FuzionOF_Platform_brochure.pdf
www.uic.com email: universal@uic.com AMERICAS T el. 1-800-432-2607 or T el. +1-607-779-7522 CHINA, SHENZHEN T el. +86-755-2685-9108 CHINA, SHANGHAI T el. +86-21-6495-2100 EUROPE T el. +421-2-4930-96-60 ©2013 Universal In…
www.uic.com
email: universal@uic.com
AMERICAS
Tel. 1-800-432-2607 or
Tel. +1-607-779-7522
CHINA, SHENZHEN
Tel. +86-755-2685-9108
CHINA, SHANGHAI
Tel. +86-21-6495-2100
EUROPE
Tel. +421-2-4930-96-60
©2013 Universal Instruments Corporation.
All rights reserved. All specifications are
subject to change.
MC-6144 12/13
Mainstreaming odd-form for enduring profitability
A Shift in Focus – Adapting with Flexible Automation
With today’s volatile labor rates, reduced time-to-market requirements, and greater
product complexity, electronics manufacturers are being challenged to uphold margins
and profitability. While the focus has historically been on optimizing upline efficiency,
there is a significant opportunity to boost productivity by enhancing end-of-line odd-
form assembly processes.
Differentiation Through Automation
Build Better. Build More. Spend Less.
Transforming back-end assembly into a strategic advantage
Many manufacturers are still impeded by manual assembly or traditional
automation solutions, which restrict productivity and competitiveness.
FuzionOF offers a more economical, flexible and higher-performance
solution that transforms new odd-form assembly challenges into quality end
products that strengthen your bottom line.
Comprehensive Odd-Form Automation Solutions
Universal Instruments delivers the most flexible customer-focused solutions for
your automation challenges. Our years of implementing odd-form solutions on a
standard surface mount platform continues today with the best-in-class
capabilities of our flagship FuzionOF™ Platform.
• Complete solutions for any market or application
• The industry’s broadest experience/knowledge base – 20+ years
• The fastest and most versatile high-speed automation platform: surface
mount, odd-form, pin-in-paste, and semiconductor
• Commonality with existing Universal platforms
• Complementary through-hole and complex automation platforms enable
simplified single-vendor solutions
Minimize costs, maximize yield
• Minimize/stabilize labor costs and reduce floor space requirements
• Implement local “market-area” production versus low-cost labor regions
• Reduce WIP and improve inventory turns with consistent production rates
• Accelerate ROI with rapid payback
• Reduce defects, rework and waste (cost of non-quality) with precise,
repeatable, closed-loop processes
Increase overall productivity
• Improve utilization and efficiency to bring new products to market quicker
• Realize 24/7 sustained productivity
• Eliminate bottlenecks for continuous production flow
• Quickly adapt to changing requirements while managing ECRs and
smaller lot sizes
• Shorten cycle times and increase production volumes
• Maintain consistent and predictable throughput, regardless of complexity
• Minimize production downtime/disruptions
Complete automation solutions for any environment
FuzionOF can be integrated as a powerful pre- and post-reflow enabler to eliminate bottlenecks and boost
productivity with complementary capabilities for demanding production environments.
Process Versatility
Focused Solutions
Pre-reflow – Medium-mix agility and versatility
End-of-line SMT/odd-form intrusive (pin-in-paste) solder solutions with ultimate flexibility for
lean manufacturing in medium-mix environments – Industrial, Medical, Military, White Goods
Post-Reflow – Cost-effective productivity
Flexible pre-wave/selective solder assembly solutions to reduce assembly costs and improve
output and yields – Motherboard, Gaming, Power Supplies
Pre-reflow – High-volume performance and yield
End-of-line SMT/odd-form intrusive (pin-in-paste) solder solutions with essential capabilities
for today’s extreme requirements and beyond (finer density, full inspection, consistent force) –
Automotive, Handheld Mobile, Lighting
Connectors Sockets
Ethernet
Jacks E-Caps Shields
Solder
Pre-Forms D-Subs Transformers LEDs
Optimized for today’s growth markets
A fast-moving electronics landscape requires a solution that can easily transition from one product to the next.
FuzionOF solutions are ideally suited to help manufacturers excel across a diverse range of unique market challenges.
Place a full array of odd-form components
Take on any odd-form component with the same confidence as a standard surface mount component.
FuzionOF places these components quickly and accurately with a sustained production flow.
• RF utility meters
• Smoke detectors
• Architectural lighting
• Power supplies
• Instrumentation
• White goods
Pre-Reflow – Medium-Mix
• Set-top boxes
• Automotive ECUs/PCMs
• Automotive ADAS systems
• Smartphones, tablets
• LED bulbs and downlighting
• Telecom
Pre-Reflow – High-Volume
• Power supplies
• Power conversion
• Amplifiers
• Filters
• Motherboards
• Gaming
Post-Reflow
FuzionOF Specifications
16,500 (Max)
11,400 (1-Bd IPC Chips)
Throughput (cph) Accuracy (µm@>1.00 Cpk) Max Board Size Component Range (mm)Max Feeder Inputs (8mm)
±38 (Chips)
±27 (ICs)
508 x 813mm
20 x 32"
120 (2 ULC)
(
0201) .25 x .5 x .15 (Min)
150 square and up to 25 tall
Fuzion2-60
Fuzion2-37 FuzionOF
Fuzion4-120 Fuzion4-120 FuzionOF PTFFuzion4-120 Fuzion4-120
FuzionOF Polaris WorkstationRadial 88HT Polaris FuzionOF FuzionOFRadial 88HT