CM602.pdf - 第2页

Head Options High-speed 12 nozzle head • Measures actual chip thickness • Maintains constant placement force, preventing chip cracking • V eriﬁes chip placement Compact Feeder Cart • 200 mm feeder cart size decrease • Co…

Values such as maximum speed and placement accuracy may vary depending on operating conditions. Please refer to the speciﬁcation booklet for details.

*1: Compatible with 220/380/400/420/480 V

*2: Only for main body

*3: Dimension D including direct tray feeder: 2,565 mm

*4: Excluding monitor and signal tower

*5: Standard conﬁguration: excluding batch exchange cart and tray feeders. This may differ depending on conﬁguration.

*6: The 0402 chip requires a speciﬁc nozzle/feeder

CM602-L

Modular High-speed Multi-functional Placement Machine

• One platform solution for any kind of production

• APC-capable (Adaptive Process Control)—adapting placement of 01005s down to 1.6mil spacing

• Linear motor drive increases reliability and reduces maintenance

• Compatible with other CM-series equipment

Electronic Assembly Mounting System

High-speed head (12 nozzles)

CM602-L

MODEL NO. NM-EJM8A

PCB

DIMENSIONS

Min L × W to

50 mm × 50 mm

Max L × W

510 mm × 460 mm

HEAD TYPE HIGH-SPEED (12 Nozzles) HIGH-FLEXIBILITY (8 Nozzles) MULTI-FUNCTION (3 Nozzles)

Maximum speed

0.036 s/chip (for Type A-2 head) 0.048 s/chip (for Type A-0 head) 0.18 s/QFP (for Type B-0 head)

Placement accuracy

±40 µm/chip (Cpk≥1)

±40 µm/chip, ±35 µm/QFP 24 mm to 32 mm

±50 µm/QFP <24 mm (Cpk≥1)

±35 µm/chip (Cpk≥1)

COMPONENT DIMENSIONS

(mm)

0402 (01005") chip

to L 12 x W 12

0603 (0201") chip to L 32 x W 32 0603 (0201") chip to L 100 x W 90

PCB EXCHANGE TIME 0.9s (Board length up to 240 mm under optimum conditions)

ELECTRIC SOURCE

3-phase AC 200 V, 4.0 kVA

PNEUMATIC SOURCE

0.49 MPa, 170 L/min (A.N.R.)

DIMENSIONS

2,350 mm

2,290 mm

1,430 mm

MASS

3,400 kg

Head Options

High-speed 12 nozzle head

• Measures actual chip thickness

• Maintains constant placement force,

preventing chip

cracking

• Veriﬁes chip

placement

Compact Feeder Cart

• 200 mm feeder cart

size decrease

• Compact cart

compatible with existing

feeder carts. Both cart

types can be used at

the same time.

*Installed high-speed software. NM-EJM8A is standard. NM-EJM4A is optional.

Maximum Speed (Type A-2)

0.036 s/chip 100,000 cph*

• New high-speed head (12 nozzles) provides

super high-speed placement of microchips

• Main body has space-saving small footprint

• 166% higher productivity than previous

generations

High-ﬂexibility 8 nozzle head

• Measures actual chip thickness

• Updates part

library with

measured

thickness

• Allows for

multiple vendors

of the same

components

Area Productivity (Type A-2)

• 15,800 to 18,500 cph/m

Highly productive

and compact

Compact feeder cart increases

area productivity 17%

(optional)

Chip thickness

measuring sensor

(optional)

one platform

solution

for

world-class

manufacturing

A wide range

of options

400 mm

2,690 mm

2,290 mm

CM602-L with CM602-L with

existing feeder cart compact type

Placement Quality

Enhancement

High-speed POP placement

using transfer units (optional)

High-speed POP Placement

• Placement speed 0.65 s/chip

Mid-sized Large

Micro-chips Components Components

High-speed Head High-ﬂexibility Head Multi-functional Head

(12 nozzles) (8 nozzles) (3 nozzles)

Board Warp Sensing

• The optimum placement height is controlled by

measuring board warp.

3D Sensor

• Detects all leads of components; i.e., QFP,

SOP, SOJ

• High-speed detection via batch scanning

• Detects solder ball position and measures ball

height

Ball lacking CSP

BGA.CSP

Batch transfer for 8 components by

high-ﬂexibility heads (8 nozzles)

Transfer unit

Easy Maintenance

• Install and remove

squeegee and scraper

without tools

Machine Conﬁguration

The most suitable module can be selected to place components from microchips to

odd-shaped components—depending on the products and production volume.

Board warp

measuring sensor

(optional)

3D sensor for high-quality

IC package placement

(optional)

CONFIGURATION TYPE 12 NOZZLES/12 NOZZLES 12 NOZZLES/8 NOZZLES 8 NOZZLES/8 NOZZLES 12 NOZZLES/3 NOZZLES 8 NOZZLES/3 NOZZLES 3 NOZZLES/3 NOZZLES

HEAD

COMBINATION

A TYPE A-2 TYPE A-1 TYPE A-0 — — —

B — — — — — TYPE B-0

C — — — TYPE C-1 TYPE C-0 —

TRAY

SUPPORT

ONE

SIDE

D — TYPE D-3 TYPE D-2 TYPE D-1 TYPE D-0 —

E — — — — — TYPE E-0

BOTH

SIDES

F — — TYPE F-2 — TYPE F-1 TYPE F-0

A wide range

of options

Tray Support

(optional)

Direct Tray

Feeder DT502-20

• JEDEC trays are supported.

• Up to 20 types of trays can be

stocked.

• Components can be supplied

from trays during operation.

Changeable Film Thickness

• Squeegee gap is programmable for each

component

TRANSFER TYPE MAX. DIMENSION

8 NOZZLES

4 COMPONENTS x TWO-TIME

BATCH TRANSFER

12 mm

3 NOZZLES

3 COMPONENTS BATCH

TRANSFER

15 mm