ±10%, 2.0 kVA or less (effectively 0.8 kVA)
(Power supply cable: 2.0 mm2 x 4-core cable, less than 3 m)
Air supply pressure 0.49 MPa
Control computer OS Windows 7, 64-bit
Optional Marking unit (Air type)