ASMPT_Brochure_DEK_Galaxy_EN_250212.pdf - 第2页
T OP PERFORMANCE AND FLEXIBILITY A T W AFER , SUBSTRA TE AND PCB LEVEL Are you looking for a high-precision and extremely powerful printer? If so then the DEK Galaxy is the perfect choice. This solder paste printer combi…
Advanced packaging and
high-precision SMT assembly
DEK Galaxy
TOP PERFORMANCE AND FLEXIBILITY
AT WAFER, SUBSTRATE AND
PCB LEVEL
Are you looking for a high-precision and extremely powerful printer? If so then
the DEK Galaxy is the perfect choice. This solder paste printer combines
impressive performance with extensive flexibility and allows you to switch quickly
between different product requirements: Wafer bumping by solder paste printing,
SMT pre-assembly for next-generation assemblies or DirEKt Ball Attach on
wafers or substrates with ball diameters down to 0.2 mm.
DEK Galaxy uses proven ASMPT technologies such as linear motors for maxi-
mum speed, precision and reliability. The printer offers numerous options,
including singulated tooling systems which allow for individual alignment and
printing of multiple substrates within one print cycle, JEDEC wafer chuck and
carriers for substrate and wafer processing. Grid-Lok
®
and Customized tools
which enable advanced substrate support even for extremely dense assemblies.
SMEMA-compatible interfaces support easy integration with DEK solutions for
wafer loading and substrate fluxing as well as with back-end devices such as
grid array reflow or placement platforms. As a stand-alone offering or as part
of a turnkey process configured by ASMPT specialists: DEK Galaxy is the
ultimate performer.
Material Management
The combination of DEK Paste
Roll Height Monitor and DEK
Automatic Paste Dispenser
(cartridge or can) controls the
paste quantity automatically.
Newly developed DEK Typhoon
high-speed stencil cleaning system
Maximum exibility and speed for under stencil
cleaning with exible insert types and chamber
lengths for optimal cleaning performance for
every process and stencil.
DEK Multiple Alignment
of Singulated Substrates
(MASS)
Multiple substrates are optically
aligned at the same time –
a technological breakthrough for
ecient and high-precision printing
processes with singulated substrates.
DEK GALAXY
INNOVATIONS
DEK GALAXY IS YOUR
COMPETITIVE ADVANTAGE
DEK Virtual Panel
Tooling (VPT)
DEK Virtual Panel Tooling (VPT)
allows the printer to process
multiple individual substrates
in a single print cycle.
DEK HawkEye
®
DEK HawkEye
®
quickly veries
the printing results within the
printer itself.
Maximum precision
Alignment accuracy: ± 12.5 µm,
at >2.0 cmk (± 6 sigma),
wet print: ± 17.5 µm,
at >2.0 cpk (± 6 Sigma)
High throughput
7 seconds core
cycle time
High print quality
Leading to greater
rst pass yield
Fast New Product Introduction (NPI)
Instinctiv V9, for faster setup and
rst print, easier operation and error
prevention and correction
Singulated substrate tooling
Allows for individual alignment and
processing of multiple substrates
within one print cycle
3D Stencil printing
Capable of 3D stencil printing with AgS
paste for power electronics packaging