CM602.pdf

V alues such as maximum speed and placement accuracy may vary depending on operating conditions. Please refer to the specification booklet for details. *1: Compatible with 220/380/400/420/480 V *2: Only for main body *3: …

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Values such as maximum speed and placement accuracy may vary depending on operating conditions. Please refer to the specification booklet for details.
*1: Compatible with 220/380/400/420/480 V
*2: Only for main body
*3: Dimension D including direct tray feeder: 2,565 mm
*4: Excluding monitor and signal tower
*5: Standard configuration: excluding batch exchange cart and tray feeders. This may differ depending on configuration.
*6: The 0402 chip requires a specific nozzle/feeder
CM602-L
Modular High-speed Multi-functional Placement Machine
• One platform solution for any kind of production
• APC-capable (Adaptive Process Control)—adapting placement of 01005s down to 1.6mil spacing
• Linear motor drive increases reliability and reduces maintenance
• Compatible with other CM-series equipment
Electronic Assembly Mounting System
High-speed head (12 nozzles)
CM602-L
MODEL NO. NM-EJM8A
PCB
DIMENSIONS
Min L × W to
50 mm × 50 mm
Max L × W
510 mm × 460 mm
HEAD TYPE HIGH-SPEED (12 Nozzles) HIGH-FLEXIBILITY (8 Nozzles) MULTI-FUNCTION (3 Nozzles)
Maximum speed
0.036 s/chip (for Type A-2 head) 0.048 s/chip (for Type A-0 head) 0.18 s/QFP (for Type B-0 head)
Placement accuracy
±40 µm/chip (Cpk≥1)
±40 µm/chip, ±35 µm/QFP 24 mm to 32 mm
±50 µm/QFP <24 mm (Cpk≥1)
±35 µm/chip (Cpk≥1)
COMPONENT DIMENSIONS
(mm)
0402 (01005") chip
*6
to L 12 x W 12
0603 (0201") chip to L 32 x W 32 0603 (0201") chip to L 100 x W 90
PCB EXCHANGE TIME 0.9s (Board length up to 240 mm under optimum conditions)
ELECTRIC SOURCE
*1
3-phase AC 200 V, 4.0 kVA
PNEUMATIC SOURCE
*2
0.49 MPa, 170 L/min (A.N.R.)
DIMENSIONS
*2
W
2,350 mm
D
2,290 mm
*3
H
1,430 mm
*4
MASS
*5
3,400 kg
Head Options
High-speed 12 nozzle head
• Measures actual chip thickness
• Maintains constant placement force,
preventing chip
cracking
• Verifies chip
placement
Compact Feeder Cart
• 200 mm feeder cart
size decrease
• Compact cart
compatible with existing
feeder carts. Both cart
types can be used at
the same time.
*Installed high-speed software. NM-EJM8A is standard. NM-EJM4A is optional.
Maximum Speed (Type A-2)
0.036 s/chip 100,000 cph*
• New high-speed head (12 nozzles) provides
super high-speed placement of microchips
• Main body has space-saving small footprint
• 166% higher productivity than previous
generations
High-flexibility 8 nozzle head
• Measures actual chip thickness
• Updates part
library with
measured
thickness
• Allows for
multiple vendors
of the same
components
Area Productivity (Type A-2)
• 15,800 to 18,500 cph/m
2
Highly productive
and compact
Compact feeder cart increases
area productivity 17%
(optional)
Chip thickness
measuring sensor
(optional)
one platform
solution
for
world-class
manufacturing
A wide range
of options
400 mm
2,690 mm
2,290 mm
CM602-L with CM602-L with
existing feeder cart compact type
Placement Quality
Enhancement
High-speed POP placement
using transfer units (optional)
High-speed POP Placement
• Placement speed 0.65 s/chip
Mid-sized Large
Micro-chips Components Components
High-speed Head High-flexibility Head Multi-functional Head
(12 nozzles) (8 nozzles) (3 nozzles)
Board Warp Sensing
• The optimum placement height is controlled by
measuring board warp.
3D Sensor
• Detects all leads of components; i.e., QFP,
SOP, SOJ
• High-speed detection via batch scanning
• Detects solder ball position and measures ball
height
Ball lacking CSP
BGA.CSP
Batch transfer for 8 components by
high-flexibility heads (8 nozzles)
Transfer unit
Easy Maintenance
• Install and remove
squeegee and scraper
without tools
Machine Configuration
The most suitable module can be selected to place components from microchips to
odd-shaped components—depending on the products and production volume.
Board warp
measuring sensor
(optional)
3D sensor for high-quality
IC package placement
(optional)
CONFIGURATION TYPE 12 NOZZLES/12 NOZZLES 12 NOZZLES/8 NOZZLES 8 NOZZLES/8 NOZZLES 12 NOZZLES/3 NOZZLES 8 NOZZLES/3 NOZZLES 3 NOZZLES/3 NOZZLES
HEAD
COMBINATION
A TYPE A-2 TYPE A-1 TYPE A-0 — — —
B — — — — — TYPE B-0
C — — — TYPE C-1 TYPE C-0 —
TRAY
SUPPORT
ONE
SIDE
D — TYPE D-3 TYPE D-2 TYPE D-1 TYPE D-0 —
E — — — — — TYPE E-0
BOTH
SIDES
F — — TYPE F-2 — TYPE F-1 TYPE F-0
A wide range
of options
Tray Support
(optional)
Direct Tray
Feeder DT502-20
• JEDEC trays are supported.
• Up to 20 types of trays can be
stocked.
• Components can be supplied
from trays during operation.
Changeable Film Thickness
• Squeegee gap is programmable for each
component
TRANSFER TYPE MAX. DIMENSION
8 NOZZLES
4 COMPONENTS x TWO-TIME
BATCH TRANSFER
12 mm
3 NOZZLES
3 COMPONENTS BATCH
TRANSFER
15 mm