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Mainstreaming odd-form for enduring profitability A Shift in Focus – Adapting with Flexible Automation With today’s volatile labor rates, reduced time-to-market requirements, and greater product complexity, electronics m…

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MC-6144 12/13

Mainstreaming odd-form for enduring profitability

A Shift in Focus – Adapting with Flexible Automation

With today’s volatile labor rates, reduced time-to-market requirements, and greater

product complexity, electronics manufacturers are being challenged to uphold margins

and profitability. While the focus has historically been on optimizing upline efficiency,

there is a significant opportunity to boost productivity by enhancing end-of-line odd-

form assembly processes.

Differentiation Through Automation

Build Better. Build More. Spend Less.

Transforming back-end assembly into a strategic advantage

Many manufacturers are still impeded by manual assembly or traditional

automation solutions, which restrict productivity and competitiveness.

FuzionOF offers a more economical, flexible and higher-performance

solution that transforms new odd-form assembly challenges into quality end

products that strengthen your bottom line.

Comprehensive Odd-Form Automation Solutions

Universal Instruments delivers the most flexible customer-focused solutions for

your automation challenges. Our years of implementing odd-form solutions on a

standard surface mount platform continues today with the best-in-class

capabilities of our flagship FuzionOF™ Platform.

• Complete solutions for any market or application

• The industry’s broadest experience/knowledge base – 20+ years

• The fastest and most versatile high-speed automation platform: surface

mount, odd-form, pin-in-paste, and semiconductor

• Commonality with existing Universal platforms

• Complementary through-hole and complex automation platforms enable

simplified single-vendor solutions

Minimize costs, maximize yield

• Minimize/stabilize labor costs and reduce floor space requirements

• Implement local “market-area” production versus low-cost labor regions

• Reduce WIP and improve inventory turns with consistent production rates

• Accelerate ROI with rapid payback

• Reduce defects, rework and waste (cost of non-quality) with precise,

repeatable, closed-loop processes

Increase overall productivity

• Improve utilization and efficiency to bring new products to market quicker

• Realize 24/7 sustained productivity

• Eliminate bottlenecks for continuous production flow

• Quickly adapt to changing requirements while managing ECRs and

smaller lot sizes

• Shorten cycle times and increase production volumes

• Maintain consistent and predictable throughput, regardless of complexity

• Minimize production downtime/disruptions

Complete automation solutions for any environment

FuzionOF can be integrated as a powerful pre- and post-reflow enabler to eliminate bottlenecks and boost

productivity with complementary capabilities for demanding production environments.

Process Versatility

Focused Solutions

Pre-reflow – Medium-mix agility and versatility

End-of-line SMT/odd-form intrusive (pin-in-paste) solder solutions with ultimate flexibility for

lean manufacturing in medium-mix environments – Industrial, Medical, Military, White Goods

Post-Reflow – Cost-effective productivity

Flexible pre-wave/selective solder assembly solutions to reduce assembly costs and improve

output and yields – Motherboard, Gaming, Power Supplies

Pre-reflow – High-volume performance and yield

End-of-line SMT/odd-form intrusive (pin-in-paste) solder solutions with essential capabilities

for today’s extreme requirements and beyond (finer density, full inspection, consistent force) –

Automotive, Handheld Mobile, Lighting

Connectors Sockets

Ethernet

Jacks E-Caps Shields

Solder

Pre-Forms D-Subs Transformers LEDs

Optimized for today’s growth markets

A fast-moving electronics landscape requires a solution that can easily transition from one product to the next.

FuzionOF solutions are ideally suited to help manufacturers excel across a diverse range of unique market challenges.

Place a full array of odd-form components

Take on any odd-form component with the same confidence as a standard surface mount component.

FuzionOF places these components quickly and accurately with a sustained production flow.

• RF utility meters

• Smoke detectors

• Architectural lighting

• Power supplies

• Instrumentation

• White goods

Pre-Reflow – Medium-Mix

• Set-top boxes

• Automotive ECUs/PCMs

• Automotive ADAS systems

• Smartphones, tablets

• LED bulbs and downlighting

• Telecom

Pre-Reflow – High-Volume

• Power supplies

• Power conversion

• Amplifiers

• Filters

• Motherboards

• Gaming

Post-Reflow

FuzionOF Specifications

16,500 (Max)

11,400 (1-Bd IPC Chips)

Throughput (cph) Accuracy (µm@>1.00 Cpk) Max Board Size Component Range (mm)Max Feeder Inputs (8mm)

±38 (Chips)

±27 (ICs)

508 x 813mm

20 x 32"

120 (2 ULC)

(

0201) .25 x .5 x .15 (Min)

150 square and up to 25 tall

Fuzion2-60

Fuzion2-37 FuzionOF

Fuzion4-120 Fuzion4-120 FuzionOF PTFFuzion4-120 Fuzion4-120

FuzionOF Polaris WorkstationRadial 88HT Polaris FuzionOF FuzionOFRadial 88HT